NISHIMURA; Tetsuro
Patent Applications and Registrations
Patent applications and USPTO patent grants for NISHIMURA; Tetsuro.The latest application filed is for "solder paste and solder bonded body".
Company Profile
6.27.27
- NISHIMURA; Tetsuro - Osaka JP
- NISHIMURA; Tetsuro - Suita-shi Osaka
- Nishimura; Tetsuro - Suita JP
- NISHIMURA; Tetsuro - Osaka-shi Osaka
- Nishimura; Tetsuro - Machida JP
- Nishimura; Tetsuro - Nishinomiya JP
- Nishimura; Tetsuro - Shizuoka JP
- Nishimura; Tetsuro - Fujinomiya JP
Patent Activity
| Patent | Date |
|---|---|
| Solder Paste And Solder Bonded Body App 20220297243 - NISHIMURA; Tetsuro | 2022-09-22 |
| Solder-metal Mesh Composite Material And Method For Producing Same App 20220281035 - NISHIMURA; Tetsuro ; et al. | 2022-09-08 |
| Preformed Solder And Solder Bonded Body Formed By Using Said Preformed Solder App 20220274212 - NISHIMURA; Tetsuro | 2022-09-01 |
| Lead-free Solder Alloy App 20220105593 - NISHIMURA; Takatoshi ; et al. | 2022-04-07 |
| Lead-free Solder Alloy And Solder Joint Part App 20220016733 - NISHIMURA; Tetsuro | 2022-01-20 |
| Solder Joint Part And Method For Manufacturing The Same App 20220009040 - NOGITA; Kazuhiro ; et al. | 2022-01-13 |
| Lifesaving assisting apparatus Grant 10,966,618 - Natsui , et al. April 6, 2 | 2021-04-06 |
| Soldered Joint App 20200140975 - Nishimura; Tetsuro ; et al. | 2020-05-07 |
| Nanoparticle production method, production device and automatic production device Grant 10,427,220 - Komatsu , et al. October 1, 2 | 2019-10-01 |
| Solder alloy and joint thereof Grant 10,329,642 - Nishimura , et al. | 2019-06-25 |
| Lead-free solder alloy Grant 10,286,497 - Nishimura , et al. | 2019-05-14 |
| Lifesaving Assisting Apparatus App 20180206748 - NATSUI; Tomoyoshi ; et al. | 2018-07-26 |
| Solder alloy Grant 9,999,945 - Nishimura , et al. June 19, 2 | 2018-06-19 |
| Solder wire bobbinless coil Grant 9,999,936 - Nishimura , et al. June 19, 2 | 2018-06-19 |
| Solder Wire Bobbinless Coil App 20160375517 - NISHIMURA; Tetsuro ; et al. | 2016-12-29 |
| Lead-free Solder Alloy App 20160368102 - NISHIMURA; Tetsuro ; et al. | 2016-12-22 |
| Lead-free solder alloy Grant 9,339,893 - Nishimura May 17, 2 | 2016-05-17 |
| Solder Alloy And Joint Thereof App 20160032424 - NISHIMURA; Tetsuro ; et al. | 2016-02-04 |
| Solder joint Grant 8,999,519 - Nishimura April 7, 2 | 2015-04-07 |
| Wire Solder, Method Of Feeding The Same, And Apparatus And System Therefor App 20140224861 - Nishimura; Tetsuro | 2014-08-14 |
| Flux composition and soldering paste composition Grant 8,652,269 - Nishimura , et al. February 18, 2 | 2014-02-18 |
| Lead-free Solder Alloy App 20140037369 - Nishimura; Tetsuro | 2014-02-06 |
| Solder Alloy App 20140030140 - Nishimura; Tetsuro ; et al. | 2014-01-30 |
| Method of regulating nickel concentration in lead-free solder containing nickel Grant 8,557,021 - Nishimura October 15, 2 | 2013-10-15 |
| Wire Solder, Method Of Feeding The Same And Apparatus Therefor App 20120286026 - Nishimura; Tetsuro | 2012-11-15 |
| Wire Solder, Method Of Feeding The Same And Apparatus Therefor App 20120280020 - Nishimura; Tetsuro | 2012-11-08 |
| Method of copper precipitation in lead-free solder, granulation and separation of (CuX).sub.6Sn.sub.5 compounds and recovery of tin Grant 8,163,061 - Nishimura April 24, 2 | 2012-04-24 |
| Apparatus for precipitation/separation of excess copper in lead-free solder Grant 8,147,746 - Nishimura April 3, 2 | 2012-04-03 |
| Wire Solder, Method Of Feeding The Same And Apparatus Therefor App 20110272454 - Nishimura; Tetsuro | 2011-11-10 |
| Flux Composition And Soldering Paste Composition App 20110220247 - Nishimura; Tetsuro ; et al. | 2011-09-15 |
| Replenished lead-free solder and a control method for copper density and nickel density in a solder dipping bath Grant 7,861,909 - Nishimura January 4, 2 | 2011-01-04 |
| Method Of Regulating Nickel Concentration In Lead-free Solder Containing Nickel App 20100307292 - Nishimura; Tetsuro | 2010-12-09 |
| Solder Joint App 20100266870 - Nishimura; Tetsuro | 2010-10-21 |
| Apparatus For Precipitation/separation Of Excess Copper In Lead-free Solder App 20100007068 - Nishimura; Tetsuro | 2010-01-14 |
| SOLDER FREE FROM LEAD FOR ADDITIONAL SUPPLY AND METHOD OF REGULATING Cu CONCENTRATION AND Ni CONCENTRATION IN SOLDER BATH App 20090289102 - Nishimura; Tetsuro | 2009-11-26 |
| METHOD OF COPPER PRECIPITATION IN LEAD-FREE SOLDER, GRANULATION AND SEPARATION OF (CuX)6Sn5 COMPOUNDS AND RECOVERY OF TIN App 20090277302 - Nishimura; Tetsuro | 2009-11-12 |
| Method of copper precipitation in lead-free solder, granulation and separation of (CuX).sub.6Sn.sub.5 compounds and recovery of tin Grant 7,591,873 - Nishimura September 22, 2 | 2009-09-22 |
| Method of Depositing Copper in Lead-Free Solder, Method of Granulating (Cux)6Sn5 Compound and Method of Separating the Same, and Method of Recovering Tin App 20080216605 - Nishimura; Tetsuro | 2008-09-11 |
| Control method for copper density in a solder dipping bath Grant 6,699,306 - Nishimura , et al. March 2, 2 | 2004-03-02 |
| A control method for copper density in a solder dipping bath App 20020134200 - Nishimura, Tetsuro ; et al. | 2002-09-26 |
| Lead-free solder alloy Grant 6,296,722 - Nishimura October 2, 2 | 2001-10-02 |
| In-pipe work apparatus Grant 6,044,769 - Oka , et al. April 4, 2 | 2000-04-04 |
| Soldering flux Grant 5,417,771 - Arita , et al. May 23, 1 | 1995-05-23 |
| Tube assembly with a breakaway plug Grant 4,915,704 - Miyasaka , et al. April 10, 1 | 1990-04-10 |
| Branch tube Grant 4,911,696 - Miyasaka , et al. March 27, 1 | 1990-03-27 |
| Tube assembly provided with a breakaway plug Grant 4,899,903 - Miyasaka , et al. February 13, 1 | 1990-02-13 |
| Medical needle device and medical equipment having the same Grant 4,657,535 - Nishimura , et al. April 14, 1 | 1987-04-14 |
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