Nolander; Ira G.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nolander; Ira G..The latest application filed is for "method of forming copper alloy sputtering targets with refined shape and microstructure".

Company Profile

4.3.6

Nolander; Ira G. - Spokane WA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of forming copper alloy sputtering targets with refined shape and microstructure Grant 11,035,036 - Ferrasse , et al. June 15, 2	2021-06-15
Copper manganese sputtering target Grant 10,760,156 - Ferrasse , et al. Sep	2020-09-01
High quality, void and inclusion free alloy wire Grant 10,421,161 - Sina , et al. Sept	2019-09-24
Method Of Forming Copper Alloy Sputtering Targets With Refined Shape And Microstructure App 20190233935 - Ferrasse; Stephane ; et al.	2019-08-01
Copper Manganese Sputtering Target App 20190112702 - Ferrasse; Stephane ; et al.	2019-04-18
High Quality, Void And Inclusion Free Alloy Wire App 20170320172 - Sina; Younes ; et al.	2017-11-09
Modified Sputtering Target And Deposition Components, Methods Of Production And Uses Thereof App 20090194414 - Nolander; Ira G. ; et al.	2009-08-06
Sputtering Targets Comprising A Novel Manufacturing Design, Methods Of Production And Uses Thereof App 20090065354 - Kardokus; Janine K. ; et al.	2009-03-12
Novel manufacturing design and processing methods and apparatus for PVD targets App 20080041720 - Kim; Jaeyeon ; et al.	2008-02-21

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