Nomoto; Kaoru
Patent Applications and Registrations
Patent applications and USPTO patent grants for Nomoto; Kaoru.The latest application filed is for "method of manufacturing three-dimensional printed wiring board".
- Nomoto; Kaoru - Aichi JP
- Nomoto; Kaoru - Okazaki JP
| Patent | Date |
|---|---|
| Method of manufacturing three-dimensional printed wiring board Grant 6,499,217 - Yamada , et al. December 31, 2 | 2002-12-31 |
| Shock-resistive printed circuit board and electronic device including the same Grant 6,274,821 - Echigo , et al. August 14, 2 | 2001-08-14 |
| Semiconductor element-mounting printed board Grant 5,248,853 - Ishikawa , et al. September 28, 1 | 1993-09-28 |
| Electroless copper plating solution Grant 4,956,014 - Kondo , et al. * September 11, 1 | 1990-09-11 |
| Electroless copper plating solution and process for electrolessly plating copper Grant 4,834,796 - Kondo , et al. May 30, 1 | 1989-05-30 |
| Electroless copper plating solution Grant 4,814,009 - Kondo , et al. March 21, 1 | 1989-03-21 |
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