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name:-0.0051438808441162
name:-0.0053379535675049
name:-0.0026130676269531
Nulman; Kenji Patent Filings

Nulman; Kenji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nulman; Kenji.The latest application filed is for "apparatus and method for die stack flux removal".

Company Profile
2.3.5
  • Nulman; Kenji - Plainview NY
  • Nulman; Kenji - Horsham PA
  • Nulman; Kenji - Warminster PA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
High pressure spray head
Grant 11,420,223 - Honigman , et al. August 23, 2
2022-08-23
Apparatus And Method For Die Stack Flux Removal
App 20210202272 - Taddei; John ;   et al.
2021-07-01
Apparatus and method for wafer thinning in advanced packaging applications
Grant 10,541,180 - Mauer , et al. Ja
2020-01-21
High Pressure Spray Head
App 20190381533 - Honigman; Steven ;   et al.
2019-12-19
Apparatus and method to remove solids from material lift off post process solvents
Grant 10,413,850 - Taddei , et al. Sept
2019-09-17
Apparatus And Method For Wafer Thinning In Advanced Packaging Applications
App 20180254221 - Mauer; Laura ;   et al.
2018-09-06
Apparatus And Method To Remove Solids From Material Lift Off Post Process Solvents
App 20180207562 - Taddei; John ;   et al.
2018-07-26
Apparatus and Method to Improve Plasma Dicing and Backmetal Cleaving Process
App 20170287768 - Mauer; Laura ;   et al.
2017-10-05

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