| Patent | Date |
|---|
Semiconductor device with light reflecting substrate area
Grant 5,536,974 - Nishiguchi July 16, 1 | 1996-07-16 |
Semiconductor chip module having an electrically insulative thermally conductive thermal dissipator directly in contact with the semiconductor element
Grant 5,525,835 - Nishiguchi June 11, 1 | 1996-06-11 |
Semiconductor device with bumps
Grant 5,461,261 - Nishiguchi October 24, 1 | 1995-10-24 |
Burn-in apparatus and method which individually controls the temperature of a plurality of semiconductor devices
Grant 5,414,370 - Hashinaga , et al. May 9, 1 | 1995-05-09 |
Burn-in apparatus and method for self-heating semiconductor devices having built-in temperature sensors
Grant 5,406,212 - Hashinaga , et al. April 11, 1 | 1995-04-11 |
Heat sink method of manufacturing the same and device of manufacturing the same
Grant 5,403,400 - Nishiguchi April 4, 1 | 1995-04-04 |
Method of measuring junction temperature
Grant 5,401,099 - Nishizawa , et al. March 28, 1 | 1995-03-28 |
Semiconductor chip module
Grant 5,387,815 - Nishiguchi February 7, 1 | 1995-02-07 |
Method and apparatus for varying temperature and electronic load conditions of a semiconductor device in a burn-in test chamber while performing a burn-in test
Grant 5,359,285 - Hashinaga , et al. October 25, 1 | 1994-10-25 |
Method of mounting semiconductor elements
Grant 5,348,214 - Nishiguchi , et al. * September 20, 1 | 1994-09-20 |
Heat sink, method of manufacturing the same, and device of manufacturing the same
Grant 5,339,215 - Nishiguchi August 16, 1 | 1994-08-16 |
Burn-in apparatus and method for semiconductor devices
Grant 5,327,075 - Hashinaga , et al. July 5, 1 | 1994-07-05 |
Semiconductor chip mounting method and apparatus
Grant 5,324,381 - Nishiguchi June 28, 1 | 1994-06-28 |
Substrate for packaging a semiconductor device
Grant 5,298,460 - Nishiguchi , et al. March 29, 1 | 1994-03-29 |
Method for packaging a semiconductor device
Grant 5,262,355 - Nishiguchi , et al. November 16, 1 | 1993-11-16 |
Apparatus for packaging a semiconductor device
Grant 5,212,880 - Nishiguchi , et al. May 25, 1 | 1993-05-25 |
Substrate for packaging a semiconductor device
Grant 5,214,308 - Nishiguchi , et al. May 25, 1 | 1993-05-25 |
Substrate for packaging a semiconductor device having particular terminal and bump structure
Grant 5,196,726 - Nishiguchi , et al. March 23, 1 | 1993-03-23 |
Semiconductor device and production method thereof
Grant 5,188,984 - Nishiguchi February 23, 1 | 1993-02-23 |
Semiconductor element manufacturing process using sequential grinding and chemical etching steps
Grant 5,122,481 - Nishiguchi June 16, 1 | 1992-06-16 |
Apparatus for grinding semiconductor wafer
Grant 5,113,622 - Nishiguchi , et al. May 19, 1 | 1992-05-19 |
Method for packaging semiconductor device
Grant 5,092,033 - Nishiguchi , et al. March 3, 1 | 1992-03-03 |
Method of adhesively and hermetically sealing a semiconductor package lid by scrubbing
Grant 5,064,782 - Nishiguchi November 12, 1 | 1991-11-12 |
Method of forming a mask pattern for the production of transistor
Grant 4,981,809 - Mitsuaki , et al. January 1, 1 | 1991-01-01 |
Superconducting coil and a method for producing the same
Grant 4,965,247 - Nishiguchi October 23, 1 | 1990-10-23 |
Wiring structure of semiconductor pressure sensor
Grant 4,908,693 - Nishiguchi March 13, 1 | 1990-03-13 |
Suction device
Grant 4,904,012 - Nishiguchi , et al. February 27, 1 | 1990-02-27 |
Chip mounting apparatus
Grant 4,868,974 - Nishiguchi September 26, 1 | 1989-09-26 |
Chip mounting apparatus
Grant 4,859,269 - Nishiguchi August 22, 1 | 1989-08-22 |
Method of testing semiconductor pressure sensor
Grant 4,825,684 - Nishiguchi , et al. May 2, 1 | 1989-05-02 |
Catheter type sensor
Grant 4,809,704 - Sogawa , et al. March 7, 1 | 1989-03-07 |
Method of adjusting bridge circuit of semiconductor pressure sensor
Grant 4,809,536 - Nishiguchi March 7, 1 | 1989-03-07 |
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