Patent | Date |
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Integrated circuits (ICs) on a glass substrate Grant 10,903,240 - Gu , et al. January 26, 2 | 2021-01-26 |
Integration of through glass via (TGV) filter and acoustic filter Grant 10,582,609 - Yun , et al. | 2020-03-03 |
Integrated semiconductor devices and method of fabricating the same Grant 10,546,852 - Dutta , et al. Ja | 2020-01-28 |
Integrated Semiconductor Devices And Method Of Fabricating The Same App 20190341381 - DUTTA; Ranadeep ;   et al. | 2019-11-07 |
Integrated Circuits (ics) On A Glass Substrate App 20190259780 - GU; Shiqun ;   et al. | 2019-08-22 |
Integrated circuits (ICs) on a glass substrate Grant 10,332,911 - Gu , et al. | 2019-06-25 |
Integration Of Through Glass Via (tgv) Filter And Acoustic Filter App 20190132942 - YUN; Changhan Hobie ;   et al. | 2019-05-02 |
Monolithic integrated emitter-detector array in a flexible substrate for biometric sensing Grant 10,271,745 - Gu , et al. | 2019-04-30 |
Compartment shielding in flip-chip (FC) module Grant 10,242,957 - Kim , et al. | 2019-03-26 |
Nanowire Device With Reduced Parasitics App 20190067435 - Badaroglu; Mustafa ;   et al. | 2019-02-28 |
CMOS and bipolar device integration including a tunable capacitor Grant 10,158,030 - Gu , et al. Dec | 2018-12-18 |
Nanowire device with reduced parasitics Grant 10,157,992 - Badaroglu , et al. Dec | 2018-12-18 |
Cmos And Bipolar Device Integration Including A Tunable Capacitor App 20180233604 - GU; Shiqun ;   et al. | 2018-08-16 |
Vertically stacked nanowire field effect transistors Grant 10,043,796 - Machkaoutsan , et al. August 7, 2 | 2018-08-07 |
Frequency multiplexer Grant 9,906,318 - Zuo , et al. February 27, 2 | 2018-02-27 |
Systems And Methods For Providing Vertical Access To The Collector Of A Heterojunction Bipolar Transistor App 20170373175 - GU; Shiqun ;   et al. | 2017-12-28 |
Monolithic Integrated Emitter-detector Array In A Flexible Substrate For Biometric Sensing App 20170360316 - GU; Shiqun ;   et al. | 2017-12-21 |
Self-aligned metal cut and via for back-end-of-line (BEOL) processes for semiconductor integrated circuit (IC) fabrication, and related processes and devices Grant 9,793,164 - Machkaoutsan , et al. October 17, 2 | 2017-10-17 |
Integrated circuits (ICS) on a glass substrate Grant 9,768,109 - Gu , et al. September 19, 2 | 2017-09-19 |
Vertically Stacked Nanowire Field Effect Transistors App 20170221884 - Machkaoutsan; Vladimir ;   et al. | 2017-08-03 |
Nanowire Device With Reduced Parasitics App 20170186846 - Badaroglu; Mustafa ;   et al. | 2017-06-29 |
Isolated complementary metal-oxide semiconductor (CMOS) devices for radio-frequency (RF) circuits Grant 9,673,275 - Kim , et al. June 6, 2 | 2017-06-06 |
Self-aligned Metal Cut And Via For Back-end-of-line (beol) Processes For Semiconductor Integrated Circuit (ic) Fabrication, And Related Processes And Devices App 20170140986 - Machkaoutsan; Vladimir ;   et al. | 2017-05-18 |
Isolated Complementary Metal-oxide Semiconductor (cmos) Devices For Radio-frequency (rf) Circuits App 20170117358 - Kim; Daeik Daniel ;   et al. | 2017-04-27 |
Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP) Grant 9,620,463 - Kim , et al. April 11, 2 | 2017-04-11 |
Integrated Circuits (ics) On A Glass Substrate App 20170098663 - Gu; Shiqun ;   et al. | 2017-04-06 |
Substrate-transferred, Deep Trench Isolation Silicon-on-insulator (soi) Semiconductor Devices Formed From Bulk Semiconductor Wafers App 20170084628 - Kim; Daeik Daniel ;   et al. | 2017-03-23 |
Integrated Circuits (ics) On A Glass Substrate App 20170084531 - Gu; Shiqun ;   et al. | 2017-03-23 |
Non-volatile multiple time programmable memory device Grant 9,508,439 - Li , et al. November 29, 2 | 2016-11-29 |
Half node scaling for vertical structures Grant 9,478,541 - Song , et al. October 25, 2 | 2016-10-25 |
Silicon-on-insulator (soi) Wafers Employing Molded Substrates To Improve Insulation And Reduce Current Leakage App 20160293477 - Kim; Daeik Daniel ;   et al. | 2016-10-06 |
Radio-frequency (rf) Shielding In Fan-out Wafer Level Package (fowlp) App 20160254237 - KIM; Daeik Daniel ;   et al. | 2016-09-01 |
Compartment Shielding In Flip-chip (fc) Module App 20160254236 - KIM; Daeik Daniel ;   et al. | 2016-09-01 |
Air gap between tungsten metal lines for interconnects with reduced RC delay Grant 9,425,096 - Gu , et al. August 23, 2 | 2016-08-23 |
High pass filters and low pass filters using through glass via technology Grant 9,425,761 - Zuo , et al. August 23, 2 | 2016-08-23 |
MTJ structure and integration scheme Grant 9,373,782 - Li , et al. June 21, 2 | 2016-06-21 |
Physically unclonable function based on programming voltage of magnetoresistive random-access memory Grant 9,343,135 - Zhu , et al. May 17, 2 | 2016-05-17 |
Composite dilation mode resonators Grant 9,331,666 - Zuo , et al. May 3, 2 | 2016-05-03 |
Varactor Device With Backside Contact App 20160093750 - Kim; Daeik Daniel ;   et al. | 2016-03-31 |
Physically unclonable function based on breakdown voltage of metal-insulator-metal device Grant 9,298,946 - Zhu , et al. March 29, 2 | 2016-03-29 |
Half Node Scaling For Vertical Structures App 20160071847 - SONG; Stanley Seungchul ;   et al. | 2016-03-10 |
Load balancing scheme in multiple channel DRAM systems Grant 9,268,720 - Wang , et al. February 23, 2 | 2016-02-23 |
Systems for reducing magnetic coupling in integrated circuits (ICS), and related components and methods Grant 9,264,013 - Zuo , et al. February 16, 2 | 2016-02-16 |
Air Gap Between Tungsten Metal Lines For Interconnects With Reduced Rc Delay App 20160013133 - GU; Shiqun ;   et al. | 2016-01-14 |
Non-volatile Multiple Time Programmable Memory Device App 20160012896 - Li; Xia ;   et al. | 2016-01-14 |
Physically unclonable function based on the initial logical state of magnetoresistive random-access memory Grant 9,230,630 - Zhu , et al. January 5, 2 | 2016-01-05 |
Physically unclonable function based on the random logical state of magnetoresistive random-access memory Grant 9,214,214 - Zhu , et al. December 15, 2 | 2015-12-15 |
Die package comprising die-to-wire connector and a wire-to-die connector configured to couple to a die package Grant 9,202,789 - Kim , et al. December 1, 2 | 2015-12-01 |
Integrated circuit module with lead frame micro-needles Grant 9,202,705 - Kaskoun , et al. December 1, 2 | 2015-12-01 |
Frequency Multiplexer App 20150304059 - Zuo; Chengjie ;   et al. | 2015-10-22 |
Die Package Comprising Die-to-wire Connector And A Wire-to-die Connector Configured To Couple To A Die Package App 20150303148 - Kim; Daeik Daniel ;   et al. | 2015-10-22 |
Integrated circuit module with lead frame micro-needles Grant 9,138,191 - Kaskoun , et al. September 22, 2 | 2015-09-22 |
Method and apparatus of probabilistic programming multi-level memory in cluster states of bi-stable elements Grant 9,135,976 - Wu , et al. September 15, 2 | 2015-09-15 |
Stacked Conductive Interconnect Inductor App 20150201495 - KIM; Daeik Daniel ;   et al. | 2015-07-16 |
Connector Placement For A Substrate Integrated With A Toroidal Inductor App 20150092314 - Kim; Daeik Daniel ;   et al. | 2015-04-02 |
Active thermal control for stacked IC devices Grant 8,987,062 - Gu , et al. March 24, 2 | 2015-03-24 |
Physically Unclonable Function Based On Programming Voltage Of Magnetoresistive Random-access Memory App 20150070979 - Zhu; Xiaochun ;   et al. | 2015-03-12 |
Physically Unclonable Function Based On The Initial Logical State Of Magnetoresistive Random-access Memory App 20150071430 - Zhu; Xiaochun ;   et al. | 2015-03-12 |
Physically Unclonable Function Based On Resistivity Of Magnetoresistive Random-access Memory Magnetic Tunnel Junctions App 20150071432 - Zhu; Xiaochun ;   et al. | 2015-03-12 |
Physically Unclonable Function Based On The Random Logical State Of Magnetoresistive Random-access Memory App 20150071431 - Zhu; Xiaochun ;   et al. | 2015-03-12 |
Physically Unclonable Function Based On Breakdown Voltage Of Metal- Insulator-metal Device App 20150074433 - Zhu; Xiaochun ;   et al. | 2015-03-12 |
Mtj Structure And Integration Scheme App 20150056722 - Li; Xia ;   et al. | 2015-02-26 |
Design For High Pass Filters And Low Pass Filters Using Through Glass Via Technology App 20140354378 - ZUO; Chengjie ;   et al. | 2014-12-04 |
Dual Substrate, Power Distribution And Thermal Solution For Direct Stacked Integrated Devices App 20140225246 - Henderson; Brian Matthew ;   et al. | 2014-08-14 |
Non-reversible state at a bitcell having a first magnetic tunnel junction and a second magnetic tunnel junction Grant 8,797,792 - Rao , et al. August 5, 2 | 2014-08-05 |
Transformer Signal Coupling For Flip-chip Integration App 20140206105 - Kim; Jonghae ;   et al. | 2014-07-24 |
Low power electronic system architecture using non-volatile magnetic memory Grant 8,719,610 - Nowak , et al. May 6, 2 | 2014-05-06 |
Composite Dilation Mode Resonators App 20140111064 - Zuo; Chengjie ;   et al. | 2014-04-24 |
Method And Apparatus Of Probabilistic Programming Multi-level Memory In Cluster States Of Bi-stable Elements App 20140098602 - Wu; Wenqing ;   et al. | 2014-04-10 |
Active Thermal Control For Stacked Ic Devices App 20140043756 - Gu; Shiqun ;   et al. | 2014-02-13 |
Method and apparatus of probabilistic programming multi-level memory in cluster states of bi-stable elements Grant 8,625,337 - Wu , et al. January 7, 2 | 2014-01-07 |
Generating a non-reversible state at a bitcell having a first magnetic tunnel junction and a second magnetic tunnel junction Grant 8,547,736 - Rao , et al. October 1, 2 | 2013-10-01 |
Through substrate via with embedded decoupling capacitor Grant 8,536,678 - Nowak , et al. September 17, 2 | 2013-09-17 |
Mutually Coupled Matching Network App 20130222060 - Lo; Chi Shun ;   et al. | 2013-08-29 |
High density metal-insulator-metal trench capacitor Grant 8,492,874 - Lan , et al. July 23, 2 | 2013-07-23 |
Multi-channel multi-port memory Grant 8,380,940 - Wang , et al. February 19, 2 | 2013-02-19 |
Through Substrate Via With Embedded Decoupling Capacitor App 20130040436 - Nowak; Matthew Michael ;   et al. | 2013-02-14 |
Accessing a multi-channel memory system having non-uniform page sizes Grant 8,375,173 - Wang , et al. February 12, 2 | 2013-02-12 |
Partitioning a crossbar interconnect in a multi-channel memory system Grant 8,359,421 - Wang , et al. January 22, 2 | 2013-01-22 |
Through silicon via with embedded decoupling capacitor Grant 8,294,240 - Nowak , et al. October 23, 2 | 2012-10-23 |
High Density Metal-Insulator-Metal Trench Capacitor App 20120199949 - Lan; Je-Hsiung ;   et al. | 2012-08-09 |
Non-Uniform Interleaving Scheme In Multiple Channel DRAM System App 20120054455 - Wang; Feng ;   et al. | 2012-03-01 |
Load Balancing Scheme In Multiple Channel DRAM Systems App 20120054423 - Wang; Feng ;   et al. | 2012-03-01 |
Generating a Non-Reversible State at a Bitcell Having a First Magnetic Tunnel Junction and a Second Magnetic Tunnel Junction App 20120033490 - Rao; Hari M. ;   et al. | 2012-02-09 |
Three dimensional inductor and transformer design methodology of glass technology Grant 8,093,982 - Kim , et al. January 10, 2 | 2012-01-10 |
Multi-Channel Multi-Port Memory App 20110320698 - Wang; Feng ;   et al. | 2011-12-29 |
Dynamic Interleaving Of Multi-Channel Memory App 20110320751 - Wang; Feng ;   et al. | 2011-12-29 |
Method and Apparatus of Probabilistic Programming Multi-Level Memory in Cluster States Of Bi-Stable Elements App 20110273926 - Wu; Wenqing ;   et al. | 2011-11-10 |
Three Dimensional Inductor and Transformer Design Methodology of Glass Technology App 20110234357 - Kim; Jonghae ;   et al. | 2011-09-29 |
Heterogeneous Technology Integration App 20110233718 - Kim; Jonghae ;   et al. | 2011-09-29 |
Systems and Methods Providing Arrangements of Vias App 20110193212 - Gu; Shiqun ;   et al. | 2011-08-11 |
Accessing a Multi-Channel Memory System Having Non-Uniform Page Sizes App 20110087846 - Wang; Feng ;   et al. | 2011-04-14 |
Partitioning a Crossbar Interconnect in a Multi-Channel Memory System App 20110035529 - Wang; Feng ;   et al. | 2011-02-10 |
Through Silicon Via With Embedded Decoupling Capacitor App 20100308435 - Nowak; Matthew Michael ;   et al. | 2010-12-09 |
Low Power Electronic System Architecture Using Non-volatile Magnetic Memory App 20100077244 - Nowak; Matthew Michael ;   et al. | 2010-03-25 |