loadpatents
name:-0.01106595993042
name:-0.0085859298706055
name:-0.00076580047607422
Nishiwaki; Masayuki Patent Filings

Nishiwaki; Masayuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nishiwaki; Masayuki.The latest application filed is for "surface shape measuring apparatus and defect determining apparatus".

Company Profile
0.7.8
  • Nishiwaki; Masayuki - Yoshikawa-shi JP
  • Nishiwaki; Masayuki - Yoshikawa JP
  • Nishiwaki; Masayuki - Kawasaki JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Surface Shape Measuring Apparatus And Defect Determining Apparatus
App 20170241773 - Nishiwaki; Masayuki
2017-08-24
Optical Inspection Apparatus And Optical Inspection System
App 20140250679 - Nishiwaki; Masayuki ;   et al.
2014-09-11
Laser cutting method
Grant 8,108,998 - Inada , et al. February 7, 2
2012-02-07
Laser cutting apparatus and laser cutting method
Grant 8,093,530 - Nishiwaki , et al. January 10, 2
2012-01-10
Laser processing apparatus and laser processing method
Grant 7,807,940 - Nishiwaki , et al. October 5, 2
2010-10-05
Automatic focusing apparatus, laser processing apparatus, and laser cutting apparatus
Grant 7,791,001 - Nishiwaki , et al. September 7, 2
2010-09-07
Laser based splitting method, object to be split, and semiconductor element chip
Grant 7,211,526 - Iri , et al. May 1, 2
2007-05-01
Method for laser cutting and method of producing function elements
App 20060258047 - Nishiwaki; Masayuki ;   et al.
2006-11-16
Laser cutting method
App 20060113287 - Inada; Genji ;   et al.
2006-06-01
Laser processing apparatus and laser processing method
App 20060108339 - Nishiwaki; Masayuki ;   et al.
2006-05-25
Laser cutting apparatus and laser cutting method
App 20060108338 - Nishiwaki; Masayuki ;   et al.
2006-05-25
Automatic focusing apparatus, laser processing apparatus, and laser cutting apparatus
App 20060109757 - Nishiwaki; Masayuki ;   et al.
2006-05-25
Laser based splitting method, object to be split, and semiconductor element chip
App 20050199592 - Iri, Junichiro ;   et al.
2005-09-15
Laser process apparatus for forming holes in a workpiece
Grant 5,389,954 - Inaba , et al. February 14, 1
1995-02-14
Method of manufacturing nozzle plate for ink jet printer
Grant 5,263,250 - Nishiwaki , et al. November 23, 1
1993-11-23

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