Noda; Kouta

Patent Applications and Registrations

Patent applications and USPTO patent grants for Noda; Kouta.The latest application filed is for "multilayered printed circuit board and manufacturing method thereof".

Company Profile

0.17.11

Noda; Kouta - Igi-gun JP
Noda; Kouta - Ibi-gun JP
Noda; Kouta - Gifu JP
Noda; Kouta - Ogaki JP
Noda; Kouta - Gifu-Ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multilayered Printed Circuit Board And Manufacturing Method Thereof App 20120125680 - Hirose; Naohiro ; et al.	2012-05-24
Multilayered printed circuit board and manufacturing method thereof Grant 8,148,643 - Hirose , et al. April 3, 2	2012-04-03
Printed wiring board and its manufacturing method Grant 8,065,794 - En , et al. November 29, 2	2011-11-29
Interlayer insulating layer for printed wiring board, printed wiring board and method for manufacturing same Grant 8,021,748 - Asai , et al. September 20, 2	2011-09-20
Method of manufacturing a multilayered printed circuit board Grant 7,832,098 - Hirose , et al. November 16, 2	2010-11-16
Electroplating process of electroplating an elecrically conductive sustrate Grant 7,827,680 - En , et al. November 9, 2	2010-11-09
Printed wiring board and its manufacturing method Grant 7,691,189 - En , et al. April 6, 2	2010-04-06
Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole Grant RE40,947 - Asai , et al. October 27, 2	2009-10-27
Printed Wiring Board And Its Manufacturing Method App 20090145652 - En; Honchin ; et al.	2009-06-11
Method of manufacturing multilayered circuit board Grant 7,415,761 - Hirose , et al. August 26, 2	2008-08-26
Multilayered Printed Circuit Board And Manufacturing Method Thereof App 20080189943 - HIROSE; Naohiro ; et al.	2008-08-14
Multilayered Printed Circuit Board And Manufacturing Method Thereof App 20080173473 - HIROSE; Naohiro ; et al.	2008-07-24
Interlayer Dielectric Layer For Printed Wiring Board, Printed Wiring Board, And Method Of Producing The Same App 20080023815 - ASAI; Motoo ; et al.	2008-01-31
Interlayer Dielectric Layer For Printed Wiring Board, Printed Wiring Board, And Method Of Producing The Same App 20080014336 - ASAI; Motoo ; et al.	2008-01-17
Printed Wiring Board And Its Manufacturing Method App 20070266886 - En; Honchin ; et al.	2007-11-22
Printed wiring board and its manufacturing method Grant 7,230,188 - En , et al. June 12, 2	2007-06-12
Interlayer insulating layer for printed wiring board, printed wiring board and method for manufacturing same App 20070013049 - Asai; Motoo ; et al.	2007-01-18
Printed wiring board and its manufacturing method App 20040134682 - En, Honchin ; et al.	2004-07-15
Multilayer printed-circuit board and method of manufacture Grant 6,762,921 - Asai , et al. July 13, 2	2004-07-13
Multilayered printed circuit board and manufacturing method therefor App 20040025333 - Hirose, Naohiro ; et al.	2004-02-12
Manufacturing method of a multilayered printed circuit board having an opening made by a laser, and using electroless and electrolytic plating Grant 6,591,495 - Hirose , et al. July 15, 2	2003-07-15
Multilayer printed wiring board having a roughened inner conductor layer and production method thereof Grant 6,512,186 - Nishiwaki , et al. January 28, 2	2003-01-28
Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole Grant 6,376,049 - Asai , et al. April 23, 2	2002-04-23
Multilayer printed wiring board and its production process, resin composition for filling through-hole Grant 6,376,052 - Asai , et al. April 23, 2	2002-04-23
Multilayered printed circuit board and manufacturing method therefor App 20010042637 - Hirose, Naohiro ; et al.	2001-11-22
Adhesive for electroless plating, feedstock composition for preparing adhesive for electroless plating, and printed wiring board Grant 6,261,671 - Asai , et al. July 17, 2	2001-07-17
Adhesive for electroless plating, raw material composition for preparing adhesive for electroless plating and printed wiring board Grant 6,248,428 - Asai , et al. June 19, 2	2001-06-19
High density multi-layered printed wiring board, multi-chip carrier and semiconductor package Grant 5,841,190 - Noda , et al. November 24, 1	1998-11-24

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