Nishihara; Kunio
Patent Applications and Registrations
Patent applications and USPTO patent grants for Nishihara; Kunio.The latest application filed is for "solid printed substrate and electronic circuit package using the same".
- Nishihara; Kunio - Kanagawa JP
- Nishihara; Kunio - Yokohama JP
| Patent | Date |
|---|---|
| Solid printed substrate and electronic circuit package using the same Grant 5,639,990 - Nishihara , et al. June 17, 1 | 1997-06-17 |
| Flexible printed circuit board having a metal substrate Grant 5,266,746 - Nishihara , et al. November 30, 1 | 1993-11-30 |
| Multi-layered electrostrictive effect element Grant 5,173,162 - Hagimura , et al. December 22, 1 | 1992-12-22 |
| Flexible laminate printed-circuit board and methods of making same Grant 4,839,232 - Morita , et al. June 13, 1 | 1989-06-13 |
| Optical recording method and media therefor Grant 4,707,425 - Sasagawa , et al. November 17, 1 | 1987-11-17 |
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