Noda, Hajime

Patent Applications and Registrations

Patent applications and USPTO patent grants for Noda, Hajime.The latest application filed is for "heat sink with fins and a method for manufacturing the same".

Company Profile

0.3.9

Noda, Hajime - Tokyo JP
Noda, Hajime - Aichi-ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Heat sink with fins and a method for manufacturing the same App 20050211416 - Kawabata, Kenya ; et al.	2005-09-29
Laser module, Peltier module, and Peltier module integrated heat spreader Grant 6,826,916 - Shimada , et al. December 7, 2	2004-12-07
Heat sink, method for manufacturing same, and pressing jig Grant 6,758,262 - Kawabata , et al. July 6, 2	2004-07-06
Heat sink with fins Grant 6,698,500 - Noda , et al. March 2, 2	2004-03-02
Wick, plate type heat pipe and container App 20040011512 - Noda, Hajime ; et al.	2004-01-22
Heat sink with fins App 20030178181 - Noda, Hajime ; et al.	2003-09-25
Wick, plate type heat pipe and container App 20020189793 - Noda, Hajime ; et al.	2002-12-19
Laser module, peltier module, and peltier module integrated heat spreader App 20020162338 - Shimada, Mamoru ; et al.	2002-11-07
Thermal transfer device and working fluid therefor including a kinetic ice inhibitor App 20020144804 - Liang, Yue ; et al.	2002-10-10
Heat sink with fins App 20020112846 - Noda, Hajime ; et al.	2002-08-22
Heat sink, method for manufacturing same, and pressing jig App 20020070005 - Kawabata, Kenya ; et al.	2002-06-13
Client information collecting method, client information providing method, point assigning method, merchandise information providing method, and merchandise information collection apparatus using network App 20010054014 - Noda, Hajime ; et al.	2001-12-20

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