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Patent applications and USPTO patent grants for Nishiwaki; Masayuki.The latest application filed is for "surface shape measuring apparatus and defect determining apparatus".
Patent | Date |
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Surface Shape Measuring Apparatus And Defect Determining Apparatus App 20170241773 - Nishiwaki; Masayuki | 2017-08-24 |
Optical Inspection Apparatus And Optical Inspection System App 20140250679 - Nishiwaki; Masayuki ;   et al. | 2014-09-11 |
Laser cutting method Grant 8,108,998 - Inada , et al. February 7, 2 | 2012-02-07 |
Laser cutting apparatus and laser cutting method Grant 8,093,530 - Nishiwaki , et al. January 10, 2 | 2012-01-10 |
Laser processing apparatus and laser processing method Grant 7,807,940 - Nishiwaki , et al. October 5, 2 | 2010-10-05 |
Automatic focusing apparatus, laser processing apparatus, and laser cutting apparatus Grant 7,791,001 - Nishiwaki , et al. September 7, 2 | 2010-09-07 |
Laser based splitting method, object to be split, and semiconductor element chip Grant 7,211,526 - Iri , et al. May 1, 2 | 2007-05-01 |
Method for laser cutting and method of producing function elements App 20060258047 - Nishiwaki; Masayuki ;   et al. | 2006-11-16 |
Laser cutting method App 20060113287 - Inada; Genji ;   et al. | 2006-06-01 |
Laser processing apparatus and laser processing method App 20060108339 - Nishiwaki; Masayuki ;   et al. | 2006-05-25 |
Laser cutting apparatus and laser cutting method App 20060108338 - Nishiwaki; Masayuki ;   et al. | 2006-05-25 |
Automatic focusing apparatus, laser processing apparatus, and laser cutting apparatus App 20060109757 - Nishiwaki; Masayuki ;   et al. | 2006-05-25 |
Laser based splitting method, object to be split, and semiconductor element chip App 20050199592 - Iri, Junichiro ;   et al. | 2005-09-15 |
Laser process apparatus for forming holes in a workpiece Grant 5,389,954 - Inaba , et al. February 14, 1 | 1995-02-14 |
Method of manufacturing nozzle plate for ink jet printer Grant 5,263,250 - Nishiwaki , et al. November 23, 1 | 1993-11-23 |
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