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name:-0.0070388317108154
name:-0.0073330402374268
name:-0.00046420097351074
Northrop Grumman Space & Missions Systems Corp. Patent Filings

Northrop Grumman Space & Missions Systems Corp.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Northrop Grumman Space & Missions Systems Corp..The latest application filed is for "bundle cable connector assembly, components, tooling and manufacturing method".

Company Profile
0.6.6
  • Northrop Grumman Space & Missions Systems Corp. - Los Angeles CA
  • Northrop Grumman Space & Missions Systems Corp. -
  • Northrop Grumman Space & Missions Systems Corporation - Los Angeles CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Microchannel cooler for high efficiency laser diode heat extraction
Grant 7,656,915 - Coleman , et al. February 2, 2
2010-02-02
Multi-dimensional wafer-level integrated antenna sensor micro packaging
Grant 7,615,863 - Yang , et al. November 10, 2
2009-11-10
Bundle cable connector assembly, components, tooling and manufacturing method
Grant 7,610,676 - Tran , et al. November 3, 2
2009-11-03
Signal processing for accelerating moving targets
Grant 7,450,057 - Clark November 11, 2
2008-11-11
Optical architecture requiring a single tilt mirror to pass a collimated beam through an aperture stop, centered, at a desired angle, in one or two dimensions
Grant 7,434,948 - Farrell October 14, 2
2008-10-14
Bundle Cable Connector Assembly, Components, Tooling and Manufacturing Method
App 20080196246 - Tran; Dean ;   et al.
2008-08-21
Deployable flat membrane structure
App 20080111031 - Mobrem; Mehran
2008-05-15
Optical architecture requiring a single tilt mirror to pass a collimated beam through an aperture stop, centered, at a desired angle, in one or two dimensions
App 20080100937 - Farrell; Thomas C.
2008-05-01
Fault Tolerant Laser Diode Package
App 20080056316 - Stephens; Edward F. IV ;   et al.
2008-03-06
Fault tolerant laser diode package
Grant 7,330,491 - Stephens, IV , et al. February 12, 2
2008-02-12
Multi-dimensional wafer-level integrated antenna sensor micro packaging
App 20070290326 - Yang; Jeffrey Ming-Jer ;   et al.
2007-12-20
Satellite communication system
App 20070072546 - Jenkin; Keith R. ;   et al.
2007-03-29

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