loadpatents
name:-0.030430793762207
name:-0.022027015686035
name:-0.0005030632019043
Nishikawa; Hidenobu Patent Filings

Nishikawa; Hidenobu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nishikawa; Hidenobu.The latest application filed is for "circuit board and process for producing the same".

Company Profile
0.21.22
  • Nishikawa; Hidenobu - Nara N/A JP
  • Nishikawa; Hidenobu - Kadoma JP
  • Nishikawa; Hidenobu - Ikoma JP
  • Nishikawa; Hidenobu - Osaka JP
  • Nishikawa, Hidenobu - Ikoma-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Circuit board and process for producing the same
Grant 8,866,021 - Nishikawa , et al. October 21, 2
2014-10-21
Memory card
Grant 8,599,571 - Nishikawa , et al. December 3, 2
2013-12-03
Circuit Board And Process For Producing The Same
App 20130010436 - NISHIKAWA; Hidenobu ;   et al.
2013-01-10
Circuit board and process for producing the same
Grant 8,291,582 - Nishikawa , et al. October 23, 2
2012-10-23
Memory card and method for manufacturing the same
Grant 8,223,500 - Yamada , et al. July 17, 2
2012-07-17
Memory card
Grant 8,125,786 - Nishikawa , et al. February 28, 2
2012-02-28
Semiconductor chip assembly and fabrication method therefor
Grant 8,035,225 - Nakamura , et al. October 11, 2
2011-10-11
Semiconductor memory module incorporating antenna
Grant 8,031,127 - Ochi , et al. October 4, 2
2011-10-04
Electronic component mounting method and apparatus
Grant 8,007,627 - Nishida , et al. August 30, 2
2011-08-30
Memory card and method for manufacturing memory card
Grant 7,939,923 - Nishikawa , et al. May 10, 2
2011-05-10
Memory card and memory card manufacturing method
Grant 7,933,127 - Nishikawa , et al. April 26, 2
2011-04-26
Electronic circuit device and method for manufacturing same
Grant 7,910,406 - Kumazawa , et al. March 22, 2
2011-03-22
Card type information device and method for manufacturing same
Grant 7,775,446 - Ochi , et al. August 17, 2
2010-08-17
Memory Card And Method For Manufacturing Memory Card
App 20100193927 - Nishikawa; Hidenobu ;   et al.
2010-08-05
Memory Card And Method For Manufacturing The Same
App 20100165587 - Yamada; Yuichiro ;   et al.
2010-07-01
Memory Card And Memory Card Manufacturing Method
App 20100157550 - Nishikawa; Hidenobu ;   et al.
2010-06-24
Memory Card
App 20100084762 - Nishikawa; Hidenobu ;   et al.
2010-04-08
Electronic component unit
Grant 7,683,482 - Nishida , et al. March 23, 2
2010-03-23
Electronic Circuit Device And Method For Manufacturing Same
App 20090267214 - Kumazawa; Kentaro ;   et al.
2009-10-29
Card Type Information Device And Method For Manufacturing Same
App 20090173795 - Ochi; Shozo ;   et al.
2009-07-09
Circuit Board And Process For Producing The Same
App 20090166064 - Nishikawa; Hidenobu ;   et al.
2009-07-02
Electronic Circuit Module With Built-in Antenna And Method For Manufacturing The Same
App 20090051606 - Ochi; Shozo ;   et al.
2009-02-26
Semiconductor Memory Module Incorporating Antenna
App 20090040734 - Ochi; Shozo ;   et al.
2009-02-12
Memory Card
App 20090009976 - Nishikawa; Hidenobu ;   et al.
2009-01-08
Semiconductor memory module having built-in antenna
Grant 7,471,260 - Ochi , et al. December 30, 2
2008-12-30
Semiconductor Chip Assembly And Fabrication Method Therefor
App 20080150133 - Nakamura; Kojiro ;   et al.
2008-06-26
Semiconductor Memory Module Having Built-In Antenna
App 20080111756 - Ochi; Shozo ;   et al.
2008-05-15
Electronic parts packaging method and electronic parts package
Grant 7,355,126 - Nishikawa , et al. April 8, 2
2008-04-08
Electronic component mounting method and apparatus
App 20070013067 - Nishida; Kazuto ;   et al.
2007-01-18
Pressurizing method
Grant 7,076,867 - Yamamoto , et al. July 18, 2
2006-07-18
Method for mounting a semiconductor element to an interposer by compression bonding
Grant 7,060,528 - Nishikawa , et al. June 13, 2
2006-06-13
Electronic component mounting method and apparatus
App 20050224974 - Nishida, Kazuto ;   et al.
2005-10-13
Electronic parts mounting method and device therefor
Grant 6,926,796 - Nishida , et al. August 9, 2
2005-08-09
Electronic component mounting method and apparatus
App 20050155706 - Nishida, Kazuto ;   et al.
2005-07-21
Image pickup device integrated with lens, method and apparatus for manufacturing the same
App 20050036057 - Ushirokawa, Kazuya ;   et al.
2005-02-17
Apparatus and method for applying fluid
Grant 6,770,320 - Yamauchi , et al. August 3, 2
2004-08-03
Semiconductor element mounting method
App 20030166313 - Nishikawa, Hidenobu ;   et al.
2003-09-04
Pressurizing method and pressurizing apparatus
App 20030145459 - Yamamoto, Akihiro ;   et al.
2003-08-07
Electronic parts packaging method and electronic parts package
App 20030092326 - Nishikawa, Hidenobu ;   et al.
2003-05-15
Apparatus and method for applying fluid
App 20030084844 - Yamauchi, Hiroshi ;   et al.
2003-05-08
Bonding head and component mounting apparatus
App 20020092887 - Hosotani, Naoto ;   et al.
2002-07-18

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