OAKLEY; Jennifer A.
Patent Applications and Registrations
Patent applications and USPTO patent grants for OAKLEY; Jennifer A..The latest application filed is for "moisture seal for photonic devices".
- OAKLEY; Jennifer A. - Cohoes NY
- Oakley; Jennifer A. - Poughkeepsie NY
- Oakley; Jennifer A. - Fishkill NY
| Patent | Date |
|---|---|
| Moisture Seal For Photonic Devices App 20210183791 - SAHIN; Asli ; et al. | 2021-06-17 |
| Insulating a via in a semiconductor substrate Grant 10,079,175 - Farooq , et al. September 18, 2 | 2018-09-18 |
| Insulating A Via In A Semiconductor Substrate App 20170256447 - FAROOQ; MUKTA G. ; et al. | 2017-09-07 |
| Strain engineering devices using partial depth films in through-substrate vias Grant 9,728,506 - Farooq , et al. August 8, 2 | 2017-08-08 |
| Insulating a via in a semiconductor substrate Grant 9,728,450 - Farooq , et al. August 8, 2 | 2017-08-08 |
| Strain Engineering Devices Using Partial Depth Films In Through-substrate Vias App 20170162508 - Farooq; Mukta G. ; et al. | 2017-06-08 |
| Protected through semiconductor via (TSV) Grant 9,673,095 - Farooq , et al. June 6, 2 | 2017-06-06 |
| Integrated circuit (IC) chips with through silicon vias (TSV) and method of forming the IC Grant 9,536,784 - Farooq , et al. January 3, 2 | 2017-01-03 |
| Insulating A Via In A Semiconductor Substrate App 20160379876 - FAROOQ; MUKTA G. ; et al. | 2016-12-29 |
| Insulating A Via In A Semiconductor Substrate App 20160379818 - COLLINS; CHRISTOPHER ; et al. | 2016-12-29 |
| Integrated Circuit (ic) Chips With Through Silicon Vias (tsv) And Method Of Forming The Ic App 20160379883 - Farooq; Mukta G. ; et al. | 2016-12-29 |
| Protected Through Semiconductor Via (tsv) App 20160293487 - Farooq; Mukta G. ; et al. | 2016-10-06 |
| Protected through semiconductor via (TSV) Grant 9,401,323 - Farooq , et al. July 26, 2 | 2016-07-26 |
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