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Patent applications and USPTO patent grants for O'Connor; Daniel P..The latest application filed is for "electrical and physical design integration method and apparatus for providing interconnections on first level ceramic chip carrier packages".
Patent | Date |
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Automated audit process Grant 8,326,709 - Spreng , et al. December 4, 2 | 2012-12-04 |
Automated audit process Grant 7,478,061 - Spreng , et al. January 13, 2 | 2009-01-13 |
In-module current source Grant 7,085,143 - Dyckman , et al. August 1, 2 | 2006-08-01 |
Electrical and physical design integration method and apparatus for providing interconnections on first level ceramic chip carrier packages Grant 6,657,130 - Van Dyke , et al. December 2, 2 | 2003-12-02 |
Electrical and physical design integration method and apparatus for providing interconnections on first level ceramic chip carrier packages App 20030051910 - Dyke, Peter D. Van ;   et al. | 2003-03-20 |
Direct deposit thin film single/multi chip module Grant 6,261,467 - Giri , et al. July 17, 2 | 2001-07-17 |
Ceramic substrate having a sealed layer Grant 6,136,419 - Fasano , et al. October 24, 2 | 2000-10-24 |
Direct deposit thin film single/multi chip module Grant 6,037,044 - Giri , et al. March 14, 2 | 2000-03-14 |
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