O'Rourke; Glenn

Patent Applications and Registrations

Patent applications and USPTO patent grants for O'Rourke; Glenn.The latest application filed is for "interposer-less stack die interconnect".

Company Profile

0.10.2

O'Rourke; Glenn - Gilroy CA
O'Rourke; Glenn - San Juan Bautista CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
High yield package assembly technique Grant 10,707,138 - Xiong , et al.	2020-07-07
Multi-die wafer-level test and assembly without comprehensive individual die singulation Grant 10,032,682 - Klein , et al. July 24, 2	2018-07-24
Heterogeneous integration of integrated circuit device and companion device Grant 9,865,567 - Chaware , et al. January 9, 2	2018-01-09
Interposer-less stack die interconnect Grant 9,761,533 - Chaware , et al. September 12, 2	2017-09-12
Interposer-less Stack Die Interconnect App 20170110407 - Chaware; Raghunandan ; et al.	2017-04-20
Method for providing charge protection to one or more dies during formation of a stacked silicon device Grant 9,385,106 - Chaware , et al. July 5, 2	2016-07-05
Increased usable programmable device dice Grant 9,372,956 - Fan , et al. June 21, 2	2016-06-21
Integrated circuit package testing Grant 9,341,668 - Hariharan , et al. May 17, 2	2016-05-17
Charge damage protection on an interposer for a stacked die assembly Grant 9,214,433 - Xiang , et al. December 15, 2	2015-12-15
Method for removing bumps from incomplete and defective interposer dies for stacked silicon interconnect technology (SSIT) devices Grant 8,900,987 - Singh , et al. December 2, 2	2014-12-02
Charge Damage Protection On An Interposer For A Stacked Die Assembly App 20140346651 - Xiang; Qi ; et al.	2014-11-27
Method and apparatus for self-regulated burn-in of an integrated circuit Grant 8,212,576 - Cho , et al. July 3, 2	2012-07-03

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