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Patent applications and USPTO patent grants for NITTO SHINKO CORPORATION.The latest application filed is for "hot melt adhesive sheet".
Patent | Date |
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Hot Melt Adhesive Sheet App 20220282136 - FUJII; Takaaki ;   et al. | 2022-09-08 |
Resin composition and electric insulating sheet Grant 11,414,546 - Kihara , et al. August 16, 2 | 2022-08-16 |
Electrically insulating resin composition and laminate sheet Grant 11,331,876 - Kihara , et al. May 17, 2 | 2022-05-17 |
Thermosetting Adhesive And Adhesive Sheet App 20220098458 - Takahashi; Yoshiki ;   et al. | 2022-03-31 |
Curable Composition App 20220081504 - Kawamura; Ryuji ;   et al. | 2022-03-17 |
Curable Compound, Curable Composition, And Method For Producing Curable Composition App 20220073672 - Kawamura; Ryuji ;   et al. | 2022-03-10 |
Hot Melt Adhesive Sheet App 20210277287 - Aoike; Shuhei ;   et al. | 2021-09-09 |
Hot Melt Adhesive Sheet And Decorative Sheet With Adhesive Layer App 20210079275 - Sasaki; Kayoko ;   et al. | 2021-03-18 |
Reaction-curable adhesive, adhesive kit, and method of using reaction-curable adhesive Grant 10,752,816 - Tabuchi , et al. A | 2020-08-25 |
Thermally conductive polymer composition and thermally conductive molded object Grant 10,544,341 - Fujikawa , et al. Ja | 2020-01-28 |
Resin Composition And Electric Insulating Sheet App 20190338125 - Kihara; Yasuyuki ;   et al. | 2019-11-07 |
Reaction-curable Adhesive, Adhesive Kit, And Method Of Using Reaction-curable Adhesive App 20180208810 - Tabuchi; Akihiro ;   et al. | 2018-07-26 |
Resin Composition And Electric Insulating Sheet App 20180118938 - Kihara; Yasuyuki ;   et al. | 2018-05-03 |
Insulating paper for oil-immersed motors Grant 9,931,812 - Kashiwagi , et al. April 3, 2 | 2018-04-03 |
Aluminum nitride powder, resin composition, and thermally conductive molded object Grant 9,663,635 - Hatakeyama , et al. May 30, 2 | 2017-05-30 |
Thermally Conductive Polymer Composition And Thermally Conductive Molded Object App 20170081579 - FUJIKAWA; Kenichi ;   et al. | 2017-03-23 |
Aluminum Nitride Powder, Resin Composition, And Thermally Conductive Molded Object App 20170066908 - HATAKEYAMA; Yoshiharu ;   et al. | 2017-03-09 |
Thermally Conductive Polymer Composition And Thermally Conductive Molding App 20170022407 - HATAKEYAMA; Yoshiharu ;   et al. | 2017-01-26 |
Electrically Insulating Resin Composition And Laminate Sheet App 20160303821 - KIHARA; Yasuyuki ;   et al. | 2016-10-20 |
Insulating Paper For Oil-immersed Motors App 20150352811 - KASHIWAGI; Yasuo ;   et al. | 2015-12-10 |
Sealant App 20150031817 - Takayanagi; Kayoko ;   et al. | 2015-01-29 |
Three-dimensionally Shaped Electrically Insulating Product And Electrically Insulating Sheet Material App 20140048309 - Kihara; Yasuyuki ;   et al. | 2014-02-20 |
Covering Material, Superconducting Electric Wire And Electrical Device App 20130023419 - MATSUSHITA; Kiichiro ;   et al. | 2013-01-24 |
Covering Material, Covered Rectangular Electric Wire And Electrical Device App 20130008688 - NAGAI; Yozo ;   et al. | 2013-01-10 |
Covering Material, Covered Rectangular Electric Wire And Electrical Device App 20130008685 - MATSUSHITA; Kiichiro ;   et al. | 2013-01-10 |
Covering Material, Superconducting Electric Wire And Electrical Device App 20130012396 - MASAKI; Shunsuke ;   et al. | 2013-01-10 |
Adhesive Tape, Tying Material Using Same, And Tied Part App 20120231688 - Tosaki; Yutaka ;   et al. | 2012-09-13 |
Thermally Conductive Member And Battery Pack Device Using Same App 20120219838 - Terada; Yoshio ;   et al. | 2012-08-30 |
Interphase insulating member and rotating electric machine Grant 7,982,355 - Takizawa , et al. July 19, 2 | 2011-07-19 |
Aromatic polyamide and epoxy group-containing phenoxy resin Grant 7,888,434 - Kihara , et al. February 15, 2 | 2011-02-15 |
Laminate sheet Grant 7,713,892 - Kihara , et al. May 11, 2 | 2010-05-11 |
Insulation inspection apparatus Grant 7,688,076 - Aihara , et al. March 30, 2 | 2010-03-30 |
Resin Composition App 20090215968 - Kihara; Yasuyuki ;   et al. | 2009-08-27 |
Laminate Sheet App 20090047858 - Kihara; Yasuyuki ;   et al. | 2009-02-19 |
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