loadpatents
Patent applications and USPTO patent grants for No; Ga Hyun.The latest application filed is for "semiconductor packages including chip stacks".
Patent | Date |
---|---|
Semiconductor packages including chip stacks Grant 10,497,671 - Cho , et al. De | 2019-12-03 |
Semiconductor Packages Including Chip Stacks App 20190221542 - CHO; Kyung Hwan ;   et al. | 2019-07-18 |
Semiconductor packages with metal posts, memory cards including the same, and electronic systems including the same Grant 9,437,580 - No , et al. September 6, 2 | 2016-09-06 |
Package substrates, packages including the same, methods of fabricating the packages with the package substrates, electronic systems including the packages, and memory cards including the packages Grant 9,412,690 - Lee , et al. August 9, 2 | 2016-08-09 |
Package Substrates, Packages Including The Same, Methods Of Fabricating The Packages With The Package Substrates, Electronic Systems Including The Packages, And Memory Cards Including The Packages App 20150243596 - LEE; Tae Ho ;   et al. | 2015-08-27 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.