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Patent applications and USPTO patent grants for Nitta; Kouji.The latest application filed is for "base material for printed interconnect boards and manufacturing method of printed interconnect boards".
Patent | Date |
---|---|
Base material for printed interconnect boards and manufacturing method of printed interconnect boards Grant 10,548,217 - Takahashi , et al. Ja | 2020-01-28 |
Base Material For Printed Interconnect Boards And Manufacturing Method Of Printed Interconnect Boards App 20200015353 - TAKAHASHI; Kenji ;   et al. | 2020-01-09 |
Board for printed wiring Grant 6,914,183 - Inazawa , et al. July 5, 2 | 2005-07-05 |
Board for printed wiring App 20040058138 - Inazawa, Shinji ;   et al. | 2004-03-25 |
Three phase fluidized bed water purifying process Grant 4,620,931 - Hirata , et al. November 4, 1 | 1986-11-04 |
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