NISHINO; Mitsuyoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for NISHINO; Mitsuyoshi.The latest application filed is for "metal-clad laminate, wiring board, metal foil provided with resin, and resin composition".

Company Profile

0.7.9

NISHINO; Mitsuyoshi - Fukushima JP
Nishino; Mitsuyoshi - Koriyama-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Metal-clad Laminate, Wiring Board, Metal Foil Provided With Resin, And Resin Composition App 20210395452 - ARISAWA; Tatsuya ; et al.	2021-12-23
Resin composition for printed wiring board, prepreg, metal-clad laminate, and printed wiring board Grant 9,775,239 - Arisawa , et al. September 26, 2	2017-09-26
Prepreg, laminate, metal foil-clad laminate, circuit board and LED module Grant 9,730,320 - Matsuda , et al. August 8, 2	2017-08-08
Thermosetting resin composition, prepreg, laminate, metal foil-clad laminate, and circuit board Grant 9,718,941 - Matsuda , et al. August 1, 2	2017-08-01
Resin Composition For Printed Wiring Board, Prepreg, Metal-clad Laminate, And Printed Wiring Board App 20170099731 - ARISAWA; TATSUYA ; et al.	2017-04-06
Resin Composition, Prepreg And Laminate Board App 20160369042 - NII; Daisuke ; et al.	2016-12-22
Thermosetting Resin Composition, Prepreg, Laminate, Metal Foil-clad Laminate, And Circuit Board App 20140087614 - Matsuda; Takashi ; et al.	2014-03-27
Prepreg, laminate, metal clad laminate, circuit board, and circuit board for LED mounting Grant 8,603,624 - Matsuda , et al. December 10, 2	2013-12-10
Prepreg, Laminate, Metal Foil-clad Laminate, Circuit Board And Led Module App 20130215628 - Matsuda; Takashi ; et al.	2013-08-22
Prepreg, Laminate, Metal-foil-clad Laminate, Circuit Board, And Circuit Board For Led Mounting App 20120228010 - Matsuda; Takashi ; et al.	2012-09-13
Epoxy Resin Composition, Prepreg, Laminate Board, And Multi-layer Board App 20110250459 - Nishino; Mitsuyoshi ; et al.	2011-10-13
Epoxy Resin Composition, Prepreg, And Laminate And Printed Wiring Board App 20100096173 - Fujino; Kentaro ; et al.	2010-04-22

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