O; In Won

Patent Applications and Registrations

Patent applications and USPTO patent grants for O; In Won.The latest application filed is for "printed circuit board and semiconductor package including the same".

Company Profile

1.8.7

O; In Won - Jeonju-si KR
O; In-won - Jeonbuk N/A KR
O; IN WON - Hwasung-City KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Printed circuit board and semiconductor package including the same Grant 11,166,368 - Park , et al. November 2, 2	2021-11-02
Printed Circuit Board And Semiconductor Package Including The Same App 20200260577 - A1	2020-08-13
Semiconductor package with terminals adjacent sides and corners Grant 9,542,978 - Lee , et al. January 10, 2	2017-01-10
Semiconductor Package App 20160049176 - LEE; Jong-won ; et al.	2016-02-18
Semiconductor device with interposer and method manufacturing same Grant 9,059,067 - Choi , et al. June 16, 2	2015-06-16
Semiconductor package having a blocking pattern between a light transmissive cover and a substrate, and method for fabricating the same Grant 8,981,514 - Ryu , et al. March 17, 2	2015-03-17
Semiconductor packages Grant 8,823,185 - O , et al. September 2, 2	2014-09-02
Semiconductor Packages And Methods For Manufacturing The Same App 20130264703 - TAE; Yujung ; et al.	2013-10-10
Semiconductor Package And Method For Fabricating The Same App 20130181314 - RYU; Han-Sung ; et al.	2013-07-18
Semiconductor Packages App 20120168918 - O; In Won ; et al.	2012-07-05
Semiconductor Device With Interposer And Method Manufacturing Same App 20120091468 - Choi; Yun-seok ; et al.	2012-04-19

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