NODA; Yutaka

Patent Applications and Registrations

Patent applications and USPTO patent grants for NODA; Yutaka.The latest application filed is for "electronic apparatus and disassembling method therefor".

Company Profile

0.15.25

NODA; Yutaka - Kawasaki JP
Noda; Yutaka - Sanda JP
NODA; Yutaka - Kawasaki-shi JP
Noda; Yutaka - Daito JP
Noda; Yutaka - Yokoyama JP
Noda; Yutaka - Daito-shi JP
Noda; Yutaka - Sanda City JP
Noda; Yutaka - Sanda-shi JP
Noda; Yutaka - Choshi JP
Noda, Yutaka - Choshi-shi JP
Noda; Yutaka - Fuji JP
Noda; Yutaka - Shizuoka-ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic Apparatus And Disassembling Method Therefor App 20180170030 - NODA; Yutaka	2018-06-21
Electronic Apparatus And Disassembling Method Therefor App 20170326864 - NODA; Yutaka	2017-11-16
Electrical Device And Method Of Producing The Same App 20160224061 - Noda; Yutaka ; et al.	2016-08-04
Component Assembly Manufacturing Method, Positioning Apparatus, And Component Assembly App 20150118447 - Fujikawa; Hideyuki ; et al.	2015-04-30
Component Adhesive Bonding Structure And Component Separation Method App 20130233494 - NODA; Yutaka ; et al.	2013-09-12
Image forming method for determining a position of an ink ribbon with a boundary line Grant 8,137,015 - Noda March 20, 2	2012-03-20
Apparatus For Forming Solder Dam App 20110165338 - KITAJIMA; Masayuki ; et al.	2011-07-07
Apparatus For Forming Solder Dam And Method Of Forming Solder Dam App 20110165319 - KITAJIMA; Masayuki ; et al.	2011-07-07
Method Of Forming Solder Dam App 20110163152 - KITAJIMA; Masayuki ; et al.	2011-07-07
Image generating apparatus Grant 7,961,207 - Noda June 14, 2	2011-06-14
Optical module Grant 7,824,111 - Okada , et al. November 2, 2	2010-11-02
Ball capturing apparatus, solder ball disposing apparatus, ball capturing method, and solder ball disposing method Grant 7,717,317 - Fujii , et al. May 18, 2	2010-05-18
Polishing Apparatus App 20100105297 - Ishizuka; Toshihiro ; et al.	2010-04-29
Optical module producing method and apparatus Grant 7,691,662 - Okada , et al. April 6, 2	2010-04-06
Circuit board, method of forming wiring pattern, and method of manufacturing circuit board App 20090044972 - Kitajima; Masayuki ; et al.	2009-02-19
Processing Apparatus App 20080296266 - Okada; Toru ; et al.	2008-12-04
Thermal printer Grant 7,456,854 - Naito , et al. November 25, 2	2008-11-25
Optical Module App 20080101746 - Okada; Toru ; et al.	2008-05-01
Electrically conductive paste and method of making the same App 20080102294 - Kitajima; Masayuki ; et al.	2008-05-01
Optical module producing method and apparatus App 20080102544 - Okada; Toru ; et al.	2008-05-01
Ball Capturing Apparatus, Solder Ball Disposing Apparatus, Ball Capturing Method, And Solder Ball Disposing Method App 20080020561 - FUJII; Masanao ; et al.	2008-01-24
Thermal printer and method for correcting the energizing time data for heating elements in the thermal printer Grant 7,304,658 - Naito , et al. December 4, 2	2007-12-04
Image Generating Apparatus App 20070273745 - Noda; Yutaka	2007-11-29
Image forming device and image forming method App 20060204307 - Noda; Yutaka	2006-09-14
Soldering method and apparatus App 20060169750 - Tanaka; Hisao ; et al.	2006-08-03
Thermal printer App 20060158506 - Naito; Tadahiro ; et al.	2006-07-20
Thermal printer and method for correcting the energizing time data for heating elements in the thermal printer App 20060132581 - Naito; Tadahiro ; et al.	2006-06-22
Solder alloy and soldered bond Grant 6,893,512 - Kitajima , et al. May 17, 2	2005-05-17
Processes for producing P1,P4-diuridine-5'-tetraphosphate Grant 6,780,988 - Maeda , et al. August 24, 2	2004-08-24
Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method Grant 6,744,183 - Kitajima , et al. June 1, 2	2004-06-01
Dinucleotide tetraphosphate crystals Grant 6,617,444 - Mori , et al. September 9, 2	2003-09-09
Solder alloy and soldered bond App 20030143104 - Kitajima, Masayuki ; et al.	2003-07-31
Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method App 20030137223 - Kitajima, Masayuki ; et al.	2003-07-24
Crystals of diuridine tetraphosphate or salt thereof, process for producing the crystals, and process for producing the compounds App 20020156269 - Maeda, Hideaki ; et al.	2002-10-24
Crystals of diuridine tetraphosphate or salt thereof, process for producing the crystals, and process for producing the compounds Grant 6,458,946 - Maeda , et al. October 1, 2	2002-10-01
Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method App 20020074902 - Kitajima, Masayuki ; et al.	2002-06-20
Method of assembling micro-actuator App 20020059717 - Okada, Toru ; et al.	2002-05-23
Method of forming bumps and template used for forming bumps Grant 6,107,181 - Kitajima , et al. August 22, 2	2000-08-22
Double-surface machining system Grant 5,921,729 - Kikuchi , et al. July 13, 1	1999-07-13
Method for checking interference, method for checking processing program, and method for checking processing propriety Grant 5,751,584 - Yuasa , et al. May 12, 1	1998-05-12

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