Nishino; Kenichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nishino; Kenichi.The latest application filed is for "commodity sales data processing device".

Company Profile

0.12.6

Nishino; Kenichi - Tokyo JP
Nishino; Kenichi - Kanagawa JP
Nishino; Kenichi - Osaka JP
Nishino, Kenichi - Osaka-shi JP
Nishino; Kenichi - Ibaraki Osaka JP
Nishino; Kenichi - Takatsuki-shi JA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Item registration apparatus and measuring device Grant 9,354,107 - Sato , et al. May 31, 2	2016-05-31
Commodity sales data processing device Grant 9,123,214 - Nishino September 1, 2	2015-09-01
Commodity Sales Data Processing Device App 20150170479 - NISHINO; Kenichi	2015-06-18
Item Registration Apparatus And Measuring Device App 20150083805 - Sato; Naokazu ; et al.	2015-03-26
Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components Grant 7,938,929 - Minamitani , et al. May 10, 2	2011-05-10
Heating And Pressurizing Apparatus For Use In Mounting Electronic Components, And Apparatus And Method For Mounting Electronic Components App 20090120998 - Minamitani; Shozo ; et al.	2009-05-14
Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components Grant 7,490,652 - Minamitani , et al. February 17, 2	2009-02-17
Electronic component, component mounting equipment, and component mounting method Grant 7,220,922 - Nishino , et al. May 22, 2	2007-05-22
Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components App 20060016562 - Minamitani; Shozo ; et al.	2006-01-26
Electronic component component mounting equipment and component mounting method App 20040060666 - Nishino, Kenichi ; et al.	2004-04-01
Bump bonding unit with tray storage and transport apparatuses Grant 6,647,616 - Matsumura , et al. November 18, 2	2003-11-18
Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components App 20030121616 - Minamitani, Shozo ; et al.	2003-07-03
Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components Grant 6,544,377 - Minamitani , et al. April 8, 2	2003-04-08
Component mounting apparatus and method Grant 6,246,789 - Hosotani , et al. June 12, 2	2001-06-12
Curable unsaturated polyester resin composition Grant 5,064,900 - Iwai , et al. November 12, 1	1991-11-12
Thixotropic polyurethane resin compositions Grant 4,640,950 - Nishino , et al. February 3, 1	1987-02-03
Composition for producing polyurethane resin at ambient temperature Grant 4,456,744 - Kamatani , et al. June 26, 1	1984-06-26
Thixotropical Polyurethane Compositions Grant 3,607,822 - Nishino September 21, 1	1971-09-21

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.