Nishiyama; Teppei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Nishiyama; Teppei.The latest application filed is for "polyamide acid, thermoplastic polyimide, resin film, metal-clad laminate and circuit board".
- Nishiyama; Teppei - Tokyo JP
- Nishiyama; Teppei - Chiba JP
| Patent | Date |
|---|---|
| Polyamide acid, thermoplastic polyimide, resin film, metal-clad laminate and circuit board Grant 10,844,175 - Suto , et al. November 24, 2 | 2020-11-24 |
| Polyamide Acid, Thermoplastic Polyimide, Resin Film, Metal-clad Laminate And Circuit Board App 20190100624 - SUTO; Yoshiki ; et al. | 2019-04-04 |
| Laminate for Suspension and Method for Producing Same App 20080225438 - Kuki; Takahiro ; et al. | 2008-09-18 |
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