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Lamp unit and power supply attachment Grant 11,441,767 - Matsunaga , et al. September 13, 2 | 2022-09-13 |
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Sensor System, Sensor Module, And Lamp Device App 20210025560 - Watano; Yuichi ;   et al. | 2021-01-28 |
Optical Coupling Device, Manufacturing Method Thereof, And Power Conversion System App 20180068990 - NOMURA; Yukio | 2018-03-08 |
Optical coupling device, manufacturing method thereof, and power conversion system Grant 9,831,226 - Nomura November 28, 2 | 2017-11-28 |
Optical Coupling Device, Manufacturing Method Thereof, And Power Conversion System App 20160245996 - NOMURA; Yukio | 2016-08-25 |
Vehicle headlamp Grant 9,310,042 - Nomura , et al. April 12, 2 | 2016-04-12 |
Vehicle headlamp and projection lens mounting method Grant 9,261,253 - Mochizuki , et al. February 16, 2 | 2016-02-16 |
Optical Coupling Device App 20140159062 - NOMURA; Yukio | 2014-06-12 |
Vehicle Headlamp App 20140112011 - NOMURA; Yukio ;   et al. | 2014-04-24 |
Vehicle Headlamp And Projection Lens Mounting Method App 20120300484 - Mochizuki; Katsuhito ;   et al. | 2012-11-29 |
Light Source Fixing Structure Of Lamp App 20110286224 - Nomura; Yukio | 2011-11-24 |
Vehicle headlamp Grant 7,909,493 - Nomura March 22, 2 | 2011-03-22 |
Vehicle Headlamp App 20100124069 - NOMURA; Yukio | 2010-05-20 |
Light emitting module and lighting unit Grant 7,290,913 - Watanabe , et al. November 6, 2 | 2007-11-06 |
Molding Apparatus For A Reinforcement Resin Coating Of Glass Optical Fiber Exposing Portion Of An Optical Fiber Junction, Method For Molding Reinforcement Resin Coating Of A Glass Optical Fiber Exposing Portion Of An Optical Fiber Junction, And Optical Fiber Cable Grant 7,234,881 - Koike , et al. June 26, 2 | 2007-06-26 |
Lead-free semiconductor device App 20060255437 - Nomura; Yukio | 2006-11-16 |
Light emitting module and lighting unit App 20060044840 - Watanabe; Shigeyuki ;   et al. | 2006-03-02 |
Semiconductor device having semiconductor element housed in packed with heat sink Grant 6,713,865 - Nomura March 30, 2 | 2004-03-30 |
Semiconductor device having semiconductor element housed in package with heat sink App 20030038362 - Nomura, Yukio | 2003-02-27 |
Molding die, method of reinforcing optical fiber junction, and optical fiber cable App 20020044749 - Koike, Rei ;   et al. | 2002-04-18 |
Embossed carrier tape, method of manufacturing the same and the metal molds used herein App 20020031660 - Hashizume, Shozi ;   et al. | 2002-03-14 |
Hydrated chromium oxide-coated steel strip useful for welded cans and other containers Grant 4,501,802 - Higuchi , et al. February 26, 1 | 1985-02-26 |