loadpatents
Patent applications and USPTO patent grants for O'Brien; James N..The latest application filed is for "method and apparatus for reducing taper of laser scribes".
Patent | Date |
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Laser machining of fired ceramic and other hard and/or thick materials Grant 8,723,075 - O'Brien , et al. May 13, 2 | 2014-05-13 |
Laser segmented cutting, multi-step cutting, or both Grant RE43,605 - O'Brien , et al. August 28, 2 | 2012-08-28 |
Laser segmented cutting Grant RE43,487 - O'Brien , et al. June 26, 2 | 2012-06-26 |
Method And Apparatus For Reducing Taper Of Laser Scribes App 20120132629 - O'Brien; James N. ;   et al. | 2012-05-31 |
Laser segmented cutting, multi-step cutting, or both Grant RE43,400 - O'Brien , et al. May 22, 2 | 2012-05-22 |
Laser Machining Of Fired Ceramic And Other Hard And/or Thick Materials App 20120103953 - O'Brien; James N. ;   et al. | 2012-05-03 |
Laser machining of fired ceramic and other hard and/or thick materials Grant 8,093,532 - O'Brien , et al. January 10, 2 | 2012-01-10 |
Use of laser energy transparent stop layer to achieve minimal debris generation in laser scribing a multilayer patterned workpiece Grant 7,977,213 - Hooper , et al. July 12, 2 | 2011-07-12 |
Laser Machining Of Fired Ceramic And Other Hard And/or Thick Materials App 20090242525 - O'Brien; James N. ;   et al. | 2009-10-01 |
Infrared laser wafer scribing using short pulses App 20070272666 - O'Brien; James N. ;   et al. | 2007-11-29 |
Laser segmented cutting Grant 6,676,878 - O'Brien , et al. January 13, 2 | 2004-01-13 |
Laser segmented cutting App 20020190435 - O'Brien, James N. ;   et al. | 2002-12-19 |
Ultraviolet laser system and method for forming vias in multi-layered targets Grant 5,593,606 - Owen , et al. January 14, 1 | 1997-01-14 |
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