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name:-0.0049939155578613
name:-0.0033969879150391
name:-0.0010719299316406
Noh; Joon-Woong Patent Filings

Noh; Joon-Woong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Noh; Joon-Woong.The latest application filed is for "sintering method for w-cu composite material without exuding of cu".

Company Profile
0.3.4
  • Noh; Joon-Woong - Daejeon KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
W-Cu alloy having homogeneous micro-structure and the manufacturing method thereof
Grant 7,172,725 - Hong , et al. February 6, 2
2007-02-06
Method of forming tungsten-coated W--Cu composite powder
Grant 6,863,707 - Lee , et al. March 8, 2
2005-03-08
Tungsten film coating method using tungsten oxide powders
Grant 6,821,557 - Lee , et al. November 23, 2
2004-11-23
Sintering method for W-Cu composite material without exuding of Cu
App 20040166014 - Kim, Eun-Pyo ;   et al.
2004-08-26
W-Cu alloy having homogeneous micro-structure and the manufacturing method thereof
App 20040120840 - Hong, Moon-Hee ;   et al.
2004-06-24
Tungsten film coating method using tungsten oxide powders
App 20030211238 - Lee, Seong ;   et al.
2003-11-13
Method of forming tungsten-coated W-Cu composite powder and use of the same
App 20030205108 - Lee, Seong ;   et al.
2003-11-06

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