| Patent | Date |
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Tungsten feature fill with nucleation inhibition
Grant 11,437,269 - Yang , et al. September 6, 2 | 2022-09-06 |
Tungsten feature fill with nucleation inhibition
Grant 11,410,883 - Chandrashekar , et al. August 9, 2 | 2022-08-09 |
Films Of Desired Composition And Film Properties
App 20220220609 - VARADARAJAN; Bhadri N. | 2022-07-14 |
Films Of Desired Composition And Film Properties
App 20220220610 - VARADARAJAN; Bhadri N. | 2022-07-14 |
Films Of Desired Composition And Film Properties
App 20220220608 - VARADARAJAN; Bhadri N. | 2022-07-14 |
Films Of Desired Composition And Film Properties
App 20220220611 - VARADARAJAN; Bhadri N. | 2022-07-14 |
Conformal Deposition Of Silicon Carbide Films
App 20220148875 - VARADARAJAN; Bhadri N. ; et al. | 2022-05-12 |
Films Of Desired Composition And Film Properties
App 20220098727 - Varadarajan; Bhadri N. | 2022-03-31 |
Conformal deposition of silicon carbide films
Grant 11,264,234 - Varadarajan , et al. March 1, 2 | 2022-03-01 |
Suppression Of Parasitic Deposition In A Substrate Processing System By Suppressing Precursor Flow And Plasma Outside Of Substrate Region
App 20210381106 - Xia; Chunguang ; et al. | 2021-12-09 |
Method and apparatuses for reducing porogen accumulation from a UV-cure chamber
Grant 11,177,131 - Gytri , et al. November 16, 2 | 2021-11-16 |
Tungsten Feature Fill
App 20210327754 - Chandrashekar; Anand ; et al. | 2021-10-21 |
Tungsten feature fill
Grant 11,075,115 - Chandrashekar , et al. July 27, 2 | 2021-07-27 |
Radical source design for remote plasma atomic layer deposition
Grant 11,053,587 - van Schravendijk July 6, 2 | 2021-07-06 |
Electroplating Apparatus For Tailored Uniformity Profile
App 20210148001 - Mayer; Steven T. ; et al. | 2021-05-20 |
Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath
Grant 10,968,531 - Ranjan , et al. April 6, 2 | 2021-04-06 |
Protecting anodes from passivation in alloy plating systems
Grant 10,954,605 - Chua , et al. March 23, 2 | 2021-03-23 |
Electroplating apparatus for tailored uniformity profile
Grant 10,920,335 - Mayer , et al. February 16, 2 | 2021-02-16 |
Systems and methods for determining film thickness using DC self-bias voltage
Grant 10,876,209 - Augustyniak , et al. December 29, 2 | 2020-12-29 |
Wetting pretreatment for enhanced damascene metal filling
Grant 10,840,101 - Mayer , et al. November 17, 2 | 2020-11-17 |
Remote plasma based deposition of oxygen doped silicon carbide films
Grant 10,832,904 - Varadarajan November 10, 2 | 2020-11-10 |
Configuration and method of operation of an electrodeposition system for improved process stability and performance
Grant 10,745,817 - Ganesan , et al. A | 2020-08-18 |
Methods for depositing films on sensitive substrates
Grant 10,741,458 - Kang , et al. A | 2020-08-11 |
Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
Grant 10,662,545 - Mayer , et al. | 2020-05-26 |
Cleaning Electroplating Substrate Holders Using Reverse Current Deplating
App 20200115816 - Chua; Lee Peng ; et al. | 2020-04-16 |
Temperature controlled showerhead
Grant 10,584,415 - Meinhold , et al. | 2020-03-10 |
Wafer chuck with aerodynamic design for turbulence reduction
Grant 10,563,298 - Stephens , et al. Feb | 2020-02-18 |
Cleaning electroplating substrate holders using reverse current deplating
Grant 10,538,855 - Chua , et al. Ja | 2020-01-21 |
METHOD TO OBTAIN SiC CLASS OF FILMS OF DESIRED COMPOSITION AND FILM PROPERTIES
App 20190382885 - Varadarajan; Bhadri N. | 2019-12-19 |
Pecvd Apparatus For In-situ Deposition Of Film Stacks
App 20190376186 - Haverkamp; Jason Dirk ; et al. | 2019-12-12 |
Systems And Methods For Determining Film Thickness Using Dc Self-bias Voltage
App 20190360101 - AUGUSTYNIAK; Edward J. ; et al. | 2019-11-28 |
Electrolyte concentration control system for high rate electroplating
Grant 10,472,730 - Mayer , et al. Nov | 2019-11-12 |
Method to obtain SiC class of films of desired composition and film properties
Grant 10,472,714 - Varadarajan Nov | 2019-11-12 |
Tungsten Feature Fill With Nucleation Inhibition
App 20190326168 - Yang; Tsung-Han ; et al. | 2019-10-24 |
Lipseals and contact elements for semiconductor electroplating apparatuses
Grant 10,435,807 - Feng , et al. O | 2019-10-08 |
Radical Source Design For Remote Plasma Atomic Layer Deposition
App 20190301013 - van Schravendijk; Bart J. | 2019-10-03 |
Hybrid ceramic showerhead
Grant 10,400,333 - Sabri , et al. Sep | 2019-09-03 |
Temperature Controlled Showerhead
App 20190256977 - Meinhold; Henner ; et al. | 2019-08-22 |
Conformal Deposition Of Silicon Carbide Films
App 20190259604 - Varadarajan; Bhadri N. ; et al. | 2019-08-22 |
Tungsten feature fill with nucleation inhibition
Grant 10,381,266 - Yang , et al. A | 2019-08-13 |
Diagnostic and control systems and methods for substrate processing systems using DC self-bias voltage
Grant 10,378,109 - Augustyniak , et al. A | 2019-08-13 |
Ultrahigh Selective Polysilicon Etch With High Throughput
App 20190221654 - Yang; Dengliang ; et al. | 2019-07-18 |
Front referenced anode
Grant 10,351,968 - Feng , et al. July 16, 2 | 2019-07-16 |
Tungsten Feature Fill With Nucleation Inhibition
App 20190206731 - Chandrashekar; Anand ; et al. | 2019-07-04 |
Conformal deposition of silicon carbide films
Grant 10,325,773 - Varadarajan , et al. | 2019-06-18 |
Radical source design for remote plasma atomic layer deposition
Grant 10,316,409 - van Schravendijk | 2019-06-11 |
Electroplating apparatus and process for wafer level packaging
Grant 10,309,024 - Mayer , et al. | 2019-06-04 |
Methods and apparatus for wetting pretreatment for through resist metal plating
Grant 10,301,738 - Buckalew , et al. | 2019-05-28 |
Low Copper Electroplating Solutions For Fill And Defect Control
App 20190145017 - Zhou; Jian ; et al. | 2019-05-16 |
Ultrahigh selective polysilicon etch with high throughput
Grant 10,283,615 - Yang , et al. | 2019-05-07 |
Tungsten feature fill with nucleation inhibition
Grant 10,256,142 - Chandrashekar , et al. | 2019-04-09 |
Mechanical suppression of parasitic plasma in substrate processing chamber
Grant 10,224,182 - Keil , et al. | 2019-03-05 |
Temperature controlled showerhead
Grant 10,221,484 - Meinhold , et al. | 2019-03-05 |
PECVD apparatus for in-situ deposition of film stacks
Grant 10,214,816 - Haverkamp , et al. Feb | 2019-02-26 |
Low copper electroplating solutions for fill and defect control
Grant 10,214,826 - Zhou , et al. Feb | 2019-02-26 |
Remote plasma based deposition of SiOC class of films
Grant 10,211,310 - Varadarajan Feb | 2019-02-19 |
Soft landing nanolaminates for advanced patterning
Grant 10,192,742 - Pasquale , et al. Ja | 2019-01-29 |
Cross flow manifold for electroplating apparatus
Grant 10,190,230 - Abraham , et al. Ja | 2019-01-29 |
Tungsten Feature Fill
App 20190019725 - Chandrashekar; Anand ; et al. | 2019-01-17 |
Protecting Anodes From Passivation In Alloy Plating Systems
App 20180371637 - Chua; Lee Peng ; et al. | 2018-12-27 |
Lipseals And Contact Elements For Semiconductor Electroplating Apparatuses
App 20180347065 - Feng; Jingbin ; et al. | 2018-12-06 |
Methods and apparatus for wetting pretreatment for through resist metal plating
Grant 10,128,102 - Chua , et al. November 13, 2 | 2018-11-13 |
Purging of porogen from UV cure chamber
Grant 10,121,682 - Smargiassi , et al. November 6, 2 | 2018-11-06 |
Method And Apparatuses For Reducing Porogen Accumulation From A Uv-cure Chamber
App 20180315604 - Gytri; Lisa Marie ; et al. | 2018-11-01 |
Method and apparatus for rapid pump-down of a high-vacuum loadlock
Grant 10,115,608 - Minshall , et al. October 30, 2 | 2018-10-30 |
Protecting anodes from passivation in alloy plating systems
Grant 10,106,907 - Chua , et al. October 23, 2 | 2018-10-23 |
Tungsten feature fill
Grant 10,103,058 - Chandrashekar , et al. October 16, 2 | 2018-10-16 |
Electroplating Apparatus For Tailored Uniformity Profile
App 20180291517 - Mayer; Steven T. ; et al. | 2018-10-11 |
Methods and apparatuses for cleaning electroplating substrate holders
Grant 10,092,933 - Kumar , et al. October 9, 2 | 2018-10-09 |
Automated cleaning of wafer plating assembly
Grant 10,087,545 - Mayer , et al. October 2, 2 | 2018-10-02 |
Methods For Depositing Films On Sensitive Substrates
App 20180247875 - Kang; Hu ; et al. | 2018-08-30 |
Electroplating Apparatus And Process For Wafer Level Packaging
App 20180237933 - Mayer; Steven T. ; et al. | 2018-08-23 |
Plating cup with contoured cup bottom
Grant 10,053,792 - He , et al. August 21, 2 | 2018-08-21 |
Plasma activated conformal dielectric film deposition
Grant 10,043,655 - Swaminathan , et al. August 7, 2 | 2018-08-07 |
UV and reducing treatment for K recovery and surface clean in semiconductor processing
Grant 10,037,905 - Varadarajan , et al. July 31, 2 | 2018-07-31 |
Dynamic current distribution control apparatus and method for wafer electroplating
Grant 10,023,970 - He , et al. July 17, 2 | 2018-07-17 |
Method for reducing porogen accumulation from a UV-cure chamber
Grant 10,020,197 - Gytri , et al. July 10, 2 | 2018-07-10 |
Method and apparatus for filling interconnect structures
Grant 10,006,144 - Reid , et al. June 26, 2 | 2018-06-26 |
Methods for depositing films on sensitive substrates
Grant 10,008,428 - Kang , et al. June 26, 2 | 2018-06-26 |
Soft Landing Nanolaminates For Advanced Patterning
App 20180158683 - Pasquale; Frank L. ; et al. | 2018-06-07 |
Lipseals and contact elements for semiconductor electroplating apparatuses
Grant 9,988,734 - Feng , et al. June 5, 2 | 2018-06-05 |
Electroplating apparatus and process for wafer level packaging
Grant 9,982,357 - Mayer , et al. May 29, 2 | 2018-05-29 |
Wetting Pretreatment For Enhanced Damascene Metal Filling
App 20180138044 - Mayer; Steven T. ; et al. | 2018-05-17 |
Enhancement Of Electrolyte Hydrodynamics For Efficient Mass Transfer During Electroplating
App 20180105949 - Mayer; Steven T. ; et al. | 2018-04-19 |
High dose implantation strip (HDIS) in H.sub.2 base chemistry
Grant 9,941,108 - Goto , et al. April 10, 2 | 2018-04-10 |
Hybrid impedance matching for inductively coupled plasma system
Grant 9,918,376 - Thomas , et al. March 13, 2 | 2018-03-13 |
Dynamic Current Distribution Control Apparatus And Method For Wafer Electroplating
App 20180057955 - He; Zhian ; et al. | 2018-03-01 |
Soft landing nanolaminates for advanced patterning
Grant 9,905,423 - Pasquale , et al. February 27, 2 | 2018-02-27 |
Apparatus for advanced packaging applications
Grant 9,899,230 - Buckalew , et al. February 20, 2 | 2018-02-20 |
Configuration And Method Of Operation Of An Electrodeposition System For Improved Process Stability And Performance
App 20180038007 - Ganesan; Kousik ; et al. | 2018-02-08 |
Method And Apparatus For Electroplating Semiconductor Wafer When Controlling Cations In Electrolyte
App 20180030611 - Spurlin; Tighe A. ; et al. | 2018-02-01 |
Methods And Apparatus For Wetting Pretreatment For Through Resist Metal Plating
App 20180023209 - Buckalew; Bryan L. ; et al. | 2018-01-25 |
Multi-station sequential curing of dielectric films
Grant 9,873,946 - Haverkamp , et al. January 23, 2 | 2018-01-23 |
Monitoring leveler concentrations in electroplating solutions
Grant 9,856,574 - Mayer January 2, 2 | 2018-01-02 |
Wetting pretreatment for enhanced damascene metal filling
Grant 9,852,913 - Mayer , et al. December 26, 2 | 2017-12-26 |
Remote Plasma Based Deposition Of Oxygen Doped Silicon Carbide Films
App 20170365462 - Varadarajan; Bhadri N. | 2017-12-21 |
Systems for uniform heat transfer including adaptive portions
Grant 9,835,388 - Gowdaru , et al. December 5, 2 | 2017-12-05 |
Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
Grant 9,834,852 - Mayer , et al. December 5, 2 | 2017-12-05 |
Methods and apparatus for wetting pretreatment for through resist metal plating
Grant 9,828,688 - Buckalew , et al. November 28, 2 | 2017-11-28 |
Dynamic current distribution control apparatus and method for wafer electroplating
Grant 9,822,461 - He , et al. November 21, 2 | 2017-11-21 |
Configuration and method of operation of an electrodeposition system for improved process stability and performance
Grant 9,816,193 - Ganesan , et al. November 14, 2 | 2017-11-14 |
Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte
Grant 9,816,196 - Spurlin , et al. November 14, 2 | 2017-11-14 |
Electroplating and post-electrofill systems with integrated process edge imaging and metrology systems
Grant 9,809,898 - Dinneen , et al. November 7, 2 | 2017-11-07 |
Methods For Depositing Films On Sensitive Substrates
App 20170316988 - Kang; Hu ; et al. | 2017-11-02 |
Methods for depositing films on sensitive substrates
Grant 9,786,570 - Kang , et al. October 10, 2 | 2017-10-10 |
Tungsten Feature Fill
App 20170278749 - Chandrashekar; Anand ; et al. | 2017-09-28 |
Detection of plating on wafer holding apparatus
Grant 9,746,427 - Mayer , et al. August 29, 2 | 2017-08-29 |
Wafer chuck with aerodynamic design for turbulence reduction
Grant 9,732,416 - Stephens , et al. August 15, 2 | 2017-08-15 |
Dual-plenum showerhead with interleaved plenum sub-volumes
Grant 9,728,380 - Mohn , et al. August 8, 2 | 2017-08-08 |
Apparatus for wetting pretreatment for enhanced damascene metal filling
Grant 9,721,800 - Mayer , et al. August 1, 2 | 2017-08-01 |
System and apparatus for flowable deposition in semiconductor fabrication
Grant 9,719,169 - Mohn , et al. August 1, 2 | 2017-08-01 |
Cross Flow Manifold For Electroplating Apparatus
App 20170175286 - Abraham; Richard ; et al. | 2017-06-22 |
Apparatus and method for edge bevel removal of copper from silicon wafers
Grant 9,685,353 - Ganesan , et al. June 20, 2 | 2017-06-20 |
Electrofill vacuum plating cell
Grant 9,677,188 - Stowell , et al. June 13, 2 | 2017-06-13 |
Multi-plenum, dual-temperature showerhead
Grant 9,677,176 - Chandrasekharan , et al. June 13, 2 | 2017-06-13 |
Low temperature tungsten film deposition for small critical dimension contacts and interconnects
Grant 9,673,146 - Chen , et al. June 6, 2 | 2017-06-06 |
Method for depositing a chlorine-free conformal SiN film
Grant 9,670,579 - Hausmann , et al. June 6, 2 | 2017-06-06 |
Methods And Apparatus For Wetting Pretreatment For Through Resist Metal Plating
App 20170148627 - Chua; Lee Peng ; et al. | 2017-05-25 |
Plasma Activated Conformal Dielectric Film Deposition
App 20170148628 - Swaminathan; Shankar ; et al. | 2017-05-25 |
Tensile dielectric films using UV curing
Grant 9,659,769 - Varadarajan , et al. May 23, 2 | 2017-05-23 |
Protecting Anodes From Passivation In Alloy Plating Systems
App 20170137960 - Chua; Lee Peng ; et al. | 2017-05-18 |
Wetting Wave Front Control For Reduced Air Entrapment During Wafer Entry Into Electroplating Bath
App 20170137958 - Ranjan; Manish ; et al. | 2017-05-18 |
Tungsten feature fill
Grant 9,653,353 - Chandrashekar , et al. May 16, 2 | 2017-05-16 |
Cross flow manifold for electroplating apparatus
Grant 9,624,592 - Abraham , et al. April 18, 2 | 2017-04-18 |
Dynamic Current Distribution Control Apparatus And Method For Wafer Electroplating
App 20170096745 - HE; Zhian ; et al. | 2017-04-06 |
Plasma activated conformal dielectric film deposition
Grant 9,611,544 - LaVoie , et al. April 4, 2 | 2017-04-04 |
Methods and apparatus for wetting pretreatment for through resist metal plating
Grant 9,613,833 - Chua , et al. April 4, 2 | 2017-04-04 |
Photoresist strip processes for improved device integrity
Grant 9,613,825 - Shaviv , et al. April 4, 2 | 2017-04-04 |
Contoured showerhead for improved plasma shaping and control
Grant 9,598,770 - Leeser , et al. March 21, 2 | 2017-03-21 |
Through silicon via filling using an electrolyte with a dual state inhibitor
Grant 9,593,426 - Willey , et al. March 14, 2 | 2017-03-14 |
Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath
Grant 9,587,322 - Ranjan , et al. March 7, 2 | 2017-03-07 |
Plasma generator systems and methods of forming plasma
Grant 9,591,738 - Qiu , et al. March 7, 2 | 2017-03-07 |
Method for forming tungsten film having low resistivity, low roughness and high reflectivity
Grant 9,589,835 - Chandrashekar , et al. March 7, 2 | 2017-03-07 |
Method for producing ultra-thin tungsten layers with improved step coverage
Grant 9,583,385 - Lee , et al. February 28, 2 | 2017-02-28 |
Plasma activated conformal dielectric film deposition
Grant 9,570,274 - Swaminathan , et al. February 14, 2 | 2017-02-14 |
Ultra low silicon loss high dose implant strip
Grant 9,564,344 - Cheung , et al. February 7, 2 | 2017-02-07 |
Enhancement Of Electrolyte Hydrodynamics For Efficient Mass Transfer During Electroplating
App 20170029973 - Mayer; Steven T. ; et al. | 2017-02-02 |
Apparatuses and methods for depositing SiC/SiCN films via cross-metathesis reactions with organometallic co-reactants
Grant 9,552,982 - LaVoie January 24, 2 | 2017-01-24 |
Cleaning Electroplating Substrate Holders Using Reverse Current Deplating
App 20170009370 - Chua; Lee Peng ; et al. | 2017-01-12 |
Temperature Controlled Showerhead
App 20170009344 - Meinhold; Henner W. ; et al. | 2017-01-12 |
Protecting anodes from passivation in alloy plating systems
Grant 9,534,308 - Chua , et al. January 3, 2 | 2017-01-03 |
Control Of Electrolyte Hydrodynamics For Efficient Mass Transfer During Electroplating
App 20160376722 - Mayer; Steven T. ; et al. | 2016-12-29 |
Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
Grant 9,523,155 - Mayer , et al. December 20, 2 | 2016-12-20 |
Plating cup with contoured cup bottom
Grant 9,512,538 - He , et al. December 6, 2 | 2016-12-06 |
Hybrid Ceramic Showerhead
App 20160348244 - Sabri; Mohamed ; et al. | 2016-12-01 |
Method of depositing a diffusion barrier for copper interconnect applications
Grant 9,508,593 - Rozbicki , et al. November 29, 2 | 2016-11-29 |
Apparatus For Advanced Packaging Applications
App 20160343582 - Buckalew; Bryan L. ; et al. | 2016-11-24 |
Wafer position correction with a dual, side-by-side wafer transfer robot
Grant 9,496,159 - Genetti , et al. November 15, 2 | 2016-11-15 |
Diagnostic And Control Systems And Methods For Substrate Processing Systems Using Dc Self-bias Voltage
App 20160326650 - Augustyniak; Edward ; et al. | 2016-11-10 |
Carousel reactor for multi-station, sequential processing systems
Grant 9,484,233 - Leeser November 1, 2 | 2016-11-01 |
Electroplating Apparatus And Process For Wafer Level Packaging
App 20160312373 - Mayer; Steven T. ; et al. | 2016-10-27 |
Cleaning electroplating substrate holders using reverse current deplating
Grant 9,476,139 - Chua , et al. October 25, 2 | 2016-10-25 |
Temperature controlled showerhead
Grant 9,476,120 - Meinhold , et al. October 25, 2 | 2016-10-25 |
Dedicated hot and cold end effectors for improved throughput
Grant 9,472,432 - Blank October 18, 2 | 2016-10-18 |
Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
Grant 9,464,361 - Mayer , et al. October 11, 2 | 2016-10-11 |
Soft Landing Nanolaminates For Advanced Patterning
App 20160293418 - Pasquale; Frank L. ; et al. | 2016-10-06 |
Suppression Of Parasitic Deposition In A Substrate Processing System By Suppressing Precursor Flow And Plasma Outside Of Substrate Region
App 20160289832 - Xia; Chunguang ; et al. | 2016-10-06 |
Purging Of Porogen From Uv Cure Chamber
App 20160284574 - Smargiassi; Eugene ; et al. | 2016-09-29 |
Methods And Apparatus For Wetting Pretreatment For Through Resist Metal Plating
App 20160281255 - Buckalew; Bryan L. ; et al. | 2016-09-29 |
Methods and apparatus for wetting pretreatment for through resist metal plating
Grant 9,455,139 - Buckalew , et al. September 27, 2 | 2016-09-27 |
Dual plenum, axi-symmetric showerhead with edge-to-center gas delivery
Grant 9,447,499 - Roy , et al. September 20, 2 | 2016-09-20 |
Apparatus for advanced packaging applications
Grant 9,449,808 - Buckalew , et al. September 20, 2 | 2016-09-20 |
Wet etching methods for copper removal and planarization in semiconductor processing
Grant 9,447,505 - Mayer , et al. September 20, 2 | 2016-09-20 |
Ceramic showerhead with embedded RF electrode for capacitively coupled plasma reactor
Grant 9,449,795 - Sabri , et al. September 20, 2 | 2016-09-20 |
Apparatuses And Methods For Depositing Sic/sicn Films Via Cross-metathesis Reactions With Organometallic Co-reactants
App 20160233081 - LaVoie; Adrien | 2016-08-11 |
Front Referenced Anode
App 20160222541 - Feng; Jingbin ; et al. | 2016-08-04 |
Contoured Showerhead For Improved Plasma Shaping And Control
App 20160203953 - Leeser; Karl F. ; et al. | 2016-07-14 |
Tungsten Feature Fill
App 20160190008 - Chandrashekar; Anand ; et al. | 2016-06-30 |
Monitoring Leveler Concentrations In Electroplating Solutions
App 20160186356 - Mayer; Steven T. | 2016-06-30 |
Lipseals And Contact Elements For Semiconductor Electroplating Apparatuses
App 20160186355 - Feng; Jingbin ; et al. | 2016-06-30 |
Methods For Depositing Films On Sensitive Substrates
App 20160155676 - Kang; Hu ; et al. | 2016-06-02 |
Automated Cleaning Of Wafer Plating Assembly
App 20160145761 - Mayer; Steven T. ; et al. | 2016-05-26 |
Low Tempature Tungsten Film Deposition For Small Critical Dimension Contacts And Interconnects
App 20160118345 - Chen; Feng ; et al. | 2016-04-28 |
Electroplating Apparatus For Tailored Uniformity Profile
App 20160115611 - Mayer; Steven T. ; et al. | 2016-04-28 |
Plating Cup With Contoured Cup Bottom
App 20160115615 - He; Zhian ; et al. | 2016-04-28 |
Low Copper/high Halide Electroplating Solutions For Fill And Defect Control
App 20160102416 - Zhou; Jian ; et al. | 2016-04-14 |
METHOD TO OBTAIN SiC CLASS OF FILMS OF DESIRED COMPOSITION AND FILM PROPERTIES
App 20160090649 - Varadarajan; Bhadri N. | 2016-03-31 |
Tungsten Feature Fill With Nucleation Inhibition
App 20160071764 - Chandrashekar; Anand ; et al. | 2016-03-10 |
Variable Showerhead Flow By Varying Internal Baffle Conductance
App 20160020074 - Mohn; Jonathan D. ; et al. | 2016-01-21 |
Ultra Low Silicon Loss High Dose Implant Strip
App 20150332933 - Cheung; David ; et al. | 2015-11-19 |
Pecvd Deposition Of Smooth Silicon Films
App 20150325435 - Hollister; Alice G. ; et al. | 2015-11-12 |
Electrolyte Concentration Control System For High Rate Electroplating
App 20150315720 - Mayer; Steven T. ; et al. | 2015-11-05 |
Hybrid Impedance Matching For Inductively Coupled Plasma System
App 20150313000 - Thomas; George ; et al. | 2015-10-29 |
Conformal Deposition Of Silicon Carbide Films
App 20150303056 - Varadarajan; Bhadri N. ; et al. | 2015-10-22 |
Method For Producing Ultra-thin Tungsten Layers With Improved Step Coverage
App 20150279732 - Lee; Sang-Hyeob ; et al. | 2015-10-01 |
Wet Etching Methods For Copper Removal And Planarization In Semiconductor Processing
App 20150267306 - Mayer; Steven T. ; et al. | 2015-09-24 |
Method For Depositing A Chlorine-free Conformal Sin Film
App 20150259791 - Hausmann; Dennis ; et al. | 2015-09-17 |
Method And Apparatuses For Reducing Porogen Accumulation From A Uv-cure Chamber
App 20150255285 - Gytri; Lisa ; et al. | 2015-09-10 |
Wafer Position Correction With A Dual, Side-by-side Wafer Transfer Robot
App 20150249028 - Genetti; Damon ; et al. | 2015-09-03 |
Wetting Wave Front Control For Reduced Air Entrapment During Wafer Entry Into Electroplating Bath
App 20150218727 - Ranjan; Manish ; et al. | 2015-08-06 |
Lipseals And Contact Elements For Semiconductor Electroplating Apparatuses
App 20150218726 - Feng; Jingbin ; et al. | 2015-08-06 |
Temperature Controlled Showerhead For High Temperature Operations
App 20150218701 - Bartlett; Christopher M. ; et al. | 2015-08-06 |
Front Referenced Anode
App 20150211144 - Feng; Jingbin ; et al. | 2015-07-30 |
Plasma Activated Conformal Dielectric Film Deposition
App 20150206719 - Swaminathan; Shankar ; et al. | 2015-07-23 |
Wetting Pretreatment For Enhanced Damascene Metal Filling
App 20150179458 - Mayer; Steven T. ; et al. | 2015-06-25 |
Apparatuses And Methods For Depositing Sic/sicn Films Via Cross-metathesis Reactions With Organometallic Co-reactants
App 20150170900 - LaVoie; Adrien | 2015-06-18 |
Through Silicon Via Filling Using An Electrolyte With A Dual State Inhibitor
App 20150159289 - Willey; Mark J. ; et al. | 2015-06-11 |
Soft Landing Nanolaminates For Advanced Patterning
App 20150126042 - Pasquale; Frank L. ; et al. | 2015-05-07 |
Multi-station Sequential Curing Of Dielectric Films
App 20150114292 - Haverkamp; Jason Dirk ; et al. | 2015-04-30 |
Systems For Modulating Step Coverage During Conformal Film Deposition
App 20150107513 - Swaminathan; Shankar ; et al. | 2015-04-23 |
Apparatus For Wetting Pretreatment For Enhanced Damascene Metal Filling
App 20150096883 - Mayer; Steven T. ; et al. | 2015-04-09 |
Flow Balancing In Gas Distribution Networks
App 20150075626 - Womack; Jeffrey ; et al. | 2015-03-19 |
Plasma Generator Apparatus
App 20150075718 - Fair; James A. ; et al. | 2015-03-19 |
Polysilicon Etch With High Selectivity
App 20150075715 - Thedjoisworo; Bayu ; et al. | 2015-03-19 |
Electroplating Apparatus For Tailored Uniformity Profile
App 20150060291 - Mayer; Steven T. ; et al. | 2015-03-05 |
Tungsten Feature Fill
App 20150056803 - Chandrashekar; Anand ; et al. | 2015-02-26 |
Apparatuses And Methods For Maintaining Ph In Nickel Electroplating Baths
App 20150041327 - Buckalew; Bryan L. ; et al. | 2015-02-12 |
Flowable Oxide Film With Tunable Wet Etch Rate
App 20150044882 - Draeger; Nerissa ; et al. | 2015-02-12 |
Pedestal Bottom Clean For Improved Fluorine Utilization And Integrated Symmetric Foreline
App 20150030766 - Lind; Gary B. ; et al. | 2015-01-29 |
In-situ Deposition Of Film Stacks
App 20150013607 - Haverkamp; Jason Dirk ; et al. | 2015-01-15 |
Multi-plenum, Dual-temperature Showerhead
App 20150007770 - Chandrasekharan; Ramesh ; et al. | 2015-01-08 |
Electroplating And Post-electrofill Systems With Integrated Process Edge Imaging And Metrology Systems
App 20150001087 - Dinneen; Daniel Mark ; et al. | 2015-01-01 |
Closed loop temperature heat up and control utilizing wafer-to-heater pedestal gap modulation
Grant 08920162 - | 2014-12-30 |
METHOD TO OBTAIN SiC CLASS OF FILMS OF DESIRED COMPOSITION AND FILM PROPERTIES
App 20140356549 - Varadarajan; Bhadri N. | 2014-12-04 |
Tensile Stressed Doped Amorphous Silicon
App 20140357064 - Fox; Keith ; et al. | 2014-12-04 |
Apparatus For Advanced Packaging Applications
App 20140357089 - BUCKALEW; Bryan L. ; et al. | 2014-12-04 |
Vacuum Robot With Linear Translation Carriage
App 20140348618 - Blank; Richard M. | 2014-11-27 |
Methods And Apparatus For Dielectric Deposition
App 20140302689 - Ashtiani; Kaihan ; et al. | 2014-10-09 |
Control Of Electrolyte Hydrodynamics For Efficient Mass Transfer During Electroplating
App 20140299477 - Mayer; Steven T. ; et al. | 2014-10-09 |
Control Of Electrolyte Hydrodynamics For Efficient Mass Transfer During Electroplating
App 20140299478 - Mayer; Steven T. ; et al. | 2014-10-09 |
Systems And Methods For Remote Plasma Atomic Layer Deposition
App 20140272185 - Na; Jeong-Seok ; et al. | 2014-09-18 |
Ceramic Showerhead With Embedded Rf Electrode For Capacitively Coupled Plasma Reactor
App 20140238608 - Sabri; Mohamed ; et al. | 2014-08-28 |
Purging Of Porogen From Uv Cure Chamber
App 20140230861 - SMARGIASSI; Eugene ; et al. | 2014-08-21 |
Methods And Apparatus For Wetting Pretreatment For Through Resist Metal Plating
App 20140230860 - Chua; Lee Peng ; et al. | 2014-08-21 |
Detection Of Plating On Wafer Holding Apparatus
App 20140230855 - Mayer; Steven T. ; et al. | 2014-08-21 |
Multi-plenum Showerhead With Temperature Control
App 20140235069 - Breiling; Patrick G. ; et al. | 2014-08-21 |
Current Ramping And Current Pulsing Entry Of Substrates For Electroplating
App 20140224661 - Spurlin; Tighe A. ; et al. | 2014-08-14 |
Method And Apparatus For Purging And Plasma Suppression In A Process Chamber
App 20140217193 - Breiling; Patrick ; et al. | 2014-08-07 |
Plasma Activated Conformal Dielectric Film Deposition
App 20140216337 - Swaminathan; Shankar ; et al. | 2014-08-07 |
Metal And Silicon Containing Capping Layers For Interconnects
App 20140216336 - Yu; Jengyi ; et al. | 2014-08-07 |
Plasma Activated Conformal Film Deposition
App 20140209562 - LaVoie; Adrien ; et al. | 2014-07-31 |
Plasma Activated Deposition Of A Conformal Film On A Substrate Surface
App 20140209026 - LaVoie; Adrien ; et al. | 2014-07-31 |
High Dose Implantation Strip (hdis) In H2 Base Chemistry
App 20140182619 - Goto; Haruhiro Harry ; et al. | 2014-07-03 |
Enhancement Of Electrolyte Hydrodynamics For Efficient Mass Transfer During Electroplating
App 20140183049 - Mayer; Steven T. ; et al. | 2014-07-03 |
Temperature Controlled Showerhead
App 20140158792 - Meinhold; Henner ; et al. | 2014-06-12 |
Methods For Depositing Ultra Thin Low Resistivity Tungsten Film For Small Critical Dimension Contacts And Interconnects
App 20140162451 - Chen; Feng ; et al. | 2014-06-12 |
Method And Apparatus For Filling Interconnect Structures
App 20140138239 - Reid; Jonathan D. ; et al. | 2014-05-22 |
Method For Depositing A Chlorine-free Conformal Sin Film
App 20140141626 - Hausmann; Dennis ; et al. | 2014-05-22 |
Methods For Depositing Films On Sensitive Substrates
App 20140141542 - Kang; Hu ; et al. | 2014-05-22 |
Electrolyte Loop With Pressure Regulation For Separated Anode Chamber Of Electroplating System
App 20140131211 - Rash; Robert ; et al. | 2014-05-15 |
Conformal Film Deposition For Gapfill
App 20140134827 - Swaminathan; Shankar ; et al. | 2014-05-15 |
Electrostatic Chucks And Methods For Refurbishing Same
App 20140124123 - Hart; Alisa ; et al. | 2014-05-08 |
Low Damage Photoresist Strip Method For Low-k Dielectrics
App 20140120733 - Cheung; David ; et al. | 2014-05-01 |
Electrofill Vacuum Plating Cell
App 20140097088 - Stowell; R. Marshall ; et al. | 2014-04-10 |
Enhancing Adhesion Of Cap Layer Films
App 20140094038 - Haverkamp; Jason Dirk ; et al. | 2014-04-03 |
Carbon Deposition-etch-ash Gap Fill Process
App 20140094035 - Ji; Chunhai ; et al. | 2014-04-03 |
High Temperature Electrode Connections
App 20140087587 - Lind; Gary | 2014-03-27 |
Multi-station Sequential Curing Of Dielectric Films
App 20140080324 - Shrinivasan; Krishnan ; et al. | 2014-03-20 |
Methods And Apparatus For Cleaning Deposition Chambers
App 20140069459 - Guan; Yan ; et al. | 2014-03-13 |
Reduced Isotropic Etchant Material Consumption And Waste Generation
App 20140061158 - Mayer; Steven T. ; et al. | 2014-03-06 |
Methods And Apparatus For Plasma-based Deposition
App 20140057454 - Subramonium; Pramod ; et al. | 2014-02-27 |
Plasma Clean Method For Deposition Chamber
App 20140053867 - Fang; Zhiyuan ; et al. | 2014-02-27 |
Flow Balancing In Gas Distribution Networks
App 20140048141 - Womack; Jeffrey ; et al. | 2014-02-20 |
High Pressure, High Power Plasma Activated Conformal Film Deposition
App 20140030444 - Swaminathan; Shankar ; et al. | 2014-01-30 |
Systems And Methods For At Least Partially Converting Films To Silicon Oxide And/or Improving Film Quality Using Ultraviolet Curing In Steam And Densification Of Films Using Uv Curing In Ammonia
App 20140020259 - Varadarajan; Bhadri N. ; et al. | 2014-01-23 |
Method For Deposition Of Conformal Films With Catalysis Assisted Low Temperature Cvd
App 20140023784 - Fox; Keith | 2014-01-23 |
Method For Depositing Tungsten Film Having Low Resistivity, Low Roughness And High Reflectivity
App 20140017891 - Chandrashekar; Anand ; et al. | 2014-01-16 |
Flowable Film Dielectric Gap Fill Process
App 20140017904 - GAURI; Vishal ; et al. | 2014-01-16 |
Photoresist-free Metal Deposition
App 20140014522 - Mayer; Steven T. ; et al. | 2014-01-16 |
Methods Of Forming Tensile Tungsten Films And Compressive Tungsten Films
App 20140011358 - Chen; Feng ; et al. | 2014-01-09 |
Electroplating Apparatuses And Methods Employing Liquid Particle Counter Modules
App 20140001050 - Huang; Ludan ; et al. | 2014-01-02 |
Polysilicon Etch With High Selectivity
App 20140004707 - Thedjoisworo; Bayu ; et al. | 2014-01-02 |
Removal Of Native Oxide With High Selectivity
App 20140004708 - Thedjoisworo; Bayu ; et al. | 2014-01-02 |
Modulating etch selectivity and etch rate of silicon nitride thin films
Grant 08617348 - | 2013-12-31 |
Subtractive patterning to define circuit components
Grant 08617982 - | 2013-12-31 |
Suppression Of Parasitic Deposition In A Substrate Processing System By Suppressing Precursor Flow And Plasma Outside Of Substrate Region
App 20130344245 - XIA; CHUNGUANG ; et al. | 2013-12-26 |
Protecting Anodes From Passivation In Alloy Plating Systems
App 20130334052 - Chua; Lee Peng ; et al. | 2013-12-19 |
Method And Apparatus For Electroplating
App 20130327650 - Mayer; Steven ; et al. | 2013-12-12 |
Diagnostic And Control Systems And Methods For Substrate Processing Systems Using Dc Self-bias Voltage
App 20130327272 - Augustyniak; Edward ; et al. | 2013-12-12 |
Hardmask Materials
App 20130330932 - Rangarajan; Vishwanathan ; et al. | 2013-12-12 |
Plasma-activated Deposition Of Conformal Films
App 20130319329 - Li; Ming ; et al. | 2013-12-05 |
Method And Apparatus For Rapid Pump-down Of A High-vacuum Loadlock
App 20130312835 - Minshall; Edmund B. ; et al. | 2013-11-28 |
Cross Flow Manifold For Electroplating Apparatus
App 20130313123 - ABRAHAM; Richard ; et al. | 2013-11-28 |
Rf-powered, Temperature-controlled Gas Diffuser
App 20130316094 - Leeser; Karl F. ; et al. | 2013-11-28 |
Systems And Methods For Modulating Step Coverage During Conformal Film Deposition
App 20130309415 - Swaminathan; Shankar ; et al. | 2013-11-21 |
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