Nishihata; Hideki
Patent Applications and Registrations
Patent applications and USPTO patent grants for Nishihata; Hideki.The latest application filed is for "method of controlling film thinning of semiconductor wafer for solid-state image sensing device".
- Nishihata; Hideki - Tokyo JP
- Nishihata; Hideki - Minato-ku JP
- NISHIHATA; Hideki - Yamagata JP
| Patent | Date |
|---|---|
| Method for producing semiconductor substrate Grant 8,183,133 - Murakami , et al. May 22, 2 | 2012-05-22 |
| Method for producing a bonded wafer Grant 8,003,494 - Nishihata , et al. August 23, 2 | 2011-08-23 |
| Method of controlling film thinning of semiconductor wafer for solid-state image sensing device Grant 7,960,225 - Morita , et al. June 14, 2 | 2011-06-14 |
| Method Of Controlling Film Thinning Of Semiconductor Wafer For Solid-state Image Sensing Device App 20110136267 - MORITA; Etsurou ; et al. | 2011-06-09 |
| Method of producing semiconductor substrate having an SOI structure Grant 7,951,692 - Murakami , et al. May 31, 2 | 2011-05-31 |
| Method for producing bonded silicon wafer Grant 7,927,957 - Kusaba , et al. April 19, 2 | 2011-04-19 |
| Epitaxial Wafer And Method Of Producing The Same App 20110084367 - NISHIHATA; Hideki ; et al. | 2011-04-14 |
| Method For Producing Semiconductor Substrate App 20110027969 - MURAKAMI; Satoshi ; et al. | 2011-02-03 |
| Laminated substrate manufacturing method and laminated substrate manufactured by the method Grant 7,858,494 - Endo , et al. December 28, 2 | 2010-12-28 |
| Method for producing semiconductor substrate Grant 7,851,337 - Murakami , et al. December 14, 2 | 2010-12-14 |
| Method For Producing A Bonded Wafer App 20100248447 - Nishihata; Hideki ; et al. | 2010-09-30 |
| Method of producing semiconductor substrate having an SOI structure Grant 7,795,117 - Murakami , et al. September 14, 2 | 2010-09-14 |
| Method For Producing Bonded Wafer App 20100178750 - Murakami; Satoshi ; et al. | 2010-07-15 |
| Method for producing bonded wafer Grant 7,713,842 - Nishihata , et al. May 11, 2 | 2010-05-11 |
| Method For Producing Bonded Silicon Wafer App 20100068867 - Kusaba; Tatsumi ; et al. | 2010-03-18 |
| Method for manufacturing bonded wafer Grant 7,625,808 - Endo , et al. December 1, 2 | 2009-12-01 |
| Method for producing bonded wafer App 20090186464 - Morimoto; Nobuyuki ; et al. | 2009-07-23 |
| Method for producing SOI wafer Grant 7,563,697 - Morimoto , et al. July 21, 2 | 2009-07-21 |
| Process for cleaning silicon substrate Grant 7,534,728 - Nishihata , et al. May 19, 2 | 2009-05-19 |
| Method For Manufacturing Soi Substrate App 20090117708 - Nishihata; Hideki ; et al. | 2009-05-07 |
| Method for producing bonded wafer App 20090098707 - Nishihata; Hideki ; et al. | 2009-04-16 |
| Method for producing SOI wafer Grant 7,510,948 - Morimoto , et al. March 31, 2 | 2009-03-31 |
| Method of producing bonded wafer Grant 7,507,641 - Morimoto , et al. March 24, 2 | 2009-03-24 |
| Method Of Producing Semiconductor Substrate App 20090075453 - MURAKAMI; Satoshi ; et al. | 2009-03-19 |
| Apparatus for manufacturing semiconductor substrates Grant 7,485,874 - Nakamura , et al. February 3, 2 | 2009-02-03 |
| Method for producing soi wafer App 20090023269 - Morimoto; Nobuyuki ; et al. | 2009-01-22 |
| Method Of Producing Bonded Wafer App 20090023272 - NISHIHATA; Hideki ; et al. | 2009-01-22 |
| Method for Manufacturing Bonded Wafer App 20080200010 - Endo; Akihiko ; et al. | 2008-08-21 |
| Method for manufacturing SIMOX wafer and SIMOX wafer Grant 7,410,877 - Aoki , et al. August 12, 2 | 2008-08-12 |
| Method of producing bonded wafer App 20080124897 - Morimoto; Nobuyuki ; et al. | 2008-05-29 |
| Process for producing SOI wafer Grant 7,358,147 - Morimoto , et al. April 15, 2 | 2008-04-15 |
| Bonded wafer and method of manufacturing the same App 20080061452 - NISHIHATA; Hideki ; et al. | 2008-03-13 |
| Method of producing bonded wafer App 20070298589 - Nishihata; Hideki ; et al. | 2007-12-27 |
| Method of producing semiconductor substrate App 20070275566 - Murakami; Satoshi ; et al. | 2007-11-29 |
| Method for producing semiconductor substrate App 20070264797 - Murakami; Satoshi ; et al. | 2007-11-15 |
| Process for producing soi wafer App 20070190737 - Morimoto; Nobuyuki ; et al. | 2007-08-16 |
| Apparatus for manufacturing semiconductor substrates App 20070114458 - Nakamura; Seiichi ; et al. | 2007-05-24 |
| Bonded wafer and its manufacturing method App 20070069335 - Endo; Akihiko ; et al. | 2007-03-29 |
| Laminated Substrate Manufacturing Method and Laminated Substrate Manufactured by the Method App 20070048971 - Endo; Akihiko ; et al. | 2007-03-01 |
| Method for manufacturing SIMOX wafer and SIMOX wafer App 20070020949 - Aoki; Yoshiro ; et al. | 2007-01-25 |
| Method for producing soi wafer App 20060266437 - Morimoto; Nobuyuki ; et al. | 2006-11-30 |
| Process for cleaning silicon substrate App 20060234461 - Nishihata; Hideki ; et al. | 2006-10-19 |
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