Norcott; Maurice H.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Norcott; Maurice H..The latest application filed is for "medium dose simox over a wide box thickness range by a multiple implant, multiple anneal process".
- Norcott; Maurice H. - Fishkill NY
- Norcott; Maurice H. - San Jose CA
- Norcott; Maurice H. - Valley Cottage NY
| Patent | Date |
|---|---|
| High density integral test probe Grant 7,276,919 - Beaman , et al. October 2, 2 | 2007-10-02 |
| Control of buried oxide quality in low dose SIMOX Grant 6,756,639 - Norcott , et al. June 29, 2 | 2004-06-29 |
| Ultimate SIMOX Grant 6,717,217 - Fogel , et al. April 6, 2 | 2004-04-06 |
| Medium dose simox over a wide BOX thickness range by a multiple implant, multiple anneal process App 20030194846 - Hovel, Harold J. ; et al. | 2003-10-16 |
| Ultimate SIMOX App 20030139023 - Fogel, Keith E. ; et al. | 2003-07-24 |
| Ultimate SIMOX Grant 6,541,356 - Fogel , et al. April 1, 2 | 2003-04-01 |
| Control of buried oxide quality in low dose SIMOX App 20030008471 - Norcott, Maurice H. ; et al. | 2003-01-09 |
| Divot reduction in SIMOX layers App 20020190318 - Fox, Stephen R. ; et al. | 2002-12-19 |
| Control of buried oxide quality in low dose SIMOX Grant 6,486,037 - Norcott , et al. November 26, 2 | 2002-11-26 |
| The ultimate SIMOX App 20020173123 - Fogel, Keith E. ; et al. | 2002-11-21 |
| High density integral test probe and fabrication method App 20020011001 - Beaman, Brian Samuel ; et al. | 2002-01-31 |
| Method of making high density integral test probe Grant 6,332,270 - Beaman , et al. December 25, 2 | 2001-12-25 |
| Method Of Making A High Density Integral Test Probe App 20010040460 - BEAMAN, BRIAN SAMUEL ; et al. | 2001-11-15 |
| Control of buried oxide quality in low dose SIMOX App 20010033002 - Norcott, Maurice H. ; et al. | 2001-10-25 |
| Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer Grant 5,635,846 - Beaman , et al. June 3, 1 | 1997-06-03 |
| Method of forming a three dimensional high performance interconnection package Grant 5,531,022 - Beaman , et al. July 2, 1 | 1996-07-02 |
| Three dimensional high performance interconnection package Grant 5,371,654 - Beaman , et al. December 6, 1 | 1994-12-06 |
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