Noda; Satoru

Patent Applications and Registrations

Patent applications and USPTO patent grants for Noda; Satoru.The latest application filed is for "component-embedded substrate".

Company Profile

0.16.18

Noda; Satoru - Kyoto JP
Noda; Satoru - Otsu JP
Noda; Satoru - Tokyo JP
Noda; Satoru - Koto-ku N/A JP
NODA; Satoru - Otsu-shi JP
Noda; Satoru - Hikone JP
NODA; Satoru - Hikone-shi JP
Noda; Satoru - Ohtsu JP
Noda; Satoru - Ohtsu-shi JP
Noda; Satoru - Hidakagawa JP
NODA; Satoru - Nagaokakyo-shi Kyoto-fu

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Component-embedded substrate Grant 9,918,381 - Noda March 13, 2	2018-03-13
Package substrate Grant 9,313,911 - Maeda , et al. April 12, 2	2016-04-12
Component-embedded Substrate App 20150116964 - Noda; Satoru	2015-04-30
Gaming machine capable of positionally changing sound image Grant 8,951,118 - Noda February 10, 2	2015-02-10
Gaming Machine App 20140135127 - NODA; Satoru	2014-05-15
Gaming machine having speakers outputting different sound at different positions and display generating display effect Grant 8,663,006 - Noda March 4, 2	2014-03-04
Package Substrate App 20130083502 - MAEDA; Atsuyoshi ; et al.	2013-04-04
Package substrate Grant 8,339,797 - Maeda , et al. December 25, 2	2012-12-25
Gaming Machine App 20110300950 - NODA; Satoru	2011-12-08
Composite electronic component Grant 7,929,316 - Noda , et al. April 19, 2	2011-04-19
Component incorporating module Grant 7,885,081 - Kawagishi , et al. February 8, 2	2011-02-08
Package Substrate App 20100232126 - MAEDA; Atsuyoshi ; et al.	2010-09-16
Composite Electronic Component And Method Of Manufacturing The Same App 20100134990 - NODA; Satoru ; et al.	2010-06-03
Composite electronic component Grant 7,684,207 - Noda , et al. March 23, 2	2010-03-23
Component-embedded substrate and component package using component-embedded substrate Grant 7,672,112 - Hattori , et al. March 2, 2	2010-03-02
Method of manufacturing composite electronic component Grant 7,594,316 - Noda , et al. September 29, 2	2009-09-29
Component-embedded Substrate And Component Package Using Component-embedded Substrate App 20090201624 - Hattori; Kazuo ; et al.	2009-08-13
Method For Manufacturing Component Incorporating Module And Component Incorporating Module App 20080149381 - KAWAGISHI; Makoto ; et al.	2008-06-26
Chalkbrood Determent App 20080008732 - Kamei; Kiyoshi ; et al.	2008-01-10
Thick film electrode and multilayer ceramic electronic device Grant 7,276,841 - Takaoka , et al. October 2, 2	2007-10-02
Composite Electronic Component And Method Of Manufacturing The Same App 20070188998 - NODA; Satoru ; et al.	2007-08-16
Composite Electronic Component And Method Of Manufacturing The Same App 20070081312 - NODA; Satoru ; et al.	2007-04-12
Thick Film Electrode And Multilayer Ceramic Electronic Device App 20060232170 - Takaoka; Hidekiyo ; et al.	2006-10-19
Method for manufacturing laminated electronic component Grant 7,067,173 - Miki , et al. June 27, 2	2006-06-27
Conductive paste for terminal electrodes of monolithic ceramic electronic component, method for making monolithic ceramic electronic component, and monolithic ceramic electronic component Grant 7,018,864 - Noda , et al. March 28, 2	2006-03-28
Conductive paste, method for manufacturing laminated ceramic electronic component, and laminated ceramic electronic component App 20040213901 - Miki, Takeshi ; et al.	2004-10-28
Conductive paste for terminal electrodes of monolithic ceramic electronic component, method for making monolithic ceramic electronic component, and monolithic ceramic electronic component App 20040214418 - Noda, Satoru ; et al.	2004-10-28
Ceramic electronic parts and method for manufacturing the same Grant 6,654,227 - Miki , et al. November 25, 2	2003-11-25
Ceramic electronic parts and method for maufacturing the same App 20030086237 - Miki, Takeshi ; et al.	2003-05-08
Conductive paste for terminal electrodes of monolithic ceramic electronic component, method for making monolithic ceramic electronic component, and monolithic ceramic electronic component App 20030064873 - Noda, Satoru ; et al.	2003-04-03
Conductive paste, method for manufacturing laminated ceraminc electronic component, and laminated ceramic electronic component App 20030060353 - Miki, Takeshi ; et al.	2003-03-27
Laminated ceramic electronic device Grant 6,370,015 - Noda , et al. April 9, 2	2002-04-09
Laminated ceramic electronic device App 20010030493 - Noda, Satoru ; et al.	2001-10-18

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