Nishiura; Naoki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nishiura; Naoki.The latest application filed is for "endless tubular polyimide film".

Company Profile

1.8.5

Nishiura; Naoki - Konan N/A JP
Nishiura; Naoki - Moriyama JP
Nishiura; Naoki - Moriyama-shi JP
Nishiura; Naoki - Aichi JP
Nishiura; Naoki - Shiga JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Polyamic acid solution composition having carbon black dispersed therein, process for production of semiconductive polyimide resin belt using the composition, and semiconductive polyimide resin belt Grant 8,686,106 - Nishiura , et al. April 1, 2	2014-04-01
Semielectroconductive polyimide resin belt and process for producing semielectroconductive polyimide resin belt Grant 8,506,848 - Ichino , et al. August 13, 2	2013-08-13
Endless tubular polyimide film Grant 8,314,204 - Nishiura , et al. November 20, 2	2012-11-20
Carbon black-dispersed polyamic acid solution composition, and process for producing semiconductive polyimide resin belt therewith Grant 8,303,852 - Nishiura , et al. November 6, 2	2012-11-06
Endless Tubular Polyimide Film App 20120040121 - Nishiura; Naoki ; et al.	2012-02-16
Endless tubular polyimide film Grant 8,097,693 - Nishiura , et al. January 17, 2	2012-01-17
Semielectroconductive Polyimide Resin Belt And Process For Producing Semielectroconductive Polyimide Resin Belt App 20100329751 - Ichino; Akira ; et al.	2010-12-30
Polyamic Acid Solution Composition Having Carbon Black Dispersed Therein, Process For Production Of Semiconductive Polyimide Resin Belt Using The Composition, And Semiconductive Polyimide Resin Belt App 20100247888 - Nishiura; Naoki ; et al.	2010-09-30
Carbon Black-dispersed Polyamic Acid Solution Composition, And Process For Producing Semiconductive Polyimide Resin Belt Therewith App 20090236566 - Nishiura; Naoki ; et al.	2009-09-24
Endless tubular polyimide film App 20070178264 - Nishiura; Naoki ; et al.	2007-08-02
Electrically-semiconductive poly(amic acid) liquid compositions and their use Grant 6,303,054 - Kanetake , et al. October 16, 2	2001-10-16

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