Nishiyama; Tousaku

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nishiyama; Tousaku.The latest application filed is for "circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment".

Company Profile

0.15.18

Nishiyama; Tousaku - Nara JP
Nishiyama; Tousaku - Nara-shi JP
Nishiyama; Tousaku - Katano JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Module with a built-in component, and electronic device with the same Grant 8,064,213 - Asahi , et al. November 22, 2	2011-11-22
Method for producing connection member Grant 7,748,110 - Asahi , et al. July 6, 2	2010-07-06
Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment App 20080185178 - Okimoto; Rikiya ; et al.	2008-08-07
Circuit board with built-in electronic component and method for manufacturing the same Grant 7,341,890 - Ishimaru , et al. March 11, 2	2008-03-11
Connection member and mount assembly and production method of the same App 20080047137 - Asahi; Toshiyuki ; et al.	2008-02-28
Connection member and mount assembly and production method of the same Grant 7,258,549 - Asahi , et al. August 21, 2	2007-08-21
Wiring board embedded with spherical semiconductor element App 20070069393 - Asahi; Toshiyuki ; et al.	2007-03-29
Method for manufacturing printed circuit board Grant 7,155,820 - Andoh , et al. January 2, 2	2007-01-02
Mount assembly, optical transmission line and photoelectric circuit board Grant 7,136,543 - Nishiyama , et al. November 14, 2	2006-11-14
Circuit board with built-in electronic component and method for manufacturing the same App 20060244119 - Ishimaru; Yukihiro ; et al.	2006-11-02
Circuit board with built-in electronic component and method for manufacturing the same Grant 7,091,593 - Ishimaru , et al. August 15, 2	2006-08-15
Semiconductor built-in millimeter-wave band module Grant 7,061,100 - Iwaki , et al. June 13, 2	2006-06-13
Three-dimensional mounting structure and method for producing the same App 20050184372 - Asahi, Toshiyuki ; et al.	2005-08-25
Connection member and mount assembly and production method of the same App 20050184381 - Asahi, Toshiyuki ; et al.	2005-08-25
Module with a built-in component, and electronic device with the same App 20050168960 - Asahi, Toshiyuki ; et al.	2005-08-04
Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment App 20050124197 - Okimoto, Rikiya ; et al.	2005-06-09
Light-reception/emission device built-in module with optical and electrical wiring combined therein, method for producing the module and assembling member of the module Grant 6,885,788 - Iwaki , et al. April 26, 2	2005-04-26
Connector sheet and wiring board, and production processes of the same App 20050057906 - Nakatani, Seiichi ; et al.	2005-03-17
Circuit board with in-built electronic component and method for manufacturing the same App 20050006142 - Ishimaru, Yukihiro ; et al.	2005-01-13
Mount assembly, optical transmission line and photoelectric circuit board App 20050002608 - Nishiyama, Tousaku ; et al.	2005-01-06
Conductive adhesive agent, packaging structure, and method for manufacturing the same structure Grant 6,814,893 - Takezawa , et al. November 9, 2	2004-11-09
Wiring board and production method thereof Grant 6,774,316 - Suzuki , et al. August 10, 2	2004-08-10
Printed circuit board and method of manufacturing the same Grant 6,753,483 - Andoh , et al. June 22, 2	2004-06-22
Printed circuit board and method of manufacturing the same App 20040089471 - Andoh, Daizo ; et al.	2004-05-13
Light-reception/emission device built-in module with optical and electrical wiring combined therein, method for producing the module and assembling of member the module App 20040001661 - Iwaki, Hideki ; et al.	2004-01-01
Conductive adhesive and packaging structure using the same Grant 6,666,994 - Takezawa , et al. December 23, 2	2003-12-23
Semiconductor built -in millimeter-wave band module App 20030189246 - Iwaki, Hideki ; et al.	2003-10-09
Conductive adhesive agent, packaging structure, and method for manufacturing the same structure Grant 6,620,345 - Takezawa , et al. September 16, 2	2003-09-16
Conductive adhesive and packaging structure using the same App 20030116756 - Takezawa, Hiroaki ; et al.	2003-06-26
Conductive adhesive agent, packaging structrue, and method for manufacturing the same structure App 20020050643 - Takezawa, Hiroaki ; et al.	2002-05-02
Conductive adhesive and packaging structure using the same App 20020043652 - Takezawa, Hiroaki ; et al.	2002-04-18
Printed circuit board and method of manufacturing the same App 20010052425 - Andoh, Daizo ; et al.	2001-12-20
Method of producing a magnetic recording media Grant 5,229,173 - Suzuki , et al. July 20, 1	1993-07-20

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