Noro; Hiroshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Noro; Hiroshi.The latest application filed is for "producing method of encapsulating layer-covered semiconductor element and producing method of semiconductor device".

Company Profile

0.28.28

Noro; Hiroshi - Osaka JP
Noro; Hiroshi - Ibaraki N/A JP
Noro; Hiroshi - Ibaraki-shi JP
Noro; Hiroshi - Wakayama JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Phosphor encapsulating sheet, light emitting diode device, and producing method thereof Grant 9,246,063 - Ebe , et al. January 26, 2	2016-01-26
Encapsulating layer-covered optical semiconductor element, producing method thereof, and optical semiconductor device Grant 9,117,984 - Katayama , et al. August 25, 2	2015-08-25
Producing Method Of Encapsulating Layer-covered Semiconductor Element And Producing Method Of Semiconductor Device App 20150179482 - Mitani; Munehisa ; et al.	2015-06-25
Photocurable resin composition and optical component using the same Grant 9,056,941 - Higo , et al. June 16, 2	2015-06-16
Epoxy resin composition for optical semiconductor device and optical semiconductor device using the same Grant 9,056,943 - Uchida , et al. June 16, 2	2015-06-16
Thermosetting encapsulation adhesive sheet Grant 8,922,031 - Toyoda , et al. December 30, 2	2014-12-30
Encapsulating Layer-covered Optical Semiconductor Element, Producing Method Thereof, And Optical Semiconductor Device App 20140183593 - KATAYAMA; Hiroyuki ; et al.	2014-07-03
Light-curing resin composition and optical material Grant 8,722,769 - Higo , et al. May 13, 2	2014-05-13
Photocurable resin composition and optical component using the same Grant 8,575,227 - Higo , et al. November 5, 2	2013-11-05
Photocurable resin composition and optical component using the same Grant 8,557,891 - Higo , et al. October 15, 2	2013-10-15
Epoxy Resin Composition For Optical Semiconductor Device And Optical Semiconductor Device Using The Same App 20120299039 - UCHIDA; Takahiro ; et al.	2012-11-29
Resin composition for optical semiconductor device, optical-semiconductor-device lead frame obtained using the same, and optical semiconductor device Grant 8,319,228 - Taniguchi , et al. November 27, 2	2012-11-27
Resin composition for optical components, optical component using the same and production method of optical lens Grant 8,304,470 - Noro , et al. November 6, 2	2012-11-06
Epoxy resin composition for semiconductor encapsulation and semiconductor device produced by using the same Grant 8,269,213 - Noro , et al. September 18, 2	2012-09-18
Light-curing Resin Composition And Optical Material App 20120165424 - HIGO; Yukiko ; et al.	2012-06-28
Thermosetting Encapsulation Adhesive Sheet App 20120153513 - Toyoda; Eiji ; et al.	2012-06-21
Epoxy resin composition for photosemiconductor element encapsulation and cured product thereof, and photosemiconductor device using the same Grant 8,198,382 - Noro June 12, 2	2012-06-12
Photocurable Resin Composition And Optical Component Using The Same App 20120010319 - HIGO; Yukiko ; et al.	2012-01-12
Photocurable Resin Composition And Optical Component Using The Same App 20120010320 - HIGO; Yukiko ; et al.	2012-01-12
Epoxy Resin Composition For Optical Use, Optical Component Using The Same, And Optical Semiconductor Device Obtained Using The Same App 20110298003 - UCHIDA; Takahiro ; et al.	2011-12-08
Bleaching activator granule Grant 8,063,009 - Onoda , et al. November 22, 2	2011-11-22
Thermosetting Resin Composition For Optical-semiconductor Element Encapsulation And Cured Material Thereof, And Optical-semiconductor Device Obtained Using The Same App 20110201763 - NORO; Hiroshi ; et al.	2011-08-18
Resin Composition For Optical Semiconductor Device, Optical-semiconductor-device Lead Frame Obtained Using The Same, And Optical Semiconductor Device App 20110058776 - TANIGUCHI; Takashi ; et al.	2011-03-10
Photocurable Resin Composition And Optical Component Using The Same App 20100324164 - HIGO; Yukiko ; et al.	2010-12-23
Resin Composition For Optical Components And Optical Component Using The Same App 20100292358 - NORO; Hiroshi ; et al.	2010-11-18
Epoxy Resin Composition For Photosemiconductor Element Encapsulation And Cured Product Thereof, And Photosemiconductor Device Using The Same App 20100164127 - Noro; Hiroshi	2010-07-01
Powder composition for paper manufacturing Grant 7,740,742 - Hamada , et al. June 22, 2	2010-06-22
Epoxy Resin Composition For Semiconductor Encapsulation And Semiconductor Device Produced By Using The Same App 20100148379 - Noro; Hiroshi ; et al.	2010-06-17
Process For Producing Optical Component App 20090311630 - NORO; Hiroshi ; et al.	2009-12-17
Resin Composition For Optical Components, Optical Component Using The Same And Production Method Of Optical Lens App 20090295003 - NORO; Hiroshi ; et al.	2009-12-03
Bleaching Activator Granule App 20090281018 - Onoda; Keiichi ; et al.	2009-11-12
Method Of Manufacturing Semiconductor Device App 20090246918 - NORO; Hiroshi ; et al.	2009-10-01
Laminated sheet Grant 7,521,122 - Noro , et al. April 21, 2	2009-04-21
Thermosetting Encapsulation Adhesive Sheet App 20080286562 - Toyoda; Eiji ; et al.	2008-11-20
Electronic component unit Grant 7,352,069 - Hazeyama , et al. April 1, 2	2008-04-01
Process for producing a bleaching activator composition Grant 7,323,437 - Fujinami , et al. January 29, 2	2008-01-29
Resin composition for encapsulating semiconductor device Grant 7,312,104 - Noro December 25, 2	2007-12-25
Powder composition for paper manufacturing App 20060137844 - Hamada; Yoshihito ; et al.	2006-06-29
Electronic component unit App 20060103028 - Hazeyama; Ichiro ; et al.	2006-05-18
Process for producing a bleaching activator composition App 20050170984 - Fujinami, Shigeaki ; et al.	2005-08-04
Resin composition for encapsulating semiconductor App 20050158557 - Noro, Hiroshi	2005-07-21
Thermosetting resin composition and semiconductor device obtained with the same Grant 6,916,538 - Noro , et al. July 12, 2	2005-07-12
Resin composition for encapsulating semiconductor device App 20050064201 - Noro, Hiroshi	2005-03-24
Laminated sheet App 20050008873 - Noro, Hiroshi ; et al.	2005-01-13
Thermosetting resin composition and semiconductor device obtained with the same App 20030219619 - Noro, Hiroshi ; et al.	2003-11-27
Thermosetting resin composition and semiconductor device using the same Grant 6,617,046 - Noro , et al. September 9, 2	2003-09-09
Thermosetting resin composition and semiconductor device using the same App 20020151106 - Noro, Hiroshi ; et al.	2002-10-17
Process for the production of semiconductor device Grant 6,333,206 - Ito , et al. December 25, 2	2001-12-25
Method of producing powder App 20010008049 - Noro, Hiroshi ; et al.	2001-07-19
Process for producing granular bleach activator composition and granular bleach activator composition Grant 5,458,801 - Oyashiki , et al. October 17, 1	1995-10-17

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