Nishimura; Sadahiro
Patent Applications and Registrations
Patent applications and USPTO patent grants for Nishimura; Sadahiro.The latest application filed is for "wiring substrate".
- Nishimura; Sadahiro - Ichinomiya JP
- NISHIMURA; Sadahiro - Ichinomiya-shi JP
- Nishimura; Sadahiro - Kawasaki JP
| Patent | Date |
|---|---|
| Wiring substrate Grant 9,881,861 - Nishimura January 30, 2 | 2018-01-30 |
| Wiring Substrate App 20170186680 - NISHIMURA; Sadahiro | 2017-06-29 |
| Wiring board unit, manufacturing method thereof, and manufacturing method of wiring board with lead Grant 9,349,674 - Matsuhashi , et al. May 24, 2 | 2016-05-24 |
| Joint structure and semiconductor device storage package Grant 9,018,755 - Nishimura , et al. April 28, 2 | 2015-04-28 |
| Wiring Board Unit, Manufacturing Method Thereof, And Manufacturing Method Of Wiring Board With Lead App 20140353024 - MATSUHASHI; Kensuke ; et al. | 2014-12-04 |
| Joint Structure And Semiconductor Device Storage Package App 20140299983 - NISHIMURA; Sadahiro ; et al. | 2014-10-09 |
| Tubular article method for injection molding thereof Grant 5,759,647 - Kuroda , et al. June 2, 1 | 1998-06-02 |
| Thermoplastic resin composition and method for preparing the same Grant 5,218,037 - Orikasa , et al. June 8, 1 | 1993-06-08 |
| Thermoplastic resin composition and method for preparing the same Grant 4,962,148 - Orikasa , et al. October 9, 1 | 1990-10-09 |
| Coating composition for power cable Grant 4,599,391 - Yamamoto , et al. July 8, 1 | 1986-07-08 |
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