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Patent applications and USPTO patent grants for Nulman; Kenji.The latest application filed is for "apparatus and method for die stack flux removal".
Patent | Date |
---|---|
High pressure spray head Grant 11,420,223 - Honigman , et al. August 23, 2 | 2022-08-23 |
Apparatus And Method For Die Stack Flux Removal App 20210202272 - Taddei; John ;   et al. | 2021-07-01 |
Apparatus and method for wafer thinning in advanced packaging applications Grant 10,541,180 - Mauer , et al. Ja | 2020-01-21 |
High Pressure Spray Head App 20190381533 - Honigman; Steven ;   et al. | 2019-12-19 |
Apparatus and method to remove solids from material lift off post process solvents Grant 10,413,850 - Taddei , et al. Sept | 2019-09-17 |
Apparatus And Method For Wafer Thinning In Advanced Packaging Applications App 20180254221 - Mauer; Laura ;   et al. | 2018-09-06 |
Apparatus And Method To Remove Solids From Material Lift Off Post Process Solvents App 20180207562 - Taddei; John ;   et al. | 2018-07-26 |
Apparatus and Method to Improve Plasma Dicing and Backmetal Cleaving Process App 20170287768 - Mauer; Laura ;   et al. | 2017-10-05 |
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