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Patent applications and USPTO patent grants for Noguchi; Tomoko.The latest application filed is for "semiconductor device having tapered metal coated sidewalls".
Patent | Date |
---|---|
Bump bond structure for enhanced electromigration performance Grant 11,450,638 - Mishra , et al. September 20, 2 | 2022-09-20 |
Semiconductor Device Having Tapered Metal Coated Sidewalls App 20220208689 - NOGUCHI; Tomoko ;   et al. | 2022-06-30 |
Transformers With Separated Magnetic Members App 20220068556 - YAN; Yi ;   et al. | 2022-03-03 |
Bump Bond Structure For Enhanced Electromigration Performance App 20200402938 - Mishra; Dibyajat ;   et al. | 2020-12-24 |
Bump bond structure for enhanced electromigration performance Grant 10,763,231 - Mishra , et al. Sep | 2020-09-01 |
Bump Bond Structure For Enhanced Electromigration Performance App 20200035633 - Mishra; Dibyajat ;   et al. | 2020-01-30 |
Solar battery module Grant 6,046,403 - Yoshikawa , et al. April 4, 2 | 2000-04-04 |
electrophotographic photoreceptors Grant 5,427,879 - Takano , et al. June 27, 1 | 1995-06-27 |
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