Noma; Hirokazu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Noma; Hirokazu.The latest application filed is for "interfacial alloy layer for improving electromigration (em) resistance in solder joints".

Company Profile

0.7.8

Noma; Hirokazu - Tokyo JP
Noma; Hirokazu - Kawasaki JP
Noma; Hirokazu - Shiga-ken JP
Noma; Hirokazu - Yasu JP
Noma; Hirokazu - Yasu-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguide Grant 9,772,462 - Noma , et al. September 26, 2	2017-09-26
Circuit board formation using organic substrates Grant 9,760,002 - Mori , et al. September 12, 2	2017-09-12
Interfacial alloy layer for improving electromigration (EM) resistance in solder joints Grant 9,698,119 - Noma , et al. July 4, 2	2017-07-04
Circuit board formation using organic substrates Grant 9,684,237 - Mori , et al. June 20, 2	2017-06-20
Interfacial Alloy Layer For Improving Electromigration (em) Resistance In Solder Joints App 20160260681 - Noma; Hirokazu ; et al.	2016-09-08
Via For Electrical Contact Passing Through Layers Of Optical Waveguide In Multilayer Structure Including Electrical Substrate And Laminated Layers Of Optical Waveguide App 20160246017 - Noma; Hirokazu ; et al.	2016-08-25
Interfacial alloy layer for improving electromigration (EM) resistance in solder joints Grant 9,391,034 - Noma , et al. July 12, 2	2016-07-12
Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguide Grant 9,354,408 - Noma , et al. May 31, 2	2016-05-31
Circuit Board Formation Using Organic Substrates App 20160081187 - Mori; Hiroyuki ; et al.	2016-03-17
Circuit Board Formation Using Organic Substrates App 20160057857 - Mori; Hiroyuki ; et al.	2016-02-25
Via For Electrical Contact Passing Through Layers Of Optical Waveguide In Multilayer Structure Including Electrical Substrate And Laminated Layers Of Optical Waveguide App 20150338589 - Noma; Hirokazu ; et al.	2015-11-26
Interfacial Alloy Layer For Improving Electromigration (em) Resistance In Solder Joints App 20140061889 - Noma; Hirokazu ; et al.	2014-03-06
Semiconductor Package And Manufacturing Method Therefor App 20090047755 - Yamaji; Yoshiyuki ; et al.	2009-02-19
Semiconductor package and manufacturing method therefor Grant 7,484,293 - Yamaji , et al. February 3, 2	2009-02-03
Semiconductor Package and Manufacturing Method Therefor App 20070145551 - Yamaji; Yoshiyuki ; et al.	2007-06-28

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