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Resin coating device and a resin coating method Grant 9,147,617 - Nonomura September 29, 2 | 2015-09-29 |
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LED package manufacturing system and resin coating method for use in LED package manufacturing system Grant 8,993,353 - Nonomura March 31, 2 | 2015-03-31 |
Plasma processing device Grant 8,956,499 - Mizukami , et al. February 17, 2 | 2015-02-17 |
Plasma processing device and method of monitoring discharge state in plasma processing device Grant 8,855,949 - Nonomura October 7, 2 | 2014-10-07 |
Resin Coating Device, And Resin Coating Method App 20140199790 - Abe; Seikou ;   et al. | 2014-07-17 |
Resin Coating Device, And Resin Coating Method App 20140141540 - Abe; Seikou ;   et al. | 2014-05-22 |
Plasma processing device and method of monitoring plasma discharge state in plasma processing device Grant 8,668,836 - Mizukami , et al. March 11, 2 | 2014-03-11 |
Component bonding method, component laminating method and bonded component structure Grant 8,614,118 - Haji , et al. December 24, 2 | 2013-12-24 |
Liquid-application Device And Liquid-application Method App 20130330480 - Nonomura; Masaru ;   et al. | 2013-12-12 |
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Led Package Manufacturing System And Resin Coating Method For Use In Led Package Manufacturing System App 20130323862 - Nonomura; Masaru | 2013-12-05 |
Plasma processing device and plasma discharge state monitoring device Grant 8,585,862 - Mizukami , et al. November 19, 2 | 2013-11-19 |
Light Emitting Element Manufacturing System And Manufacturing Method And Light Emitting Element Package Manufacturing System And Manufacturing Method App 20130288404 - Nonomura; Masaru | 2013-10-31 |
Plasma processing apparatus Grant 8,558,460 - Nonomura , et al. October 15, 2 | 2013-10-15 |
Resin Coating Device And A Resin Coating Method App 20130236991 - Nonomura; Masaru | 2013-09-12 |
Method and device for resin coating Grant 8,525,217 - Nishiwaki , et al. September 3, 2 | 2013-09-03 |
Resin Coating Device And Resin Coating Method App 20130210174 - Nonomura; Masaru | 2013-08-15 |
Led Package Manufacturing System And Resin Coating Method In Led Package Manufacturing System App 20130192061 - Nonomura; Masaru | 2013-08-01 |
Plasma processing apparatus Grant 8,450,933 - Nonomura , et al. May 28, 2 | 2013-05-28 |
Method And Device For Resin Coating App 20130052761 - NISHIWAKI; Kentaro ;   et al. | 2013-02-28 |
Resin Coating Device In Led Package Manufacturing System App 20130008377 - Nonomura; Masaru | 2013-01-10 |
Resin Coating Device In Led Package Manufacturing System App 20130000554 - Nonomura; Masaru | 2013-01-03 |
Led Package Manufacturing System App 20120316665 - Nonomura; Masaru | 2012-12-13 |
Led Package Manufacturing System App 20120204793 - Nonomura; Masaru | 2012-08-16 |
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Plasma Processing Device And Method Of Monitoring Discharge State In Plasma Processing Device App 20110109530 - Nonomura; Masaru | 2011-05-12 |
Plasma Treatment Apparatus And Plasma Treatment Method App 20100243470 - Nonomura; Masaru ;   et al. | 2010-09-30 |
Plasma Processing Device And Method Of Monitoring Plasma Discharge State In Plasma Processing Device App 20100176085 - Mizukami; Tatsuhiro ;   et al. | 2010-07-15 |
Plasma Processing Device App 20100163182 - Mizukami; Tatsuhiro ;   et al. | 2010-07-01 |
Plasma Processing Device And Plasma Discharge State Monitoring Device App 20100132890 - Mizukami; Tatsuhiro ;   et al. | 2010-06-03 |
Method, apparatus and program of thermal analysis, heat controller and heating furnace using the method Grant 7,549,566 - Nonomura , et al. June 23, 2 | 2009-06-23 |
Component Bonding Method, Component Laminating Method And Bonded Component Structure App 20090035892 - Haji; Hiroshi ;   et al. | 2009-02-05 |
Method, apparatus and program of thermal analysis, heat controller and heating furnace using the same App 20060006210 - Nonomura; Masaru ;   et al. | 2006-01-12 |
Plasma processing method and method for fabricating electronic component module using the same App 20050266618 - Nonomura, Masaru ;   et al. | 2005-12-01 |
Heating device and heating method Grant 6,600,137 - Nonomura , et al. July 29, 2 | 2003-07-29 |
Reflow soldering device Grant 6,120,585 - Inomata , et al. September 19, 2 | 2000-09-19 |