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name:-0.00032997131347656
name:-0.00054097175598145
OBA; Tomoyuki Patent Filings

OBA; Tomoyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for OBA; Tomoyuki.The latest application filed is for "epoxy resin composition and cured resin film with low curing shrinkage and excellent adhesion".

Company Profile
0.0.2
  • OBA; Tomoyuki - CHIBA JP
  • Oba; Tomoyuki - Minamata-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Epoxy Resin Composition And Cured Resin Film With Low Curing Shrinkage And Excellent Adhesion
App 20190185711 - SUWA; Kazuya ;   et al.
2019-06-20
Method of Producing Halosilane and Method of Purifying Solid Fraction
App 20070231236 - Kajimoto; Kimihiko ;   et al.
2007-10-04

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