loadpatents
name:-0.025987863540649
name:-0.021021127700806
name:-0.00057697296142578
Nowak; Matthew M. Patent Filings

Nowak; Matthew M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nowak; Matthew M..The latest application filed is for "tunable diplexers in three-dimensional (3d) integrated circuits (ic) (3dic) and related components and methods".

Company Profile
0.22.24
  • Nowak; Matthew M. - San Diego CA
  • Nowak; Matthew M - San Diego CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Two-stage power delivery architecture
Grant 10,039,188 - Yun , et al. July 31, 2
2018-07-31
Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods
Grant 9,813,043 - Zuo , et al. November 7, 2
2017-11-07
MRAM word line power control scheme
Grant 9,672,885 - Kim , et al. June 6, 2
2017-06-06
Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods
Grant 9,634,640 - Zuo , et al. April 25, 2
2017-04-25
Devices, systems and methods using through silicon optical interconnects
Grant 9,478,528 - Kaskoun , et al. October 25, 2
2016-10-25
Tunable Diplexers In Three-dimensional (3d) Integrated Circuits (ic) (3dic) And Related Components And Methods
App 20160204758 - Zuo; Chengjie ;   et al.
2016-07-14
Diplexer design using through glass via technology
Grant 9,203,373 - Zuo , et al. December 1, 2
2015-12-01
Two-stage Power Delivery Architecture
App 20150334847 - Yun; Changhan ;   et al.
2015-11-19
Two-stage power delivery architecture
Grant 9,101,068 - Yun , et al. August 4, 2
2015-08-04
Daisy chain connection for testing continuity in a semiconductor die
Grant 9,024,315 - Yao , et al. May 5, 2
2015-05-05
Inductive Device That Includes Conductive Via And Metal Layer
App 20150035162 - Lan; Je-Hsiung ;   et al.
2015-02-05
Systems For Reducing Magnetic Coupling In Integrated Circuits (ics), And Related Components And Methods
App 20140354372 - Zuo; Chengjie ;   et al.
2014-12-04
Tunable Diplexers In Three-dimensional (3d) Integrated Circuits (ic) (3dic) And Related Components And Methods
App 20140327496 - Zuo; Chengjie ;   et al.
2014-11-06
MTJ structure and integration scheme
Grant 8,866,242 - Li , et al. October 21, 2
2014-10-21
Two-stage Power Delivery Architecture
App 20140268615 - Yun; Changhan ;   et al.
2014-09-18
Daisy Chain Connection For Testing Continuity In A Semiconductor Die
App 20140264331 - Yao; Hongjun ;   et al.
2014-09-18
Diplexer Design Using Through Glass Via Technology
App 20140197902 - Zuo; Chengjie ;   et al.
2014-07-17
Low Parasitic Package Substrate Having Embedded Passive Substrate Discrete Components And Method For Making Same
App 20140167273 - Kim; Jonghae ;   et al.
2014-06-19
Through Silicon Optical Interconnects
App 20140131549 - Kaskoun; Kenneth ;   et al.
2014-05-15
Transformer signal coupling for flip-chip integration
Grant 8,717,118 - Kim , et al. May 6, 2
2014-05-06
Mram Word Line Power Control Scheme
App 20140063922 - Kim; Sungryul ;   et al.
2014-03-06
Non-reversible State At A Bitcell Having A First Magnetic Tunnel Junction And A Second Magnetic Tunnel Junction
App 20140010006 - Rao; Hari M. ;   et al.
2014-01-09
Apparatus and method for through silicon via impedance matching
Grant 8,618,629 - Kim , et al. December 31, 2
2013-12-31
Reduced susceptibility to electrostatic discharge during 3D semiconductor device bonding and assembly
Grant 8,604,626 - Henderson , et al. December 10, 2
2013-12-10
Wide input/output memory with low density, low latency and high density, high latency blocks
Grant 8,595,429 - Gu , et al. November 26, 2
2013-11-26
Low Cost High Throughput Tsv/microbump Probe
App 20130297981 - Gu; Shiqun ;   et al.
2013-11-07
Mtj Structure And Integration Scheme
App 20130119494 - Li; Xia ;   et al.
2013-05-16
Transformer Signal Coupling For Flip-chip Integration
App 20130095576 - Kim; Jonghae ;   et al.
2013-04-18
Forming radio frequency integrated circuits
Grant 8,362,599 - Kim , et al. January 29, 2
2013-01-29
System and method to manufacture magnetic random access memory
Grant 8,208,290 - Rao , et al. June 26, 2
2012-06-26
Wide Input/Output Memory with Low Density, Low Latency and High Density, High Latency Blocks
App 20120054422 - Gu; Shiqun ;   et al.
2012-03-01
Three Dimensional Wire Bond Inductor and Transformer
App 20110316657 - Park; Sang-June ;   et al.
2011-12-29
Apparatus and Method for Through Silicon via Impedance Matching
App 20110084358 - Kim; Jonghae ;   et al.
2011-04-14
Forming Radio Frequency Integrated Circuits
App 20110068433 - Kim; Jonghae ;   et al.
2011-03-24
System and Method to Manufacture Magnetic Random Access Memory
App 20110051509 - Rao; Hari M. ;   et al.
2011-03-03
Memory Cell and Method of Forming a Magnetic Tunnel Junction (MTJ) of a Memory Cell
App 20090174015 - Gu; Shiqun ;   et al.
2009-07-09
Integrated circuit employing dummy conductors for planarity
Grant 4,916,514 - Nowak April 10, 1
1990-04-10

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