Nishizaki; Takahiro
Patent Applications and Registrations
Patent applications and USPTO patent grants for Nishizaki; Takahiro.The latest application filed is for "flux, method for applying flux, and method for mounting solder ball".
- Nishizaki; Takahiro - Campbell CA
- Nishizaki; Takahiro - Tochigi JP
- NISHIZAKI; Takahiro - Adachi-ku Tokyo
- Nishizaki; Takahiro - Tokyo JP
- Nishizaki; Takahiro - San Jose CA
| Patent | Date |
|---|---|
| Flux and solder paste Grant 11,376,694 - Kawanago , et al. July 5, 2 | 2022-07-05 |
| Flux Grant 11,305,385 - Kawanago , et al. April 19, 2 | 2022-04-19 |
| Flux, Method For Applying Flux, And Method For Mounting Solder Ball App 20220009041 - NISHIZAKI; Takahiro ; et al. | 2022-01-13 |
| Method for manufacturing electronic device Grant 11,158,599 - Kazama , et al. October 26, 2 | 2021-10-26 |
| Flux and solder paste Grant 11,117,224 - Kawanago , et al. September 14, 2 | 2021-09-14 |
| Method For Manufacturing Electronic Device App 20210143122 - KAZAMA; Tatsuya ; et al. | 2021-05-13 |
| Flux And Solder Paste App 20210078113 - KAWANAGO; Tomohisa ; et al. | 2021-03-18 |
| Flux App 20210060713 - KAWANAGO; Tomohisa ; et al. | 2021-03-04 |
| Flux and solder paste Grant 10,857,630 - Takagi , et al. December 8, 2 | 2020-12-08 |
| Flux and solder paste Grant 10,843,298 - Kawasaki , et al. November 24, 2 | 2020-11-24 |
| Flux and Solder Paste App 20200361039 - Kawanago; Tomohisa ; et al. | 2020-11-19 |
| Flux And Solder Paste App 20200316725 - TAKAGI; Yoshinori ; et al. | 2020-10-08 |
| Solder ball, solder joint, and joining method Grant 10,780,530 - Oshima , et al. Sept | 2020-09-22 |
| Flux App 20200156192 - Nishizaki; Takahiro ; et al. | 2020-05-21 |
| Flux And Solder Paste App 20190366487 - KAWASAKI; Hiroyoshi ; et al. | 2019-12-05 |
| Solder Ball, Solder Joint, and Joining Method App 20190358752 - Oshima; Hiroki ; et al. | 2019-11-28 |
| Flux App 20190030656 - NISHIZAKI; Takahiro ; et al. | 2019-01-31 |
| Flux App 20180200845 - Kawanago; Tomohisa ; et al. | 2018-07-19 |
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