Nomura; Tomohiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nomura; Tomohiro.The latest application filed is for "electronic component built-in substrate and method of manufacturing the same".

Company Profile

0.7.8

Nomura; Tomohiro - Nagano JP
Nomura; Tomohiro - Nagano-shi JP
Nomura; Tomohiro - Kakuda JP
NOMURA; Tomohiro - Kakuda-shi JP
Nomura; Tomohiro - Yodogawa-ku Osaka-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic component built-in substrate and method of manufacturing the same Grant 9,247,646 - Sato , et al. January 26, 2	2016-01-26
Electronic Component Built-in Substrate And Method Of Manufacturing The Same App 20130319740 - Sato; Junji ; et al.	2013-12-05
Coil winding system and method for fabricating molded coil Grant 8,534,590 - Nomura , et al. September 17, 2	2013-09-17
Method for fabricating molded coil Grant 8,434,213 - Nomura , et al. May 7, 2	2013-05-07
Coil Winding System And Method For Fabricating Molded Coil App 20120286085 - NOMURA; Tomohiro ; et al.	2012-11-15
Coil Winding System And Method For Fabricating Molded Coil App 20120280424 - NOMURA; Tomohiro ; et al.	2012-11-08
Coil winding system and method for fabricating molded coil Grant 8,253,524 - Nomura , et al. August 28, 2	2012-08-28
Coil winding system and method for fabricating molded coil App 20090090807 - Nomura; Tomohiro ; et al.	2009-04-09
Method of manufacturing flexible wiring substrate and method of manufacturing electronic component mounting structure App 20070141757 - Nomura; Tomohiro	2007-06-21
Method of manufacturing flexible circuit substrate App 20060223236 - Nomura; Tomohiro ; et al.	2006-10-05
Flexible circuit substrate and method of manufacturing the same App 20060215377 - Nomura; Tomohiro ; et al.	2006-09-28
Process for producing multilayer circuit board App 20020083586 - Iijima, Takahiro ; et al.	2002-07-04
Cleaning process Grant 5,120,370 - Mori , et al. June 9, 1	1992-06-09

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