Nishikawa; Kimihito

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nishikawa; Kimihito.The latest application filed is for "power module substrate, power module substrate with heat sink, power module, method of producing power module substrate, paste for copper sheet bonding, and method of producing bonded body".

Company Profile

1.5.8

Nishikawa; Kimihito - Sunto-gun JP
Nishikawa; Kimihito - Gotenba JP
Nishikawa; Kimihito - Kitamoto JP
Nishikawa; Kimihito - Gotenba-shi JP
Nishikawa; Kimihito - Gotemba JP
Nishikawa; Kimihito - Kitamoto-shi JP
Nishikawa; Kimihito - Gotemba-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Power Module Substrate, Power Module Substrate With Heat Sink, Power Module, Method Of Producing Power Module Substrate, Paste For Copper Sheet Bonding, And Method Of Producing Bonded Body App 20210068251 - Terasaki; Nobuyuki ; et al.	2021-03-04
Joined body manufacturing method, multilayer joined body manufacturing method, power-module substrate manufacturing method, heat sink equipped power-module substrate manufacturing method, and laminated body manufacturing device Grant 10,607,915 - Oohiraki , et al.	2020-03-31
Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste Grant 10,375,825 - Terasaki , et al.	2019-08-06
Joined Body Manufacturing Method, Multilayer Joined Body Manufacturing Method, Power-module Substrate Manufacturing Method, Heat Sink Equipped Power-module Substrate Manufacturing Method, And Laminated Body Manufacturing Device App 20170141011 - Oohiraki; Tomoya ; et al.	2017-05-18
Manufacturing method of power-module substrate Grant 9,579,739 - Oohiraki , et al. February 28, 2	2017-02-28
Power Module Substrate, Power Module Substrate With Heat Sink, Power Module, Method Of Manufacturing Power Module Substrate, And Copper Member-bonding Paste App 20170034905 - Terasaki; Nobuyuki ; et al.	2017-02-02
Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste Grant 9,504,144 - Terasaki , et al. November 22, 2	2016-11-22
Solder joint structure, power module, power module substrate with heat sink and method of manufacturing the same, and paste for forming solder base layer Grant 9,355,986 - Nishimoto , et al. May 31, 2	2016-05-31
Manufacturing Method Of Power-module Substrate App 20160001388 - Oohiraki; Tomoya ; et al.	2016-01-07
Power Module Substrate, Power Module Substrate With Heat Sink, Power Module, Method Of Producing Power Module Substrate, Paste For Copper Sheet Bonding, And Method Of Producing Bonded Body App 20150313011 - Terasaki; Nobuyuki ; et al.	2015-10-29
Power Module Substrate, Power Module Substrate With Heat Sink, Power Module, Method Of Manufacturing Power Module Substrate, And Copper Member-bonding Paste App 20150208496 - Terasaki; Nobuyuki ; et al.	2015-07-23
Solder Joint Structure, Power Module, Power Module Substrate With Heat Sink And Method Of Manufacturing The Same, And Paste For Forming Solder Base Layer App 20150035137 - Nishimoto; Shuji ; et al.	2015-02-05
Power Module Substrate, Power Module Substrate With Heat Sink, Power Module, Paste For Forming Flux Component Intrusion-preventing Layer And Method For Bonding Bonded Body App 20140318831 - Nishikawa; Kimihito ; et al.	2014-10-30

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