NISHII; Toshihiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for NISHII; Toshihiro.The latest application filed is for "liquid stabilizer for chlorine-containing resin, and method for manufacturing same".

Company Profile

1.28.38

NISHII; Toshihiro - Osaka JP
Nishii; Toshihiro - Hirakata-shi JP
Nishii; Toshihiro - Hirakata JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Liquid Stabilizer For Chlorine-containing Resin, And Method For Manufacturing Same App 20210371621 - NISHII; Toshihiro ; et al.	2021-12-02
Chlorine-containing resin composition Grant 10,947,377 - Tsuda , et al. March 16, 2	2021-03-16
Chlorine-containing Resin Composition App 20200325322 - TSUDA; Koichi ; et al.	2020-10-15
Method of manufacturing circuit forming board Grant 8,069,557 - Nishii , et al. December 6, 2	2011-12-06
Method of manufacturing clad board for forming circuitry, clad board and core board for clad board Grant 7,754,321 - Yamane , et al. July 13, 2	2010-07-13
Method for manufacturing circuit forming substrate Grant 7,685,707 - Nishii March 30, 2	2010-03-30
Method for producing circuit-forming board and material for producing circuit-forming board Grant 7,624,502 - Nishii December 1, 2	2009-12-01
Method of manufacturing circuit-forming board and material of circuit-forming board Grant 7,572,500 - Nishii August 11, 2	2009-08-11
Method For Manufacturing Circuit Forming Substrate App 20090183366 - Nishii; Toshihiro	2009-07-23
Circuit-formed substrate and method of manufacturing circuit-formed substrate Grant 7,356,916 - Nishii , et al. April 15, 2	2008-04-15
Laminated Circuit Board And Its Manufacturing Method, And Manufacturing Method For Module Using The Laminated Circuit Board And Its Manufacturing Apparatus App 20080073024 - Kimura; Junichi ; et al.	2008-03-27
Method of manufacturing printed wiring boards Grant 7,325,300 - Tatsumi , et al. February 5, 2	2008-02-05
Method of manufacturing circuit-forming board and material of circuit-forming board App 20080017403 - Nishii; Toshihiro	2008-01-24
Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus Grant 7,317,621 - Kimura , et al. January 8, 2	2008-01-08
Method of manufacturing circuit forming board to improve adhesion of a circuit to the circuit forming board Grant 7,251,885 - Nishii August 7, 2	2007-08-07
Method of manufacturing a circuit board and its manufacturing apparatus Grant 7,143,772 - Kishimoto , et al. December 5, 2	2006-12-05
Method for producing circuit-forming board and material for producing circuit-forming board App 20060242827 - Nishii; Toshihiro	2006-11-02
Circuit board and production method therefor App 20060210780 - Nishii; Toshihiro	2006-09-21
Printing plate, circuit board and method of printing circuit board Grant 7,105,277 - Takenaka , et al. September 12, 2	2006-09-12
Circuit board production method and circuit board production data Grant 7,097,394 - Nishii , et al. August 29, 2	2006-08-29
Method and material for manufacturing circuit-formed substrate Grant 7,059,044 - Nishii June 13, 2	2006-06-13
Circuit board producing method and circuit board producing device Grant 7,018,672 - Takenaka , et al. March 28, 2	2006-03-28
Method for manufacturing a circuit board Grant 6,996,902 - Suzuki , et al. February 14, 2	2006-02-14
Circuit board and method of manufacturing same Grant 6,993,836 - Takenaka , et al. February 7, 2	2006-02-07
Method of manufacturing clad board for forming circuitry, clad board and core board for clad board App 20050249933 - Yamane, Shigeru ; et al.	2005-11-10
Manufacturing method of laminated substrate, and manufacturing apparatus of semiconductor device for module and laminated substrate for use therein App 20050233122 - Nishimura, Mikio ; et al.	2005-10-20
Circuit formation substrate manufacturing method and circuit formation substrate material App 20050198818 - Nishii, Toshihiro ; et al.	2005-09-15
Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus App 20050117312 - Kimura, Junichi ; et al.	2005-06-02
Method and system of drying materials and method of manufacturing circuit boards using the same Grant 6,893,530 - Kishimoto , et al. May 17, 2	2005-05-17
Method for manufacturing printed-circuit board Grant 6,890,449 - Kawamoto , et al. May 10, 2	2005-05-10
Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate material Grant 6,838,164 - Yamane , et al. January 4, 2	2005-01-04
Method of manufacturing clad board for forming circuitry, clad board, and core board for clad board Grant 6,833,042 - Yamane , et al. December 21, 2	2004-12-21
Printing plate, circuit board and method of printing circuit board App 20040248041 - Takenaka, Toshiaki ; et al.	2004-12-09
Method of manufacturing a circuit board and its manufacturing apparatus Grant 6,820,331 - Kishimoto , et al. November 23, 2	2004-11-23
Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate material Grant 6,814,836 - Yamane , et al. November 9, 2	2004-11-09
Circuit forming board and method of manufacturing circuit forming board App 20040163247 - Nishii, Toshihiro	2004-08-26
Method of manufacturing a circuit board and its manufacturing apparatus App 20040126516 - Kishimoto, Kunio ; et al.	2004-07-01
Method of manufacturing circuit formed substrate App 20040075988 - Tatsumi, Kiyohide ; et al.	2004-04-22
Method and meterial for manufacturing circuit-formed substrate App 20040067348 - Nishii, Toshihiro	2004-04-08
Circuit-formed subtrate and method of manufacturing circuit-formed substrate App 20040058136 - Nishii, Toshihiro ; et al.	2004-03-25
Method of manufacturing circuit forming board to improve adhesion of a circuit to the circuit forming board Grant 6,698,093 - Nishii March 2, 2	2004-03-02
Multi-layer circuit board having at least two or more circuit patterns connected Grant 6,700,071 - Takenaka , et al. March 2, 2	2004-03-02
Circuit board and method of manufacturing same App 20040035604 - Takenaka, Toshiaki ; et al.	2004-02-26
Circuit board and method for manufacturing the same Grant 6,686,029 - Suzuki , et al. February 3, 2	2004-02-03
Printed wiring board, and method and apparatus for manufacturing the same Grant 6,671,951 - Nishii , et al. January 6, 2	2004-01-06
Circuit board and method for manufacturing the same App 20030170434 - Suzuki, Takeshi ; et al.	2003-09-11
Circuit board and method for manufacturing the same App 20030157307 - Suzuki, Takeshi ; et al.	2003-08-21
Circuit board producing method and circuit board producing device App 20030138553 - Takenaka, Toshiaki ; et al.	2003-07-24
Circuit board and production method therefor App 20030113522 - Nishii, Toshihiro	2003-06-19
Circuit forming board producing method, circuit forming board, and material for circuit forming board App 20030091787 - Yamane, Shigeru ; et al.	2003-05-15
Method for manufacturing circuit board App 20030047269 - Tatsumi, Kiyohide ; et al.	2003-03-13
Circuit board production method and circuit board production data App 20030044248 - Nishii, Toshihiro ; et al.	2003-03-06
Printed wiring board, and method and apparatus for manufacturing the same Grant 6,518,515 - Nishii , et al. February 11, 2	2003-02-11
Circuit board and method of manufacturing same App 20020189856 - Takenaka, Toshiaki ; et al.	2002-12-19
Method for manufacturing printed-circuit board App 20020170876 - Kawamoto, Eiji ; et al.	2002-11-21
Method and system of drying materials and method of manufacturing circuit boards using the same App 20020173109 - Kishimoto, Kunio ; et al.	2002-11-21
Circuit forming board and method of manufacturing circuit forming board App 20020157862 - Nishii, Toshihiro	2002-10-31
Circuit board and method for manufacturing the same App 20020127379 - Suzuki, Takeshi ; et al.	2002-09-12
Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate material App 20020112822 - Yamane, Shigeru ; et al.	2002-08-22
Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate material App 20020112815 - Yamane, Shigeru ; et al.	2002-08-22
Method And Apparatus For Fabricating Circuit-forming-substrate And Circuit-forming-substrate Material App 20020040758 - YAMANE, SHIGERU ; et al.	2002-04-11
Printed wiring board, and method and apparatus for manufactujring the same App 20020020556 - Nishii, Toshihiro ; et al.	2002-02-21
Multi-layer circuit board and method of manufacturing same App 20020020548 - Takenaka, Toshiaki ; et al.	2002-02-21
Printed wiring board, and method and apparatus for manufacturing the same App 20020020557 - Nishii, Toshihiro ; et al.	2002-02-21
Printed Wiring Board App 20010032700 - NISHII, TOSHIHIRO ; et al.	2001-10-25
Method of manufacturing a circuit board and its manufacturing apparatus App 20010004803 - Kishimoto, Kunio ; et al.	2001-06-28

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