loadpatents
name:-0.0081069469451904
name:-0.0055050849914551
name:-0.0005030632019043
NOLL; Thomas E. Patent Filings

NOLL; Thomas E.

Patent Applications and Registrations

Patent applications and USPTO patent grants for NOLL; Thomas E..The latest application filed is for "methods related to fabrication of shielded radio-frequency module".

Company Profile
0.7.6
  • NOLL; Thomas E. - Aliso Viejo CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Packaged Radio-frequency Module Having Wirebond Shielding
App 20150255402 - HOANG; Dinhphuoc V. ;   et al.
2015-09-10
Methods Related To Fabrication Of Shielded Radio-frequency Module
App 20150255403 - HOANG; Dinhphuoc V. ;   et al.
2015-09-10
Methods for fabricating an overmolded semiconductor package with wirebonds for electromagnetic shielding
Grant 9,054,115 - Hoang , et al. June 9, 2
2015-06-09
Overmolded semiconductor package with wirebonds for electromagnetic shielding
Grant 9,041,168 - Hoang , et al. May 26, 2
2015-05-26
Overmolded semiconductor package with a wirebond cage for EMI shielding
Grant 8,399,972 - Hoang , et al. March 19, 2
2013-03-19
Overmolded Semiconductor Package With Wirebonds For Electromagnetic Shielding
App 20120146178 - Hoang; Dinhphuoc V. ;   et al.
2012-06-14
Methods For Fabricating An Overmolded Semiconductor Package With Wirebonds For Electromagnetic Shielding
App 20120137514 - Hoang; Dinhphuoc V. ;   et al.
2012-06-07
Overmolded semiconductor package with a wirebond cage for EMI shielding
Grant 8,071,431 - Hoang , et al. December 6, 2
2011-12-06
Overmolded Semiconductor Package With A Wirebond Cage For Emi Shielding
App 20110084368 - Hoang; Dinphuoc V. ;   et al.
2011-04-14
Overmolded semiconductor package with a wirebond cage for EMI shielding
App 20070241440 - Hoang; Dinhphuoc V. ;   et al.
2007-10-18

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