loadpatents
name:-0.048354148864746
name:-0.041390895843506
name:-0.0005180835723877
Noto; Nobuhiko Patent Filings

Noto; Nobuhiko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Noto; Nobuhiko.The latest application filed is for "reclaiming processing method for delaminated wafer".

Company Profile
0.42.38
  • Noto; Nobuhiko - Tokyo JP
  • Noto; Nobuhiko - Annaka JP
  • Noto; Nobuhiko - Annaka-city JP
  • Noto; Nobuhiko - Gunma JP
  • Noto, Nobuhiko - Annaka-shi JP
  • Noto; Nobuhiko - Gunma-ken JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Reclaiming processing method for delaminated wafer
Grant 9,496,130 - Ishizuka , et al. November 15, 2
2016-11-15
Method for manufacturing bonded wafer and bonded SOI wafer
Grant 8,987,109 - Aga , et al. March 24, 2
2015-03-24
Reclaiming Processing Method For Delaminated Wafer
App 20140273400 - Ishizuka; Toru ;   et al.
2014-09-18
Silicon epitaxial wafer, method for manufacturing the same, bonded SOI wafer and method for manufacturing the same
Grant 8,823,130 - Kato , et al. September 2, 2
2014-09-02
Method for manufacturing bonded wafer
Grant 8,697,544 - Ishizuka , et al. April 15, 2
2014-04-15
Method For Manufacturing Bonded Wafer And Bonded Soi Wafer
App 20140097523 - Aga; Hiroji ;   et al.
2014-04-10
Method for producing bonded wafer
Grant 8,691,665 - Oka , et al. April 8, 2
2014-04-08
SOI wafer, semiconductor device, and method for manufacturing SOI wafer
Grant 8,466,538 - Ishizuka , et al. June 18, 2
2013-06-18
Method For Manufacturing Bonded Wafer
App 20130102126 - Aga; Hiroji ;   et al.
2013-04-25
SOI (silicon on insulator) structure semiconductor device and method of manufacturing the same
Grant 8,410,573 - Ohtsuki , et al. April 2, 2
2013-04-02
Method for manufacturing bonded wafer
Grant 8,389,382 - Oka , et al. March 5, 2
2013-03-05
Method for manufacturing SOI wafer
Grant 8,361,888 - Yokokawa , et al. January 29, 2
2013-01-29
Silicon Epitaxial Wafer, Method For Manufacturing The Same, Bonded Soi Wafer And Method For Manufacturing The Same
App 20120326268 - Kato; Masahiro ;   et al.
2012-12-27
Method for manufacturing SOI substrate
Grant 8,338,277 - Takeno , et al. December 25, 2
2012-12-25
Method For Producing Bonded Wafer
App 20120244679 - Oka; Satoshi ;   et al.
2012-09-27
Method for manufacturing SOI wafer
Grant 8,202,787 - Ishizuka , et al. June 19, 2
2012-06-19
Method for manufacturing bonded wafer
Grant 8,173,521 - Kobayashi , et al. May 8, 2
2012-05-08
Method for manufacturing bonded wafer
Grant 8,097,523 - Kobayashi , et al. January 17, 2
2012-01-17
Method for producing semiconductor substrate
Grant 8,076,223 - Oka , et al. December 13, 2
2011-12-13
Method For Manufacturing Soi Wafer
App 20110281420 - Aga; Hiroji ;   et al.
2011-11-17
Method for forming silicon oxide film of SOI wafer
Grant 8,053,334 - Yokokawa , et al. November 8, 2
2011-11-08
Method For Manufacturing Bonded Wafer
App 20110237049 - Oka; Satoshi ;   et al.
2011-09-29
Method For Manufacturing Soi Wafer
App 20110223740 - Ishizuka; Tohru ;   et al.
2011-09-15
Method For Manufacturing Bonded Wafer
App 20110212598 - Ishizuka; Tohru ;   et al.
2011-09-01
Method for manufacturing soi wafer
Grant 7,985,660 - Yokokawa , et al. July 26, 2
2011-07-26
Method For Manufacturing Bonded Wafer
App 20110104870 - Kobayashi; Norihiro ;   et al.
2011-05-05
Method for measuring rotation angle of bonded wafer
Grant 7,861,421 - Kobayashi , et al. January 4, 2
2011-01-04
Method For Manufacturing Soi Substrate
App 20100323502 - Takeno; Hiroshi ;   et al.
2010-12-23
Soi Wafer, Semiconductor Device, And Method For Manufacturing Soi Wafer
App 20100314722 - Ishizuka; Tohru ;   et al.
2010-12-16
Method for producing SOI substrate
Grant 7,838,388 - Oka , et al. November 23, 2
2010-11-23
Soi (silicon On Insulator) Structure Semiconductor Device And Method Of Manufacturing The Same
App 20100264510 - Ohtsuki; Hiroshi ;   et al.
2010-10-21
Method for manufacturing SOI substrate
Grant 7,799,660 - Ishizuka , et al. September 21, 2
2010-09-21
Method for manufacturing bonded wafer
Grant 7,776,719 - Soeta , et al. August 17, 2
2010-08-17
Method for manufacturing SOI substrate and SOI substrate
Grant 7,749,861 - Takeno , et al. July 6, 2
2010-07-06
Method For Measuring Rotation Angle Of Bonded Wafer
App 20100132205 - Kobayashi; Norihiro ;   et al.
2010-06-03
Method For Manufacturing Soi Wafer
App 20100129993 - Yokokawa; Isao ;   et al.
2010-05-27
Method For Manufacturing Bonded Wafer
App 20100120223 - Kobayashi; Norihiro ;   et al.
2010-05-13
Method For Manufacturing Soi Wafer
App 20100112781 - Yokokawa; Isao ;   et al.
2010-05-06
Method For Forming Silicon Oxide Film Of Soi Wafer
App 20100112824 - Yokokawa; Isao ;   et al.
2010-05-06
Manufacturing Method Of Strained Si Substrate
App 20100003803 - Oka; Satoshi ;   et al.
2010-01-07
Method For Producing Semiconductor Substrate
App 20090305485 - Oka; Satoshi ;   et al.
2009-12-10
Method for producing SOl substrate
App 20090258474 - Oka; Satoshi ;   et al.
2009-10-15
Method for manufacturing bonded wafer
App 20090170285 - Soeta; Yasutsugu ;   et al.
2009-07-02
Method of fabricating light-emitting device and light-emitting device
Grant 7,553,685 - Noto , et al. June 30, 2
2009-06-30
Method for producing semiconductor wafer
Grant 7,550,309 - Yokokawa , et al. June 23, 2
2009-06-23
Method for Manufacturing SOI Substrate and SOI Substrate
App 20090042361 - Takeno; Hiroshi ;   et al.
2009-02-12
Method for Manufacturing Bonded Wafer and Bonded Wafer
App 20080315349 - Takei; Tokio ;   et al.
2008-12-25
Method for manufacturing SOI substrate
App 20080261411 - Ishizuka; Tohru ;   et al.
2008-10-23
Method for Producing Semiconductor Wafer
App 20080003785 - Yokokawa; Isao ;   et al.
2008-01-03
Method For Producing Semiconductor Wafer
App 20070287269 - Yokokawa; Isao ;   et al.
2007-12-13
Method for producing a semiconductor wafer
App 20060185581 - Aga; Hiroji ;   et al.
2006-08-24
Light-emitting device and method of fabricating the same
Grant 7,041,529 - Yamada , et al. May 9, 2
2006-05-09
Light emitting device and method of fabricating the same
Grant 6,995,401 - Yamada , et al. February 7, 2
2006-02-07
Method of fabricating light-emitting device and light-emitting device
App 20050285127 - Noto, Nobuhiko ;   et al.
2005-12-29
Light emitting device
Grant 6,847,056 - Noto , et al. January 25, 2
2005-01-25
Light emitting device and method of fabricating the same
App 20040206961 - Yamada, Masato ;   et al.
2004-10-21
Light-emitting device and method for manufacturing the same
Grant 6,787,383 - Ikeda , et al. September 7, 2
2004-09-07
Light-emitting device and method of fabricating the same
App 20040135166 - Yamada, Masato ;   et al.
2004-07-15
Light emitting element and method for manufacturing the same
Grant 6,759,689 - Adomi , et al. July 6, 2
2004-07-06
Light-emitting device, method of fabricating the same, and OHMIC electrode structure for semiconductor device
App 20040104395 - Hagimoto, Kazunori ;   et al.
2004-06-03
Light emitting device
App 20040061101 - Noto, Nobuhiko ;   et al.
2004-04-01
Light emitting element and method for manufacturing the same
App 20040026703 - Adomi, Keizo ;   et al.
2004-02-12
Compound semiconductor single crystal and fabrication process for compound semiconductor device
Grant 6,589,447 - Ishizaki , et al. July 8, 2
2003-07-08
Light-emitting device and method for manufacturing the same
App 20030059972 - Ikeda, Shunichi ;   et al.
2003-03-27
Algainp light-emitting device
Grant 5,739,553 - Noto , et al. April 14, 1
1998-04-14
Semiconductor light emitting device with current spreading layer
Grant 5,600,158 - Noto , et al. February 4, 1
1997-02-04
Semiconductor light emitting device with nitrogen doping
Grant 5,442,201 - Adomi , et al. August 15, 1
1995-08-15
Semiconductor light emitting device having AlGaAsP light reflecting layers
Grant 5,442,203 - Adomi , et al. August 15, 1
1995-08-15

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