O.; Min Ho

Patent Applications and Registrations

Patent applications and USPTO patent grants for O.; Min Ho.The latest application filed is for "composition, anti-oxide film including the same, electronic component including the anti-oxide film, and methods for forming the anti-oxide film and electronic component".

Company Profile

0.2.8

O.; Min Ho - Daegu KR
O; Min-Ho - Taegu-Si KR
O; Min Ho - Suseong-gu KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Composition, Anti-oxide Film Including The Same, Electronic Component Including The Anti-oxide Film, And Methods For Forming The Anti-oxide Film And Electronic Component App 20140048318 - HAHN; Jung Seok ; et al.	2014-02-20
Semiconductor package embedded in substrate, system including the same and associated methods Grant 7,888,785 - Ahn , et al. February 15, 2	2011-02-15
Semiconductor package using chip-embedded interposer substrate Grant 7,626,254 - O , et al. December 1, 2	2009-12-01
Composition, anti-oxide film including the same, electronic component including the anti-oxide film, and methods for forming the anti-oxide film and electronic component App 20090197090 - Hahn; Jung Seok ; et al.	2009-08-06
Semiconductor Chip Package And Method Of Manufacturing The Same App 20090115069 - KIM; Young-Lyong ; et al.	2009-05-07
Semiconductor package embedded in substrate, system including the same and associated methods App 20090065920 - Ahn; Eun-Chul ; et al.	2009-03-12
Semiconductor Chip Package, Semiconductor Package Including Semiconductor Chip Package, And Method Of Fabricating Semiconductor Package App 20080308935 - KIM; Young-Lyong ; et al.	2008-12-18
Semiconductor Package Using Chip-embedded Interposer Substrate App 20080283996 - O; Min-Ho ; et al.	2008-11-20
Multi-chip Package And Method Of Manufacturing The Multi-chip Package App 20080265432 - O; Min-Ho ; et al.	2008-10-30
Partially Insulation Coated Metal Wire For Wire Bonding And Wire Bonding Method For Semiconductor Package Using The Same App 20080124547 - O; Min-Ho ; et al.	2008-05-29

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