Niwa; Hiroyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Niwa; Hiroyuki.The latest application filed is for "assembly method and assembly apparatus for cross shaft universal joint".

Company Profile

2.9.14

Niwa; Hiroyuki - Culver City CA
NIWA; Hiroyuki - Yao-shi JP
NIWA; Hiroyuki - Kyoto JP
Niwa; Hiroyuki - Fuji JP
Niwa; Hiroyuki - Otsu-shi JP
NIWA; Hiroyuki - Fuji-shi JP
Niwa; Hiroyuki - Otsu JP
Niwa; Hiroyuki - Nisshin JP
Niwa; Hiroyuki - Shiga JP
Niwa; Hiroyuki - Nisshin-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Automotive vehicle display screen with graphical user interface for seat control Grant D964,403 - Hope , et al. September 20, 2	2022-09-20
Assembly Method And Assembly Apparatus For Cross Shaft Universal Joint App 20210102583 - NIWA; Hiroyuki ; et al.	2021-04-08
Wireless Communication Device App 20190200357 - YOKOTE; Koudai ; et al.	2019-06-27
Outdoor unit of air conditioner Grant 10,001,285 - Yamauchi , et al. June 19, 2	2018-06-19
Process For Producing Adhesive Sheet Having Singulated Adhesive Layer, Process For Producing Wiring Substrate Using The Adhesive Sheet, Method Of Manufacturing Semiconductor Equipment, And Equipment For Producing Adhesive Sheet App 20150107764 - Katayama; Masaya ; et al.	2015-04-23
Outdoor Unit Of Air Conditioner App 20150040609 - YAMAUCHI; Hirofumi ; et al.	2015-02-12
Photosensitive resin composition, photosensitive resin composition film, and semiconductor device using the photosensitive resin composition or photosensitive resin composition film Grant 8,946,852 - Niwa February 3, 2	2015-02-03
Photosensitive adhesive composition, photosensitive adhesive film, and semiconductor device using each Grant 8,759,989 - Matsumura , et al. June 24, 2	2014-06-24
Photosensitive Resin Composition, Photosensitive Resin Composition Film, And Semiconductor Device Using The Photosensitive Resin Composition Or Photosensitive Resin Composition Film App 20130214379 - Niwa; Hiroyuki	2013-08-22
Photosensitive Adhesive Composition, Photosensitive Adhesive Film, And Semiconductor Device Using Each App 20130105998 - Matsumura; Kazuyuki ; et al.	2013-05-02
Photosensitive Adhesive Composition, Photosensitive Adhesive Sheet, And Semiconductor Device Using The Same App 20120181709 - Shimada; Akira ; et al.	2012-07-19
Paste composition for light guide and light guide utilizing the same Grant 7,960,462 - Shinba , et al. June 14, 2	2011-06-14
Multipath data transmission system with transmission sequence identification of data packets for sequential reordering of received data packets Grant 7,870,591 - Ui , et al. January 11, 2	2011-01-11
Paste Composition For Light Guide And Light Guide Utilizing The Same App 20090270541 - Shinba; Yoichi ; et al.	2009-10-29
Siloxane Resin Composition And Production Method Thereof App 20090105360 - Niwa; Hiroyuki ; et al.	2009-04-23
Data transmission system, communication apparatus, and program App 20070113256 - Ui; Katsunori ; et al.	2007-05-17
Positive type radiation-sensitive composition and process for producing pattern with the same Grant 6,919,157 - Niwa , et al. July 19, 2	2005-07-19
Positive type radiation-sensitive composition and process for processing for producing pattern with the same App 20030003392 - Niwa, Hiroyuki ; et al.	2003-01-02

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