Oba; Ryugo
Patent Applications and Registrations
Patent applications and USPTO patent grants for Oba; Ryugo.The latest application filed is for "method of processing wafer".
- Oba; Ryugo - Tokyo JP
- Oba; Ryugo - Ota-Ku JP
| Patent | Date |
|---|---|
| Method of processing wafer Grant 10,811,458 - Oba , et al. October 20, 2 | 2020-10-20 |
| Method Of Processing Wafer App 20190109173 - OBA; Ryugo ; et al. | 2019-04-11 |
| Optical device wafer processing method Grant 10,109,527 - Oba , et al. October 23, 2 | 2018-10-23 |
| Laser processing apparatus Grant 9,724,783 - Odagiri , et al. August 8, 2 | 2017-08-08 |
| Optical Device Wafer Processing Method App 20170098579 - Oba; Ryugo ; et al. | 2017-04-06 |
| Laser Processing Apparatus App 20160151857 - Odagiri; Wataru ; et al. | 2016-06-02 |
| Laser beam processing machine Grant 8,610,030 - Oba , et al. December 17, 2 | 2013-12-17 |
| Laser beam machining apparatus Grant 8,049,133 - Oba , et al. November 1, 2 | 2011-11-01 |
| Optical Device Configured By Bonding First And Second Transparent Members Having Birefringent Property App 20110261457 - Nomaru; Keiji ; et al. | 2011-10-27 |
| Laser processing beam machine Grant 7,968,821 - Oba June 28, 2 | 2011-06-28 |
| Dividing method for wafer having film on the front side thereof Grant 7,897,488 - Watanabe , et al. March 1, 2 | 2011-03-01 |
| Wafer processing method Grant 7,772,092 - Iizuka , et al. August 10, 2 | 2010-08-10 |
| Laser Processing Machine App 20100084386 - Masuda; Yukiyasu ; et al. | 2010-04-08 |
| Wafer processing method and laser processing apparatus Grant 7,655,541 - Oba February 2, 2 | 2010-02-02 |
| Dividing Method For Wafer Having Film On The Front Side Thereof App 20090298263 - Watanabe; Yosuke ; et al. | 2009-12-03 |
| Wafer laser processing method Grant 7,601,616 - Morikazu , et al. October 13, 2 | 2009-10-13 |
| Wafer processing method App 20090191692 - IIzuka; Kentaro ; et al. | 2009-07-30 |
| Laser beam processing machine Grant 7,482,554 - Furuta , et al. January 27, 2 | 2009-01-27 |
| Laser Beam Machining Apparatus App 20080296275 - Oba; Ryugo ; et al. | 2008-12-04 |
| Wafer processing method and laser processing apparatus App 20080200012 - Oba; Ryugo | 2008-08-21 |
| Method for laser processing of wafer Grant 7,396,780 - Hoshino , et al. July 8, 2 | 2008-07-08 |
| Wafer dividing method App 20080047408 - Oba; Ryugo ; et al. | 2008-02-28 |
| Wafer laser processing method App 20080020548 - Morikazu; Hiroshi ; et al. | 2008-01-24 |
| Method of processing sapphire substrate App 20080003708 - Hoshino; Hitoshi ; et al. | 2008-01-03 |
| Laser beam processing machine App 20070235430 - Oba; Ryugo ; et al. | 2007-10-11 |
| Laser processing beam machine App 20070228020 - Oba; Ryugo | 2007-10-04 |
| Wafer processing method Grant 7,179,723 - Genda , et al. February 20, 2 | 2007-02-20 |
| Wafer laser processing method and laser beam processing machine App 20060255022 - Hoshino; Hitoshi ; et al. | 2006-11-16 |
| Laser beam processing machine App 20060148210 - Furuta; Kenji ; et al. | 2006-07-06 |
| Method for laser processing of wafer App 20060094260 - Hoshino; Hitoshi ; et al. | 2006-05-04 |
| Laser processing method App 20060035411 - Oba; Ryugo ; et al. | 2006-02-16 |
| Method for the laser processing of a wafer App 20060009008 - Kaneuchi; Yasuomi ; et al. | 2006-01-12 |
| Semiconductor wafer processing method App 20050155954 - Oba, Ryugo ; et al. | 2005-07-21 |
| Wafer processing method App 20050106782 - Genda, Satoshi ; et al. | 2005-05-19 |
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