loadpatents
name:-0.021133899688721
name:-0.01059889793396
name:-0.0086889266967773
NISHITANI; Yoshinori Patent Filings

NISHITANI; Yoshinori

Patent Applications and Registrations

Patent applications and USPTO patent grants for NISHITANI; Yoshinori.The latest application filed is for "composition for curable resins, cured product of said composition, production method for said composition and said cured product, and semiconductor device".

Company Profile
6.5.15
  • NISHITANI; Yoshinori - Tokyo JP
  • Nishitani; Yoshinori - Tochigi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Composition For Curable Resins, Cured Product Of Said Composition, Production Method For Said Composition And Said Cured Product, And Semiconductor Device
App 20220195188 - NISHITANI; Yoshinori ;   et al.
2022-06-23
Composition For Curable Resin, Cured Product Of Said Composition, Production Method For Said Composition And Said Cured Product, And Semiconductor Device
App 20220106437 - NISHITANI; Yoshinori ;   et al.
2022-04-07
Composition For Curable Resin, Cured Product Of Said Composition, Production Method For Said Composition And Said Cured Product, And Semiconductor Device
App 20210301076 - NISHITANI; Yoshinori ;   et al.
2021-09-30
Composition For Curable Resin, Cured Product Of Said Composition, Production Method For Said Composition And Said Cured Product, And Semiconductor Device
App 20200325270 - NISHITANI; Yoshinori ;   et al.
2020-10-15
Composition For Curable Resin, Cured Product Of Said Composition, Production Method For Said Composition And Said Cured Product, And Semiconductor Device
App 20200308340 - NISHITANI; Yoshinori ;   et al.
2020-10-01
Composition For Curable Resin, Cured Product Of Said Composition, Production Method For Said Composition And Said Cured Product, And Semiconductor Device
App 20200291173 - NISHITANI; Yoshinori ;   et al.
2020-09-17
Curable Resin Composition, Cured Product Obtained From The Same, Method For Hardening The Same, And Semiconductor Device
App 20200095422 - NISHITANI; Yoshinori ;   et al.
2020-03-26
Composition For Curable Resin, Cured Product Of Said Composition, Method Of Producing Said Composition And Said Cured Product, A
App 20200024426 - NISHITANI; Yoshinori ;   et al.
2020-01-23
Epoxy resin composition and semiconductor device
Grant 8,921,461 - Kotani , et al. December 30, 2
2014-12-30
Epoxy resin composition and semiconductor device
Grant 8,697,803 - Kotani , et al. April 15, 2
2014-04-15
Epoxy Resin Composition And Semiconductor Device
App 20130134610 - Kotani; Takahiro ;   et al.
2013-05-30
Epoxy Resin Composition And Semiconductor Device
App 20130119564 - KOTANI; Takahiro ;   et al.
2013-05-16
Epoxy Resin Composition And Semiconductor Device
App 20130113122 - KOTANI; Takahiro ;   et al.
2013-05-09
Epoxy resin composition and semiconductor device
Grant 8,324,326 - Kotani , et al. December 4, 2
2012-12-04
Epoxy resin composition for encapsulating semiconductor and semiconductor device
Grant 8,008,410 - Kotani , et al. August 30, 2
2011-08-30
Epoxy Resin Composition and Semiconductor Device
App 20090096114 - Kotani; Takahiro ;   et al.
2009-04-16
Epoxy resin composition for encapsulating semiconductor and semiconductor device
App 20080128922 - Kotani; Takahiro ;   et al.
2008-06-05
Semiconductor encapsulant of epoxy resin, phenolic resin and triazole compound
Grant 7,354,978 - Nishitani April 8, 2
2008-04-08
Epoxy resin composition and semiconductor device
App 20060157872 - Kotani; Takahiro ;   et al.
2006-07-20
Epoxy resin composition and semiconductor device
App 20050085568 - Nishitani, Yoshinori
2005-04-21

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