O'Riain; Lincoln

Patent Applications and Registrations

Patent applications and USPTO patent grants for O'Riain; Lincoln.The latest application filed is for "integrated semiconductor device having an insulating structure and a manufacturing method".

Company Profile

0.9.8

O'Riain; Lincoln - Dresden DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated semiconductor device having an insulating structure and a manufacturing method Grant 9,257,448 - Stecher , et al. February 9, 2	2016-02-09
Semiconductor device with an insulating structure for insulating an electrode from a semiconductor body Grant 9,000,520 - Strasser , et al. April 7, 2	2015-04-07
Integrated Semiconductor Device Having An Insulating Structure And A Manufacturing Method App 20140287560 - Stecher; Matthias ; et al.	2014-09-25
Semiconductor Device with an Insulating Structure for Insulating an Electrode from a Semiconductor Body App 20140159154 - Strasser; Marc ; et al.	2014-06-12
Integrated semiconductor device having an insulating structure and a manufacturing method Grant 8,749,018 - Stecher , et al. June 10, 2	2014-06-10
Lateral semiconductor device and manufacturing method therefor Grant 8,686,505 - Strasser , et al. April 1, 2	2014-04-01
Lateral Semiconductor Device and Manufacturing Method Therefor App 20140027848 - Strasser; Marc ; et al.	2014-01-30
Semiconductor devices and methods of manufacture thereof Grant 8,115,279 - Tilke , et al. February 14, 2	2012-02-14
Integrated Semiconductor Device Having An Insulating Structure And A Manufacturing Method App 20110309441 - Stecher; Matthias ; et al.	2011-12-22
Semiconductor Devices and Methods of Manufacture Thereof App 20100207238 - Tilke; Armin ; et al.	2010-08-19
Semiconductor devices and methods of manufacture thereof Grant 7,749,859 - Tilke , et al. July 6, 2	2010-07-06
Semiconductor Devices and Methods of Manufacture Thereof App 20090001502 - Tilke; Armin ; et al.	2009-01-01
Method for fabricating a semiconductor structure with an encapsulation of a filling which is used for filling trenches Grant 6,908,831 - O'Riain , et al. June 21, 2	2005-06-21
Method For Fabricating A Semiconductor Structure With An Encapsulation Of A Filling Which Is Used For Filling Trenches App 20050095788 - O'Riain, Lincoln ; et al.	2005-05-05

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